The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting the paper, “Alpha Power Electronics Solutions” at the 3rd China Powertrain Electrification and Innovation Summit 2020 – New Energy Vehicle 2.0 Era from October 22-23, 2020 in Shanghai, China.
The summit will gather more than100 EV experts and senior executives from global OEMs, Tier 1&2 component suppliers, software solutions suppliers and automotive battery manufacturers. The topics featured duringthe summit willinclude EV powertrain system design, powertrain control systems, solid battery technology and many advanced emerging powertrain technologies.
“The ability of the die and substrate attach materials to dissipate the heat directly affects the performance and lifetime of power semiconductors and the electric vehicle. The good news is that silver sintering technology is rapidly evolving to overcome the thermal and reliability challenges associated with these layers,” said Gyan Dutt, Global Portfolio Manager for Power Electronics, Assembly Solutions at MacDermid Alpha. “Power electronics of the most advanced electric vehicles in the market are now using silver sintering technology for increased efficiency (lower power loss by thermal dissipation), improved peak performance (managing transients at high torque situations) and improving reliability (10-15X fold improvement in power cycling) for longer lifetime.“
Wilson Wu, Application Manager – Die Attach, will be presenting the paper at 16:10pm on Thursday, October 22nd at The Longemont Shanghai.For more information on Alpha’s Power Electronics packaging and assembly solutions, visit MacDermidAlpha.com or contact Wilson.Wu@MacDermidAlpha.com
The 3rd China Powertrain Electrification & Innovation Summit
Date: Oct 22, 2020 (Thursday)
Time: 16:10 – 16:45
Venue:Ballroom B, 6/F, The Longemont Shanghai, 1116 West Yan An Road,Changning District, Shanghai,P.R. China
Topic:Alpha Power Electronics Solutions
Speaker: Wilson Wu,Application Manager - Die Attach
Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, Kester and MacDermid Enthone brands, we provide solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find out more at MacDermidAlpha.com.