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Seika Machinery to highlight stencil cleaner, twin table router and PCB measurement software during APEX Virtual EXPO

Feb 12, 2021

Seika Machinery, Inc. is pleased to announce its participation in the 2021 IPC APEX Virtual EXPO, scheduled to take place March 9-11, 2021 online at www.ipcapexexpo.org. Seika will highlight the Sawa SC-BM500E Automatic Ultrasonic Metal Stencil Cleaner, Sayaka SAM-CT34NJW Twin Table PCB Router with online camera for programming, Tsuchiyama n=1 Checker FAI and Kyowa PCAS Software Series for PCB Measurement.

The Sawa SC-BM500E offers precise cleaning with an ultrasonic Cleaning head designed for a variety of applications, including wafer bump and electroform stencils.

It accommodates a wide range of stencils from 320mm×320mm to 1000×740mm, and is ideal for customers using multiple types of stencils. The SC-BM500E is available in three models to accommodate specific customer needs and can clean mesh screens as well remove ink, adhesives and solder paste. Additionally, the system can clean misprinted PCBs.

The Sayaka Twin Table Router features advanced image-processing software with point-and-click operation for programming router paths. The CCD camera captures an image of the PCB, while programming cutting paths is achieved by simple point-and-click operation on screen. An ideal solution for stress-free depanelization, the high-speed router bit cleanly and precisely cuts densely populated PCBs without stressing the PCB.

The Malcom SWB-2 Wetting Balance Tester takes the "Dip & Look" method to the next level by actually measuring the wetting forces during the soldering process. The tester has been designed to evaluate the effectiveness of different solder and flux combinations on a standardized test coupon, or your own test pieces.

The n=1 revolutionary automatic first-article inspection tool checks component presence and orientation and verifies LCR values (induction, capacitance, resistance) 10x faster. Additionally, it speeds up visual inspection with camera magnification.

The PCAS Series enables users to evaluate printed circuit assemblies (PCAs) easily with intuitive operation. Perform real-time recording, analyze data and create reports in accordance with IPC/JEDEC-9704A with the easy-to-use measurement software.

Additional highlights include McDry Storage Cabinets, Eightech Vacuum Reflow Oven, CT56NJ Large Platform PCB Router, Malcom Viscometers, Solder Paste Mixers and RCX Modular Reflow Profiling System, Unitech PCB cleaner and Hioki ICT.

For more information, contact Michelle Ogihara at 310-540-7310; e-mail michelle@seikausa.com; or visit www.seikausa.com.


Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.

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