SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Newly Appointed IPC APEX EXPO Technical Program Committee Calls for IPC APEX EXPO 2022 Participation

Newly Appointed IPC APEX EXPO Technical Program Committee Calls for IPC APEX EXPO 2022 Participation

May 21, 2021

The newly appointed IPC APEX EXPO Technical Program Committee (TPC) is inviting engineers, researchers, academics, technical experts, and industry leaders to submit technical conference abstracts for IPC APEX EXPO 2022 to be held at the San Diego Convention Center. The technical conference will take place January 25–27, 2022.

“The TPC – comprised of top technical leadership and subject matter experts from across the electronics industry – continues to build and strengthen the IPC APEX EXPO technical conference. A new committee chair and co-chair, expanded committee size, and a new structure enables the group to be future focused and provide a stronger technical voice spanning various technologies and the supply chain,” said Matt Kelly, IPC chief technologist. “The TPC’s mission is to deliver strong, relevant, and valuable technical programming that balances conventional technology advances with next-generation disruptive technologies. With these upgrades to the TPC, I’m excited to see what the IPC APEX EXPO 2022 technical conference has in store.”

Led by Beverley Christian, Ph.D., HDP User Group (Chair) and Stanton Rak, Ph.D., SF Rak Co. (Co-Chair) the 24-person committee comprises the following members: Bhanu Sood, Ph.D., NASA Goddard Space Flight Center; Cheryl Tulkoff, NI; Chris Jorgensen, IPC; Hans-Peter Tranitz, Ph.D., Continental Automotive GmbH; Jason Keeping, Celestica Inc.; Jerry Magera, Motorola Solutions; Martin Goetz, Northrop Grumman Corporation; Matt Kelly, IPC; Michael Ford, Aegis Industrial Software; Michael Carano, RBP Chemical Technology, Inc.; Milos Lazic, Indium Corporation; Paige Fiet, Michigan Technological University; Paul Cooke, Asahi Glass Co. Ltd.; Radu Diaconescu, Swissmic SA; Raymond Whittier Jr., BAE Systems; Robert Kinyanjui, Ph.D., John Deere Electronic Solutions; Sarah Czaplewski, IBM; Steven Bowles, Lockheed Martin Corporation; Tim Burke, Ph.D., Arch Systems Inc.; Todd MacFadden, Bose Corporation; Toya Richardson, IPC; and Udo Welzel, Robert Bosch GmbH.

Technical conference paper abstracts are due June 18, 2021. An approximate 300-word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments and case studies, emphasize new techniques, discuss trends of interest and contain appropriate technical test results. To submit an abstract, visit www.IPCAPEXEXPO.org/CFP.


IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its nearly 3,000 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly, and testing. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry.

Oct 06, 2022 -

Dr. Hans-Peter Tranitz Appointed Senior Director, Solutions at IPC Electronics Europe GmbH

Oct 04, 2022 -

Industry Well Represented on New U.S. Government Advisory Committee on Microelectronics

Sep 30, 2022 -

Likelihood of a Recession in 2023 in the United States and Europe Continues to Increase

Sep 30, 2022 -

Engineer Turned Accomplished Author and Emmy-nominated Science TV Host Emily Calandrelli to Keynote IPC APEX EXPO 2023

Sep 26, 2022 -

North American PCB Industry Sales Up 15.1 Percent in August

Sep 26, 2022 -

Electronics Industry Calls for U.S. Presidential Determination On Key Components Under Defense Production Act

Sep 26, 2022 -

Taiwan Union Technology Corporation (TUC) First Company Globally to Re-Qualify Products to IPC-4101 Qualified Products Listing

Sep 21, 2022 -

Winners of IPC Hand Soldering and Rework Competition at NEPCON Vietnam 2022 Announced

Sep 21, 2022 -

Fralock Earns IPC-1791 Qualified Manufacturers Listing (QML) as Trusted Electronics Designer

Sep 14, 2022 -

PCB Designers to Vie for Design Champion Title at IPC APEX EXPO 2023

1320 more news from Association Connecting Electronics Industries (IPC) »

Oct 07, 2022 -

Inline PCBA Brush Cleaning Machine HJS-7000, Single side PCBA Brush Cleaning Machine

Oct 06, 2022 -

MacDermid Alpha to Present Automotive Traction Module Attach by Silver Sintering at IEMT Conference 2022

Oct 06, 2022 -

PRIDE Industries Observes National Disability Employment Awareness Month

Oct 06, 2022 -

Women's Leadership Program Presentation to Discuss Growth, Leadership and Self-Actualization during SMTA International 2022

Oct 06, 2022 -

KYZEN to Deliver a Range of Cleaning Solutions at SMTA Long Island

Oct 06, 2022 -

The TPCA - Taiwan Printed Circuit Association Show Taipei - 26.10.2022 - 28.10.2022 – Booth L-629

Oct 06, 2022 -

Cybord Release 'Traceability as a Productivity Tool' White Paper

Oct 06, 2022 -

VAS Engineering Selects New Nordson Assure FLEX E Component Counter

Oct 06, 2022 -

PVA Valve Tool Changer Nominated for New Product of the Year

Oct 06, 2022 -

Wireless Strain & Stress Measurement with the Kyowa MRS-100 Series

See electronics manufacturing industry news »

Newly Appointed IPC APEX EXPO Technical Program Committee Calls for IPC APEX EXPO 2022 Participation news release has been viewed 290 times

  • SMTnet
  • »
  • Industry News
  • »
  • Newly Appointed IPC APEX EXPO Technical Program Committee Calls for IPC APEX EXPO 2022 Participation
Global manufacturing solutions provider

ITAR and Biomedical Electronic Manufacturing Facility Late-Model SMT Equipment: DEK, MyData, Heller & Nordson (25+) MyData/Agilis Magazines & (250+) Feeders Wave Soldering, Inspection, X-Ray, AOI & More