Jan 30, 2003
The selection of Prague as the conference location demonstrates the support that EIPC offers to the Eastern European Printed Circuit and Packaging Industry. This first-class event is directed at PCB industry managers, design and technology engineers, decision makers and industry leaders throughout Europe. Eastern European countries, many of whom are poised to become EU members, will have the full focus of attention. By offering a unique business and technology platform, EIPC serves both current members and potential Eastern European members alike.
The Spring Conference will provide a peerless opportunity for speakers and delegates to exchange information on the current market conditions, learn about innovations on interconnection and packaging, as well as about assembly of electronic and opto-electronic circuits. A high-calibre conference programme is expected to draw in more than 200 delegates from all over Europe, who will also be able to enjoy the Conference Dinner, an opportunity for some invaluable networking.
EIPC is being strongly supported by its sister associations around the world, who will be promoting the event, as will members of the industry press world-wide, and information is also being sent out by direct mail and newsletters.
Don't be vague, come to Prague!
For further information, please contact:
Kirsten Smit-Westenberg, Event Manager,
EIPC, Maastricht, The Netherlands
Tel: +31-43-3440872,
email: kwestenberg@eipc.org
