Introducing "Essemtec TechTalk: Engineering SMT Solutions"

We’re excited to introduce "Essemtec TechTalk: Engineering SMT Solutions" a new video series where we explore the advanced solutions we’re developing to meet the demands of today’s SMT processes. Whether you’re an engineer, a technician, or someone interested in SMT advancements, this series provides valuable insights into how Essemtec is engineering solutions to optimize your production.

In the first episode, we’ll discuss the development of our latest dispensing solution, Jet-on-the-fly for Solder Paste Jetting. While the technology of Solder Paste Jet Printing was introduced a few years ago, our contribution focuses on enhanced speed and new capabilities - such as dispensing in cavities and at varying Z-levels. Additionally, we offer precise volume control with fully customizable parameters, ensuring that this solution meets the high standards of today’s SMT processes.

Jet-on-the-Fly for High-Speed Solder Paste Jetting by Irving Rodriguez: 

https://youtu.be/fvPNS_WvfDI?si=kptIbOWCjuo7WUOq

Join us in this exciting journey, where we’ll explore how innovation and engineering come together to engineer SMT solutions.