May 06, 2025 
PEMTRON today announced plans to exhibit at the JPCA Show 2025, taking place June 4–6, 2025 at Tokyo Big Sight, Japan. Visitors to PEMTRON’s booth will have the opportunity to experience the POSEIDON Wafer Warpage Measurement System and the JUPITER 3D X-ray Inspection System (AXI)—two cutting-edge solutions designed to enhance quality control and precision in semiconductor and electronics manufacturing.
POSEIDON: Advanced Wafer Warpage and FC-BGA Bump Inspection
The POSEIDON System offers a state-of-the-art solution for wafer warpage measurement and FC-BGA bump inspection, enabling manufacturers to achieve unprecedented accuracy and process reliability. By leveraging high-resolution 3D data, POSEIDON precisely measures warpage, flatness, and coplanarity, ensuring optimal process control for advanced applications such as wire bonding and Micro LED assembly.
Beyond measurement, POSEIDON features high-resolution imaging capable of detecting fine defects like missing bumps, bridging, and microcracks, allowing for early-stage quality control in semiconductor manufacturing. Its fast, accurate mapping and profiling capabilities make it an essential tool for high-precision production environments.
JUPITER: High-Precision 3D X-ray Inspection for In-Depth Quality Analysis
The JUPITER 3D X-ray Inspection System (AXI) integrates advanced PCT reconstruction-based processing, providing manufacturers with both 3D and 2D inspection capabilities for comprehensive defect analysis. Equipped with a high-resolution optical camera, JUPITER combines PEMTRON’s industry-leading AOI defect detection algorithms with powerful X-ray imaging, ensuring detailed process quality analysis and in-line inspection accuracy.
Seamlessly integrating with SPI and AOI systems, JUPITER enables real-time data sharing, offering valuable insights into production trends and defect patterns. This connectivity enhances manufacturing efficiency, allowing operators to detect, analyze, and correct issues faster, ultimately improving yield and reducing production costs.
PEMTRON invites attendees to visit its booth #4F-09 at JPCA Show 2025 to see live demonstrations of POSEIDON and JUPITER, and to learn how these advanced solutions can help manufacturers achieve superior process control, defect detection, and production efficiency.
For more information about PEMTRON and its portfolio of inspection systems, visit www.PEMTRON.com.
Based on 3D precision measurement and vision source technology, PEMTRON develops equipment used in various fields such as SMT, Automotive Field, Lead Tab, Semiconductor, and supplies
Soldering Inspection equipment (3D SPI), 3D Mounting Inspection equipment (3D AOI, MOI), Conformal Coating Inspection equipment (TROI-8800 CI), Bottom Head Inspection equipment (Eagle 8800TH), Top & Bottom Double Sided Simultaneous Inspection equipment (Eagle 8800TWIN), Automated X-Ray SMD Counter (MERCURY), Wafer Sawing Before/After 3D Inspection equipment (8800 WI/WIR), Wire Bonding 3D Inspection & MEMS Auto Inspection equipment(ZEUS), Package AVI equipment (APOLLON), Memory Module / SSD Auto Inspection equipment (MARS), FC-BGA, FCP-CSP Inspection equipment (POSEIDON-S), Scale Sorter Of FC-BGA Products (8800 FI), Bump Metal Mask Inspection equipment (8800 MI), PCB Appearance Inspection equipment (8800 AI) and Lead Tab Process/Inspection equipment(Hawk 7300).
