Apr 21, 2003
Led by conference chair Rob Rowland, RadiSys Corporation, the highly regarded SMTA International Technical Advisory Committee is comprised of electronics manufacturing and packaging experts who represent all facets of the industry.
This year's program will feature half- and full-day courses, 15 of which are new. They include:
Low Cost Flip Chip; PWB Yield Management for Increased Profitability; Lead-free Implementation; Quality Improvements in the SMT Process; Lead-free Reliability; Selective Soldering; Creating Competitive Advantage in Today's EMS Market; Classification and Handling of Moisture Sensitive ICs; Lean Manufacturing; Low Volume Assembly; Designing Advanced IC Package Technology; High Density Manufacturing; PPM/DPMO Benchmarking Your Yield; Pin-in-Hole Intrusive Reflow; and 0201 Design, Assembly, and Soldering.
Paper sessions, during which over 120 papers will be presented, are organized into tracks on Manufacturing and Assembly, Advanced Packaging, Soldering, Process Control, Substrates, Test and Inspection, and Contract Manufacturing/Business Issues.
11 new technical sessions include 3-D Packaging, Leadless Packaging, Six Sigma, Cleaning, MSD, Selective Soldering, Pick and Place, Black Pad, Test and Lead-free, Chip on Board for SMT, Cleaning for High Frequency Applications, and Nanotechnology.
Also returning will be the ever-popular symposiums on Contract Manufacturing and Lead-free Soldering, as well as the Emerging Technologies Summit, where attendees will get a glimpse of what the future holds for the electronics manufacturing industry.
Free programs each day focus on Six Sigma, NEMI Roadmap, Board Talk, Doing Business in China, Reducing Your Line Set Up Time, and Future SMT Practices.
For more information and developments regarding SMTA International visit the on-line brochure, or contact SMTA administrator JoAnn Stromberg.
SMTA
www.smta.org
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