SMT, PCB Electronics Industry News

IPC Honors Members at IPC Printed Circuits Expo� 2003

Apr 23, 2003

NORTHBROOK, Ill., April 21, 2003--IPC�Association Connecting Electronics Industries honored 32 individuals at IPC Printed Circuits Expo� 2003, held March 23-27, 2003, in Long Beach, Calif., for their contributions to IPC and the electronics industry.

Michael Carano, Electrochemicals Inc., received IPC�s Outgoing Chairman Award on behalf of the printed circuit board and electronics manufacturing services industries, their suppliers and customers. Carano was recognized for his leadership and devoted service as Chairman of the IPC Suppliers Council Steering Committee from 2001-2003.

Rainer Thueringer, C.I.D.+, Fachhochschule Giessen-Friedberg University of Applied Sciences, was honored with the IPC President�s Award for his work in completing the translation of the entire IPC PCB Designer Certification Program into German. This award is given to members who have exhibited ongoing leadership in IPC and have made significant contributions to the association and the electronics assembly industry.

In addition, IPC presented two Special Recognition Awards to individuals who have made a recent exceptional contribution to an IPC program. Brian Butler, Introbotics Corp., was awarded for his significant contributions to the IPC and CAT Inc.�s Printed Board Process Capability,

Quality and Relative Reliability (PCQR2) Benchmark Database and for providing exceptional controlled impedance test data. Thomas Gardeski, E. I. du Pont de Nemours and Co., received an IPC Special Recognition Award for his numerous contributions to the Technical Program Committee, for chairing a technical paper session at IPC Printed Circuits Expo 2003 and for chairing the Technical Conference at the inaugural 2003 International Symposium on Flexible Circuits and Chip Scale Packaging.

IPC also presented 28 volunteers with Distinguished Committee Service Awards at IPC Printed Circuits Expo 2003. This award is given to IPC committee members who have made an exceptional contribution to a specific standard, guideline, round robin test program or other IPC program.

The following were recognized for their significant efforts in the build and release of

IPC-D-356B, Bare Substrate Electrical Test Data Format:

▪ Duane Delfosse, ECT Test Services Div. ▪ Elke Fleck, Mania GmbH & Co.

▪ Gilbert Volpert, ATG Test Systems GmbH ▪ Ilan Angier, Frontline PCB Solutions

▪ Marcia Rogowsky, ECT Test Services Div. ▪ Bini Elhanan, Valor Computerized Systems

For their significant efforts in the release of IPC-2221A, Generic Standard on Printed Board Design, the following were also presented Distinguished Committee Service Awards:

▪ Don Dupriest, Lockheed Martin Missiles &Fire Control ▪ Randy Reed, Merix Corp

▪ Werner Engelmaier, Engelmaier Associates, L.C. ▪ Susan Mansilla, Robisan Laboratory

▪ Mike Green, Lockheed Martin Space &Strategic Missiles ▪ Lionel Fullwood, WKK Distribution Ltd.

▪ Ignatius Chong, Celestica International, Inc. ▪ Chris Conklin, Lockheed Martin Corp.

The following six members were awarded for their significant efforts in the release of IPC-2226, Sectional Design Standard for High Density Interconnect (HDI) Boards:

▪ Don Dupriest, Lockheed Martin Missiles and Fire Control ▪ Gary M. Ferrari, CID+

▪ Michael G. Luke, CID, Raytheon Company ▪ Frank Y. S. Bai, TPCA

▪ Lionel Fullwood, WKK Distribution Ltd. ▪ Samy Hanna, AT&S

In recognition of their strong support of IPC�s Designers Council and contributions to the design community, the following were awarded IPC Distinguished Committee Service awards:

▪ Philip Mayo, Premier EDA Solutions Ltd. ▪ Paul Fleming, C.I.D., Mentor Graphics

▪ Richard P. Hartley, C.I.D., Hartley Enterprises ▪ Andrew Kowalewski, C.I.D.+, SyChip, Inc.

▪ Alan Johnson, C.I.D.+, Premier EDA Solutions Ltd.

Finally, Akikazu Shibata, JPCA, received IPC�s Distinguished Committee Service Award for his significant work toward the development of IPC-0040, Optoelectronic Assembly and Packaging Technology, and Michael Beauchesne was awarded for his efforts in the release of the ANSI-approved IPC-4202, Flexible Base Dielectrics for Use in Flexible Printed Circuitry; IPC-4203, Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films; and IPC-4204, Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry.

For more information on these awards and the award recipients, contact IPC Communications Manager Joe Dudeck at JoeDudeck@ipc.org or 847-790-5371.

About IPC

IPC is a Northbrook, Ill.-based trade association dedicated to the competitive excellence and financial success of its more than 2,300 member companies, which represent all facets of the electronic interconnection industry, including design, printed circuit board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of a $40 billion U.S. industry employing more than 350,000 people. IPC maintains offices in Taos, N.M.; Washington, D.C.; Garden Grove, Calif.; and Shanghai, China. For more information, visit http://www.ipc.org.

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