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Fairchild vows lead-free finishes in under one year

Sep 02, 2003

July 21 2003

from Fairchild Semiconductor

Fairchild to be lead-free by next June

Fairchild Semiconductor has initiated conversion of all products to lead-free (Pb-free) finish packages.

Fairchild Semiconductor has initiated conversion of all products to lead-free (Pb-free) finish packages.

Conversion will continue through the remainder of this year and is expected to be completed by June 2004.

Fairchild's lead-free packages meet or exceed the requirements of the joint IPC/JEDEC standard J-STD-020B, are compliant with the European Union requirements which will take effect in 2005, and meet additional conditions delineated by key customers.

Fairchild launched its Pb-free initiative to provide its customers with lead-free package finishes, responding to concerns about the environmental impact of lead, historically used in solder finishes and lead coating in electronic components.

JEDEC requires moisture sensitivity level (MSL) certification using reflow peak temperature testing to 250C.

This higher temperature testing is required to ensure that packages attach properly to printed circuit boards.

A majority of Fairchild's surface mount lead-free packages have been tested to a peak reflow temperature of 260C to provide customers with additional reliability assurance.

"Fairchild is actively pursuing measures that foster a clean environment and provide superior customer service.

One of the ways we accomplish this will be by providing our customers with lead-free finish products", said Mark Rioux, Director of Worldwide Quality and Reliability.

"Fairchild offers a growing array of products with lead-free finishes - one of the largest in the industry.

By June of 2004, all our products will be converted to lead-free finishes.

Supplying environmentally friendly components to satisfy our customers' requirements is an integral part of Fairchild's commitment to the environment and to our customers".

The primary lead-free finish used by Fairchild is pure matte tin, providing stable plating highly compatible with widely used tin-lead solder processes.

It is also compatible with Pb-free board assembly processes, such as those using tin-silver-copper (SnAgCu) solders.

Fairchild's lead-free implementation is an important element of the company's commitment to actively protect the environment, part of its stated responsibility to customers and the global communities in which the company operates.

Fairchild remains dedicated to developing and maintaining excellent environmental management systems that meet all governmental regulations, the requirements of ISO14001 and its customers' expectations.

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