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Bonding Platform FINEPLACER� Micro MA � Accuracy Meets Flexibility

Nov 27, 2007

FINEPLACER� Micro MA is a bonding platform characterized by an enlarged working space (max. substrate size 460 mm x 310 mm) combined with placement accuracy better than 10 micron. The system is suitable for small component assembly with a pitch down to 50 micron.

Due to its modular system architecture, FINEPLACER� Micro MA offers an exceptionally high grade of flexibility. Depending on the specific requirements, the machine can be equipped with a broad range of application modules to support a multitude of assembly technologies such as AuSn/Indium/C4 soldering, thermocompression, ultrasonic and thermosonic bonding, adhesive technologies (ACF, ACP, NCP) or curing (UV, temperature).

Typical applications for FINEPLACER� Micro MA are RFID and sensor assembly, flip chip bonding, chip-on-flex, chip-on-glass, embedded components or chip-to-wafer bonding. With an optional Die Pick-up Module it is even possible to work with 8� wafers.

Optionally available is a motorized Bonding Force Module which is controlled by the bonding software �WinFlipChip�. Critical process steps will be carried out operator-independent � at the same time there is an increase in reproducibility and usability.

Because of the platform concept FINEPLACER� Micro MA can be enhanced with powerful soldering modules to turn the system into a high-performance rework station. This makes it the perfect choice for universities and research facilities.

More information available at


FINETECH is a leading manufacturer of innovative rework and micro assembly equipment for the latest advanced packages. The modular design of the FINEPLACER� platform enables a multitude of applications, from reworking SMDs to the highly accurate placement of flip chips or opto-electronic components. FINETECH is headquartered in Berlin, Germany, with offices in Tempe, Arizona, and Shanghai, China.

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