SMT, PCB Electronics Industry News

Indium Corporation�s Technology Experts Presenting at APEX

Feb 03, 2008

Three of Indium Corporation�s technology experts will be presenting at APEX, IPC Printed Circuits Expo March 29 -April 3, 2008: Vice President of Technology, Dr. Ning-Cheng Lee; Senior Technologist, Dr. Ronald C. Lasky, Ph.D.; and Solder Paste Product Manager, Tim Jensen.

Dr. Lee will present a professional development course entitled: "Achieving High Reliability for Lead-Free Solder Joints � Material Considerations" - Sunday, March 30, 8:30am � 4:30pm

He will also participate in two technical conferences: "Future Lead-Free alloys � Meeting Challenges of Miniaturization" - Wednesday, April 2, 10:15am � 11:45am. And: "A Compliant and Creep Resistant SAC+Al (Ni) Alloy" - Thursday, April 3, 9:00am � 10:00am

Dr. Lasky will be present a professional development course: "Rapid RoHS Assembly Development for Large and Small Boards in an RoHS Environment" - Monday, March 31, 8:30am � 4:30pm

He will also present at the technical conference: "Assembly of Large PWBs in an RoHS 5, RoHS 5.5, and RoHS 6 Environment" - Wednesday, April 2, 9:00am � 10:00am

Tim Jensen will present at the technical conference: "Improving Pb-Free Reflow Coalescence through Consistently High Solder Paste Transfer Efficiency" - Tuesday, April 1, 1:30pm � 3:00pm

Indium Corporation will also be exhibiting at the show at booth #747.

Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests cover advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost of ownership.

Dr. Lasky, holder of the prestigious SMTA Founder�s Award, is a world-renown process expert and a visiting professor at Dartmouth College. He has over 25 years of experience in electronics and optoelectronic packaging and assembly. He has authored or edited five books and numerous technical papers, and holds several patent disclosures. Dr. Lasky also authors a technology blog which can be found at .

Tim Jensen has a Bachelor�s Degree in Chemical Engineering from Clarkson University. He has authored technical publications and numerous process and technical guidelines. Tim is a member of the SMTA and participates actively in several IPC standards development committees.

Indium Corporation is a premiere materials supplier to the global electronics assembly, semiconductor fabrication & packaging, solar photovoltaic, and thermal management markets. Founded in 1934, the company offers a broad range of products, services, and technical support focused on advanced materials science. With facilities in the PRC, Singapore, the United Kingdom, and the USA, the company is a four-time Frost & Sullivan Award winner, and registered to ISO-9001.

For more information about APEX or to register for these conferences, visit http://www.goipcshows.org .

For more information about Indium Corporation visit or email _abrown@indium.com_.

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