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  • SMTA Announces �Best of Conference� Award for Pan Pacific 2008 Symposium

SMTA Announces �Best of Conference� Award for Pan Pacific 2008 Symposium

Mar 07, 2008

Minneapolis**, MN*� The Annual Pan Pacific Microelectronics Symposium and Tabletop Exhibition that took place January 22-24, 2008 in Kauai, Hawaii was a great success. Speakers at the Pan Pacific Symposium promoted international technical exchange and joined in a diverse forum for extensive networking among microelectronics professionals from around the world.

As rated by the attendees, the �Best of Conference� Award was given to two presenters this year. The first was awarded to Shari Farrens, Ph.D., SUSS MicroTec, for her presentation of �Precision Wafer to Wafer Packaging Using Eutectic Metal Bonding�.

The second was awarded to Maaike Taklo, Ph.D., /SINTEF ICT/, for her presentation of /�BCB Bonded Wireless Vibration Sensor�.

Both papers are featured in the 2008 Pan Pacific Symposium Proceedings, available now in the SMTA Bookstore. The 2009 Pan Pacific Conference will be held on February 10-12, 2009 on the Big Island of Hawaii

For more information on the Pan Pacific Microelectronics Symposium and Tabletop Exhibition, contact SMTA administrator JoAnn Stromberg at 952-920-7682 or joann@smta.org

The SMTA is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

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