Apr 10, 2008 
In the underfills category, Henkel won both an NPI Award and a Vision Award for its cornerbond underfill system, Loctite� 3508. The NPI Awards program is sponsored by Circuits Assembly magazine and the Vision Awards contest is hosted by SMT magazine. Both have completely separate criteria and judging panels but, clearly, the diversity of the judges participating in each awards program had no bearing on the final outcome � all unanimously recognized the benefits provided by Loctite 3508. Henkel�s unique material delivers a cost-effective alternative for traditional capillary flow underfills for certain applications, particularly for BGAs and CSPs used in mobile products such as laptops, gaming consoles and other devices that will experience only occasional vibration. Loctite 3508 can be applied in-line and cures during the normal solder reflow process, thus maximizing existing capital equipment usage and dramatically improving throughput. As the only material in this class that allows for component self-centering, Loctite 3508 enables proper solder ball collapse so that robust interconnections can be formed.
Commenting on the award wins, Henkel�s Robert Chu, Underfills Global Product Manager, said, �Both Henkel and our customers have already experienced first-hand the cost-effectiveness and reliability of Loctite 3508. We are honored that the judges for both of these prestigious contests have further validated our confidence in this superior material.�
Also known for its pioneering developments in thermal interface materials, Henkel was selected as one of twelve winners of show organizer IPC�s Innovative Technology Center. PowerstrateXtreme Dispensable (PSX-D). a new phase change thermal interface material (PCTIM2), received the accolade and was included in a special display at last week�s APEX conference and exhibition. As a PCTIM2 in paste form, PSX-D offers all of the benefits of thermal greases without any of the shortcomings. The material�s thickness can be adjusted depending on the requirement, offering manufacturers considerable flexibility as only one material � not various films of different thicknesses � must be procured. PSX-D also delivers process adaptability, as it can be needle dispensed or manually applied onto a heat sink or other surfaces, eliminating the need for additional equipment investment and improving throughput. PSX-D is reworkable and repeatable which makes it extraordinarily cost-effective, especially for both lidded and bare die applications and it has been optimized as a TIM2 material for use between microprocessors, IGBT, FBDIMM/Memory, GPU, multichip modules, ASICs and their active heat sinks.
�This is a revolutionary material in every sense of the word,� says Jason Brandi, Henkel Global Product Manager for Thermal Interface Materials. �Manufacturers have long sought the best of both worlds � all of the advantages of PCTIMs and thermal greases in one product � and now, with PSX-D, this has been achieved. It is just another example of Henkel�s unyielding ingenuity and its commitment to remain at the forefront of materials technology.�
For more information on Henkel�s thermal management or underfill materials, please call the company headquarters at 949-789-2500 or visit Henkel online at http://www.henkel.com/electronics.
About Henkel
For more than 130 years, Henkel has been a leader with brands and technologies that make people's lives easier, better, and more beautiful. Henkel operates in three business areas -- Home Care, Personal Care, and Adhesives Technologies -- and ranks among the Fortune Global 500 companies. In fiscal 2007, Henkel generated sales of $19.218 billion and operating profit of $1.975 billion. Our 53,000 employees worldwide are dedicated to fulfilling our corporate claim, "A Brand like a Friend," and ensuring that people in more than 125 countries can trust in brands and technologies from Henkel.
