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IPC/SMTA High-Performance Electronics Assembly Cleaning Symposium Announces Session Five Speakers

Oct 25, 2008

ROSEMONT, IL � Industry-leading associations IPC and SMTA jointly announce that Dr. Harald Wack (Session Chair) of Zestron Corporation, Jason Keeping of Celestica, Barry Richie of Dow Corning Corporation, Phil Kinner of Humiseal, and Lamar Young of Specialty Coating Systems will present in Session 5 on Conformal Coating Adhesion. The symposium, jointly sponsored by IPC and SMTA, will be held at Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008.

Conformal coating electronics assemblies have relevance in preventing moisture that can mobilize ions and induce current leakage. Conformal coating over no-clean flux residues may result in poor adhesion. Coating that releases from the circuit assembly may create a reliability condition.

Jason Keeping will discuss critical considerations for selecting a conformal coating process. Barry Richie will discuss cleaning for conformal coating. Phil Kinner will discuss the impact of process residues on conformal coating performance. Lamar Young will discuss cleaning effects on conformal coating adhesion. Attendees will gain insight into conformal adhesion and the value of cleaning or not cleaning before the conformal coating process.

For more information about the conference, visit http://www.ipc.org/CleaningConferenceBrochure. Visit http://www.ipc.org/CleaningConfSponsorshipApp for information about the sponsorship application, and http://www.ipc.org/CleaningConfTabletopApp for the tabletop application.

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