3rd International Symposium on Tin Whiskers
June 23-24, 2009,
Technical University of Denmark,
Lyngby, Denmark
Symposium on Avoiding, Detecting, and Preventing Counterfeit Electronic Parts
June 25-26, 2009,
Technical University of Denmark,
Lyngby, Denmark
The 3rd International Symposium on Tin Whiskers will cover case histories, theories of tin whisker growth, experiments and results, risk evaluation methods, and risk mitigation strategies. Attendees will be able to learn about the current state of knowledge enabling the development of improved and effective qualification and mitigation procedures. The first two symposia were organized by CALCE in US and Japan,
The Symposium on Avoiding, Detecting, and Preventing Counterfeit Electronic Parts will be valuable to supply chain managers, component engineers, brand protection specialists, marketing and procurement policy makers, contracts management, security specialists and other interested engineers. The focus is to provide relevant information to the professionals that can be used for solving problems today while planning for a different business and technology environment in the future. This is the second time that CALCE and SMTA is collaborating in this symposium following a successful meeting last September at College Park, Maryland.
These symposia are organized by SMTA in conjunction with the Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland, College Park, MD and the Centre for Electronic Corrosion (CELCORR) and ATV-SEMAPP at the Technical University of Denmark. Abstracts are currently being solicited for both events.
For information on these events or to submit an abstract, contact Melissa Serres Marx at 952-920-7682 or melissa@smta.org or visit the SMTA Call for Participation page.
http://www.smta.org/education/education.cfm#tin-whiskers
http://www.smta.org/education/education.cfm#counterfeit
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.