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RPS Deploys Selective Soldering System at US Navy Center of Excellence / ACI Facility

Mar 05, 2009

RPS Automation OPUS - 3

RPS Automation OPUS - 3

News Release

Friday, March 6, 2009

RPS Deploys Selective Soldering System at US Navy Center of Excellence / ACI Facility

RPS Automation selected for advanced selective soldering applications at prestigious facility.

Spokane Valley, WA, March 6, 2009� RPS Automation LLC, a global supplier of selective soldering, lead tinning and solder test equipment, announced that it has deployed an advanced robotic selective soldering system at ACI Technologies, a research corporation serving the US Navy Center of Excellence.

Reed Gaither, CEO of RPS, stated, �ACI is committed to evaluating, demonstrating and using the most advanced electronics manufacturing techniques in the world. We are honored to be selected to provide selective soldering at ACI.� Gaither continued, �this says a great deal about the superb team of engineers and technicians we have at RPS. We have been perfecting this technology for 20 years and this deployment at ACI is a testament to the innovation and superior quality of our U.S. built systems.�

ACI has deployed an Opus III Selective Soldering System from RPS. This system performs precise automated robotic soldering of thu-hole and odd form components and lead attach applications. The Opus utilizes a top-side gantry with 360 degrees of rotation, 0-10 degrees of programmable tilt and tool-free accommodation of PCB's as large as 18 x 18� (455 x 455mm).

The RPS proprietary Gaussian MiniWave Nozzles�, from 2mm to 20mm in diameter, deliver tall, stable mini waves of solder that can handle an enormous range of applications, from long leads to tight keep away pin placements. The Opus at ACI is lead and lead-free ready with quick change solder pots; ACI is also using a 6-inch conventional wave nozzle to handle traditional wave processing without the higher cost and maintenance of a wave system.

Ken Friedman, Equipment Advisory Board Coordinator at ACI commented, �Our production team is experienced with a wide range of robotic automation equipment and they could not be more pleased with the terrific performance and ease of operation of the Opus System. Friedman went on to state, �The RPS team is a great asset, with factory-direct field technicians and process expertise that is rare in the industry today; we have a true partner in RPS.�

News Release

FRIDAY, March 6, 2009

RPS Deploys Selective Soldering System at US Navy Center of Excellence / ACI Facility

RPS Automation selected for advanced selective soldering applications at prestigious facility.

About ACI

ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. The company operates the U.S. Navy's Center of Excellence in Electronics Manufacturing (Electronics Manufacturing Productivity Facility EMPF), and the U.S. Army's Electronics Sustainment Center (AESC). The EMPF focuses on the development, application and transfer of new electronics manufacturing technology by partnering with industry, academia and government centers and laboratories in the United States in order to maximize available research capabilities at the lowest possible cost.

About RPS

RPS Automation LLC manufactures a complete line of advanced selective soldering, lead tinning and solder test equipment for the electronic assembly and manufacturing industry. Systems feature closed loop servo robotics, precision selective miniwave performance, and ease of programming. The company has delivered over 500 installations to more than 300 global customers. RPS is committed to high performance soldering, long term durability, and exceptional customer service. All RPS products and software are designed and manufactured by RPS in Spokane, Washington USA.

For more information, please contact:

Diana Jenno

Director of Marketing

RPS Automation LLC

509.891.1680 x204

djenno@rpsautomation.com

http://www.rpsautomation.com

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