May 26, 2009 
The Sawa SC-500HE removes solder balls from stencil apertures after normal wipe cleaning. A small handheld ultrasonic cleaning head (2.36" diameter) is manually applied over apertures with IPA, water or a non-VOC solvent. During application of the cleaning head, a small tray containing a foam pad soaked with solvent is held underneath the stencil to capture solder balls dislodged by the cleaning head. The Sawa 500HE can clean stencils without removing them from the printing machine, allowing stencils to be cleaned in just a few minutes.
Sawa Stencil Cleaners are widely used in the Japanese Electronics Industry to ensure high yields when screen printing solder paste onto PCBs. Normal cloth wipe cleaning of stencils cannot completely remove solder paste especially in fine-pitch applications because a small amount of solder balls have a tendency to adhere to the corners of the apertures. Sawa Stencil Cleaners are able to completely remove solder paste using ultrasonic vibration and require no special solvents as they are effective with isopropyl alcohol, a water-based solvent or any other solvent.
Product literature also will be distributed for all Seika Machinery's products. For more information about the Sawa SC-500HE portable cleaner or Seika's full product line, visit Seika at the SMTA Upper Midwest Expo & Tech Forum or visit http://www.seikausa.com.
About Seika Machinery, Inc.
Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.
