CN-1728 is a fast-flowing capillary underfill with a viscosity of 900 cps, and it can be cured in as little as 1 minute at 150°C. These properties makes the underfill suited for high volume, high speed in-line processing.
Rework is accomplished by use of elevated temperature, 170°C to 180°C, to remove the underfill fillet. Then, the BGA is lifted from the board after heating it to reflow temperature. Underfill residue is easily scraped off, again at 170°C to 180°C.
Zymet is a manufacturer of microelectronic and electronic adhesives and encapsulants. Its products include die attach adhesives, substrate adhesives, UV curable glob top and cavity-fill encapsulants, and underfill encapsulants.
For more information, contact Zymet, Inc., East Hanover, NJ. Requests for information may also be submitted by Email to email@example.com