Nov 06, 2009
Attendees this year enjoyed strong presentations from 60 speakers and the addition of a third track covering MEMS and Embedded Device Packaging. There were more than 40 exhibiting companies and 200 exhibits attendees. The number of tutorial attendees was twice that of last year’s event. Over 500 industry leaders in attendance provided the IWLPC strong representation from a well-rounded group of OEMs, academia, and suppliers.
The conference commenced on Wednesday with a Kick-off panel discussion led by the WLCSP Forum. Panelists represented Stats ChipPAC, Amkor Technology, Flip Chip International, ASE US Inc. and Pac Tech USA.
Thursday started the Technical Conference with Opening Speaker, Rolf Aschenbrenner, Fraunhofer IZM, speaking to a full room on the topic of "Chip Embedding Technology for IC Packaging". Keynote speaker, Dr. Rao Tummala, Georgia Institute of Technology, engaged his audience with a presentation on "Trends and Progress from ICs to 3D ICs to 3D Systems-on-Wafer."
The conference ended strong with Plenary Speaker Dr. Bill Bottoms, chairman of Third Millennium Test Solutions and iNEMI, discussing challenges and potential solutions for combining WLP and 3D IC technologies.
Sponsored jointly by the SMTA and Chip Scale Review magazine, the annual IWLPC explores cutting edge topics in wafer-level packaging and IC/MEMS/MOEMS packaging, including 3D/Stacked/CSP/SiP/SoP and mixed technology packages. The event was sponsored by Dow Electronic Materials, Enthone, NEXX Systems, Pac Tech USA, and Technic, Inc.
Plans are now underway for the 2010 event. For more information contact Melissa Serres Marx at 952-920-7682 or melissa@smta.org.
Visit http://www.iwlpc.com to view the full program and watch for a complete event review.
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
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