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Christopher Associates Announces Product Lineup for IPC/APEX 2010

Mar 27, 2010

Koh Young aSPIre 2, The New Dimension in Solder Paste Inspection.

Koh Young aSPIre 2, The New Dimension in Solder Paste Inspection.

Christopher Associates, a pioneering supplier and distributor to the electronics and photovoltaic industries, will exhibit a comprehensive portfolio of exciting new technologies in booth #1917 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas.

In addition to contributing to the technical sessions, Christopher Associates will exhibit the latest solder paste inspection technology from Koh Young Technology, as well as advanced full color AOI from Marantz Electronics, an industry leader in inspection.

Koki Company Ltd., one of the world’s leading suppliers of soldering materials, will introduce an exciting new lead-free alloy with superior performance characteristics. Additionally, Koki will introduce several new solder paste formulations for package-on-package (PoP) applications.

Other products to be exhibited include the Vacu-Nest substrate support system, a patented firm yet soft technology developed by Novatec S.A. Christopher Associates also will display its range of printed circuit fabrication products.

Finally, Christopher will introduce the Japan Unix Unisonik 414R ultrasonic robotic soldering technology. The Unisonik is an enabling technology that allows fluxless soldering to materials such as glass, aluminum and molybdenum. It also is useful for advanced manufacturing processes requiring extreme cleanliness.

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