Indium Corporation Features New Halogen-Free Pb-Free Solder Paste at NEPCON Shenzhen

Indium8.9HF-1 Solder Paste is a no-clean Pb-free halogen-free solder paste that offers the best-in-class probe-testability and unprecedented stencil print transfer efficiency to work in the broadest range of processes.

Indium8.9HF-1 was specially designed to be extremely thermally stable and maintain a soft, pliable residue after reflow. This means easier probe-testability and fewer false rejects during in-circuit testing.

Indium8.9HF-1 has a high oxidation barrier to eliminate graping and head-in-pillow defects.

Indium8.9HF-1 has excellent print transfer efficiency on 0.4mm pitch CSPs and is halogen-free per the EN14582 test method.

Indium8.9HF-1 exhibits low voiding (

Indium8.9HF-1 is also compatible with Sn/Pb alloys.

The performance benefits customers obtain by using Indium8.9HF-1 result in increased cost savings and the highest finished goods reliability.

Indium will be exhibiting at Booth 2F55.

For more information about Indium8.9HF-1 halogen-free Pb-free solder paste, visit http://www.indium.com or email abrown@indium.com.