FINETECH to Showcase Sub-Micron Bonder at IMAPS 2010

Oct 04, 2010

FINEPLACER® Lambda

FINETECH will showcase the FINEPLACER® Lambda in booth 706 at the upcoming IMAPS 2010 Exhibition, scheduled for November 2-4, 2010 at the Raleigh Convention Center - Research Triangle in Raleigh, NC.

The FINEPLACER® Lambda is ideal for low-volume, prototyping and R&D environments requiring precision, advanced technologies and the highest bonding placement accuracy (down to ± 0.5 micron). This versatile system can be used for precise placement, die-attach and advanced packaging utilizing various bonding technologies ― soldering (Eutectic, Au/Sn, Indium), thermo compression, thermo-/ultrasonic bonding, adhesives, and curing.

Applications include flip chip, 3-D packaging, MEMS, wafer level packaging (W2W, C2W), optoelectronic and micro optics bonding and assembly, sensors and more. The system handles component sizes from 0.15mm to 60mm and special tools allow object sizes down to 5 micron.

For more information, visit the company in booth 706 or visit http://www.finetechusa.com.

FINETECH is a leading manufacturer of innovative rework and advance packaging and assembly equipment for the latest advanced packages. The modular design of the FINEPLACER® platform enables a multitude of applications, from reworking SMDs to the highly accurate placement of flip chips or opto-electronic components. FINETECH is headquartered in Berlin, Germany, with offices in Tempe, Arizona; Manchester, New Hampshire; Shanghai, China; and Penang, Malaysia.

FINETECH to Showcase Sub-Micron Bonder at IMAPS 2010 news release has been viewed 955 times

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