SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • FINETECH to Showcase FINEPLACER® core rework system at IPC APEX EXPO 2011

FINETECH to Showcase FINEPLACER® core rework system at IPC APEX EXPO 2011

Mar 11, 2011

The FINEPLACER® core represents a compact, yet versatile hot-gas rework system withs a level of professionalism that exceeds its attractive price.

The FINEPLACER® core represents a compact, yet versatile hot-gas rework system withs a level of professionalism that exceeds its attractive price.

FINETECH will highlight the FINEPLACER® core rework system in Booth #1940 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.

The FINEPLACER® core offers proven rework technology for a wide spectrum of SMT components, ranging in size from 0201 to 70 x 70 mm BGAs, and handling PCBs up to 300 x 400 mm. The semi-automated design includes force measurement with automatic component lift-off and placement. An in-site process observation camera allows the ability to view the reflow process at almost any angle. The FINEPLACER® core represents a compact, yet versatile hot-gas rework system withs a level of professionalism that exceeds its attractive price.

The system integrates the complete rework cycle into an efficient design without diminishing functionality. The FINEPLACER® core handles de-soldering, site dressing/solder removal, paste print, re-balling and component replacement in one integrated platform. Driven by sophisticated integrated thermal management and the new QuickStart Profile Library, the FINEPLACER® core provides more for less.

For more information, stop by Booth #1940 or visit http://www.finetechusa.com

Jan 14, 2019 -

Finetech to Demo Contactless Residual Solder Removal at IPC APEX 2019

Apr 07, 2016 -

Finetech/Martin Introducing New Rework and Dispense Solutions at IPC APEX 2016

Nov 27, 2013 -

Martin Streamlines and Simplifies Rework with New Process Shuttle

Nov 08, 2013 -

Finetech Unveils High Force ACF Bonder

May 28, 2013 -

Al Cabral Joins Finetech as Regional Sales Manager

Mar 11, 2013 -

Donated Finetech Die Bonder Installed at Pennsylvania State University

Jan 16, 2013 -

Finetech to Exhibit the Ideal Blend of Performance and Cost Rework Technology at the 2013 IPC APEX EXPO

Jan 04, 2013 -

Finetech to Exhibit Sub-micron Die Bonder at SPIE Photonics West

Oct 03, 2012 -

The Best in Rework Technology – Finetech to Exhibit FINEPLACER® Core Rework System at SMTA International

Sep 26, 2012 -

MARTIN to Demonstrate Mini-Oven Reball/PreBump Unit at the Mississauga EPTECH Electronics Show

77 more news from Finetech »

Apr 19, 2024 -

ViTrox Pioneering the Future of Smart Manufacturing at NEPCON China 2024! Booth #1H27

Apr 18, 2024 -

ViTrox Technologies Elevates Service & Support Across US & Canada with Jeremy Woodworth's Appointment!

Apr 16, 2024 -

I.C.T | Your One-Stop Service for Smart Meter SMT Factory

Apr 15, 2024 -

Three Industry Leaders Receive IPC President's Award

Apr 15, 2024 -

IFTEC's Pierre-Jean Albrieux Inducted into the IPC Raymond E. Pritchard Hall of Fame at IPC APEX EXPO 2024

Apr 15, 2024 -

IPC Honors Summit Interconnect and Robert Bosch GmbH with Corporate Recognition Awards

Apr 15, 2024 -

IPC Publishes Comprehensive Strategy to Address Electronics Industry's Global Workforce Challenge, Calls on Leaders in Government, Business and Education for Support

Apr 15, 2024 -

Data I/O Announces Major Milestone with 500th PSV System Sale Ahead of IPC APEX Expo

Apr 15, 2024 -

IPC Announces New Board Members at IPC APEX EXPO 2024

Apr 15, 2024 -

Seika Machinery Recognizes Outstanding Sales Achievements at 2024 IPC APEX EXPO

See electronics manufacturing industry news »

FINETECH to Showcase FINEPLACER® core rework system at IPC APEX EXPO 2011 news release has been viewed 780 times

  • SMTnet
  • »
  • Industry News
  • »
  • FINETECH to Showcase FINEPLACER® core rework system at IPC APEX EXPO 2011
IPC Training & Certification - Blackfox

One stop service for all SMT and PCB needs