May 06, 2011 
The meeting will take place from 10 a.m.-2:30 p.m. with lunch served from 12-12:45 p.m.
Robert's two-hour presentation will begin at 10 a.m. and is titled "SMT Assembly Challenges and Proven Solutions for Increasing Yields Including Stencil Design, Root Cause Analysis and Manufacturing."
Technological advancements in the areas of stencil lasers, materials, nano-coatings and aperture registration accuracies will be presented, along with a discussion of how these new technologies can improve process yields.
Robert Dervaes has more than 19 years of design and manufacturing engineering experience in the electronics manufacturing industry, working for both the commercial and defense industries. He has been with FCT Assembly for over seven years and currently directs the technical development and engineering efforts for its Fine Line Stencil and FCT Solder divisions. He is a member of the IPC Stencil Design Task Group and has a published white paper entitled "Conquering SMT Stencil Printing Challenges with Today’s Miniature Components." Robert holds a bachelor’s degree in Mechanical Engineering from Kansas State University.
If interested in attending the upcoming SMTA Ohio Valley chapter meeting, please e-mail Brett Crane at bcrane@bird-technologies.com or arrive at Dave and Busters from 9:30-10 a.m. on June 3 to register onsite.
FCT Assembly (http://www.fctassembly.net) consists of three divisions: FCT Solder, Fine Line Stencil and A-Laser. With numerous facilities in the United States, FCT is one of the electronics industry’s leading manufacturers of lead-free and leaded solder products, superior quality stencils and precision cut parts.
The company sets itself apart from its competitors by continuously studying new products and processes in order to uphold its reputation as a leader in technology. FCT’s customers can always count on the company to use the latest technology and to supply products with the highest quality.
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