SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • MARTIN to Demonstrate BGA Reball/Pre-Bump Unit at the SMTA Space Coast Expo & Tech Forum

MARTIN to Demonstrate BGA Reball/Pre-Bump Unit at the SMTA Space Coast Expo & Tech Forum

May 10, 2011

Mini-Oven 04 Reball/Prebump unit

Mini-Oven 04 Reball/Prebump unit

MARTIN will showcase its Mini-Oven 04 Reball/Prebump unit at the upcoming Space Coast Expo and Tech Forum, scheduled to take place June 9, 2011 at the Melbourne Auditorium in Melbourne, FL.

Ideal for the complete QFN solder bumping process, down to the smallest pitches, MARTIN's Mini-Oven 04 Reball/Prebump unit uses a unique Hotprint Technology where the mask is not removed after printing paste but remains on the QFN during reflow.

The reballing function can handle a diverse range of BGAs, as well as QFNs and CSPs. Additionally, processes can be completed in as little as three minutes. The simple Rapid Technology soldering profiles rigorously apply settings within the permitted thermal limits, heat at the highest advisable thermal ramp rates and maintain a safe temperature zone.

The unit provides programmable modes and a nitrogen process gas supply. Also, up to 99 profiles can be accommodated, with the ability to edit individual profiles and fine tune parameters.

For further information, visit MARTIN at the SMTA Space Coast Expo & Tech Forum or online at http://www.bgarework.com.


MARTIN has developed affordable rework, BGA reballing, hand soldering, and dispensing technologies for nearly 30 years. The USA sales and service office is located in Manchester, NH. The company‘s manufacturing facility is in Wesseling, Germany. MARTIN is a FINETECH company which produces advanced rework and bonding platforms for complex applications.

Apr 24, 2013 -

MARTIN Introduces IR Temperature Measurement Sensors for ENHANCED Rework

Apr 19, 2012 -

MARTIN to Demonstrate Mini-Oven Reball/Solder Bumping Unit at the SMTA Toronto Expo and Tech Forum

Jan 20, 2012 -

MARTIN to Demonstrate Affordable Rework Solutions at the 2012 IPC APEX Expo

Oct 07, 2011 -

MARTIN to Demonstrate Mini-Oven Reball/Solder Bumping Unit at SMTA LA/Orange County Expo

Sep 19, 2011 -

MARTIN to Demonstrate Affordable Rework System and Mini-Oven Reball/PreBump Unit at SMTAI 2011

Jul 27, 2011 -

LEDs Are Well On The Way To Becoming The Most Innovative Components With The Fastest Growth Rate

Apr 07, 2011 -

MARTIN Launches Web Site for North American Market

Dec 03, 2021 -

Why We Use VFD - Efficiency and Performance

Dec 03, 2021 -

Use of Differential Pressure Transmitter and Common Troubleshooting

Dec 03, 2021 -

Solderstar Introduce North America to its Latest Profiling Systems at IPC Apex

Dec 03, 2021 -

Solderstar to Launch a Unique Zero Set-Up Datalogger at Productronica

Dec 03, 2021 -

Bittele Electronics Expands Authorized Suppliers to Obtain Parts During Global Components Shortage

Dec 03, 2021 -

Semicon West USA, San Francisco – An Array of New, Innovative Products in Booth 1361

Dec 03, 2021 -

Europlacer Announces Intelligent Freeform Feeder for Loose Pick & Place Parts.

Dec 03, 2021 -

Current Conditions for the Electronics Supply Chain Remain Challenging

Dec 02, 2021 -

Calibration of Rosemount Transmitter

Dec 01, 2021 -

Data analysis of air compressor energy consumption and heat recovery benefit

See electronics manufacturing industry news »

MARTIN to Demonstrate BGA Reball/Pre-Bump Unit at the SMTA Space Coast Expo & Tech Forum news release has been viewed 1061 times

  • SMTnet
  • »
  • Industry News
  • »
  • MARTIN to Demonstrate BGA Reball/Pre-Bump Unit at the SMTA Space Coast Expo & Tech Forum
Fluid Dispensers

PCB Manufacturing