Steel mesh template

 Steel mesh template

 Steel mesh template

Model:

Steel mesh template

Category:

Screen Printers

Model Year:

2019

Condition:

new

Location:

China

Offered by:

ZK Electronic Technology Co., Limited

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Steel mesh template
        The main function of the stencil is to accurately apply the solder paste to the solder paste pad on the PCB. In the solder paste printing process, the processing quality of the stencil directly affects the printing quality of the solder paste. The thickness of the stencil and the size of the opening determine the printing amount of the solder paste, and the stainless steel laser template needs to be fabricated by external processing. Therefore, the parameters such as the thickness of the template and the size of the design opening must be confirmed before the external processing to ensure the printing quality of the solder paste.
        Generally, there are components with a pitch of 1.27mm or more on a PCB, and narrow-pitch components. Components with a pitch of 1.27mm or more require a stainless steel plate of 0.2mm thick, and components with a narrow pitch require a stainless steel plate of 0.15-0.10mm thick. The thickness of the stainless steel plate can be determined according to the condition of most components on the PCB, and then the amount of the solder paste is adjusted by expanding or reducing the opening size of the individual component pads.
        If the component requires a large amount of solder paste on the same PCB, the template at the narrow pitch component can be partially thinned, but the processing cost of the thinning process is higher. Therefore, a compromise method can be adopted. The thickness of the stainless steel plate can take an intermediate value. For example, the components on the same PCB require 0.20 mm thick, and other components require 0.15-0.12 mm thick. At this time, the thickness of the stainless steel plate can be 0.18. Mm. The opening size can be 1:1 for general components, and the opening area of ​​large Chip components and PLCC requiring a large amount of solder paste should be increased by 10%. For devices such as QFPs with 0.5mm pitch and 0.65mm pitch, the opening area should be reduced by 10%.
        Appropriate opening shape can improve the mounting effect. For example, when the size of the Chip component is less than 1005, 0603, because the distance between the two pads is small, the solder paste on the pads on both ends of the chip is easy at the bottom of the component. Adhesion, bridging and soldering of the bottom of the component are easily generated after reflow soldering. Therefore, when processing the template, the inside of the opening of a pair of rectangular pads (Fig. 1) can be modified into a pointed shape or an arc shape (as shown in Fig. 2, the shape of the opening of the Chip element), thereby reducing the amount of solder paste at the bottom of the component, which can improve the patching time. The solder paste on the bottom of the component is stuck.

---Becky Su
becky@hysmt.cn

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Company Information:

ZK Electronic Technology Co., Limited

ZK Electronic Technology Co., Limited professional in Surface-Mount Technology area and supports most major brands of electronic asembly equipments with a large selections of compatible SMT.

Shenzhen, China

Assembly, Distributor, Equipment Dealer / Broker, Pick and Place, Test Services

  • Phone 86-0755-27807792
  • Fax 86-0755-22144952

ZK Electronic Technology Co., Limited website

Company Postings:

(1951) SMT parts, accessories & PCB supplies items

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This Steel mesh template has been added in 20, Feb 2020

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