GP1208 BGA Rework System
Model: |
GP1208 BGA Rework System |
Part Number: |
GP1208 BGA Rework System |
Category: |
|
Model Year: |
2016 |
Condition: |
|
Location: |
China |
Offered by: |
|
|
GP1208 BGA Rework System
Features
1. Color LCD touch monitor, could be replaced by Laptop
2. Heaters movable, convenient operation, manual lifting X-Y regulator and PCB table and locking handle seat.
3. Large movable bottom IR heating area, PCB clamps can be adjusted along with X&Y table flexibly , the max PCB size it can handle up to 340 x 400 mm
4. Color optical system, with functions of split vision, zoom in/out and micro-adjust,equipped with aberration detection device, with auto focus and software operation function
5. Three heating systems—upper / lower hot air heater, bottom IR heater—heating independently, time and temperature can be displayed in digital on touch screen.
6. 8 segments of temperature up-down and 8 segments constant temperature control, profile save is unlimited.
7. Large movable IR heating area at the bottom, ensures PCB of whole piece could be heated equally .
8. Use of an infrared heat lamp. Heat is easy to pierce and distribute evenly, which overcome disadvantage (burn out elements) of traditional welding machines.
9. Easy operation. Your just need one-day training and you can operate it skillfully.
10. Infrared heating without heated air flowing. No. impact on circumjacent small elements. It is suitable for all of the elements, especially Micro BGA elements
Specification
Applicable PCB
20 x 20 to 340 x 400 mm
PCB thickness
0.5 to 4mm
Upper heater
350 degree
Lower heater
350 degree
Upper heater(hot air)
800W
Lower heater(hot air)
250W
Bottom IR heater
2400W
Power supply
AC 220V 3.45KW
Applicable BGA
1 x 1 to 70 x 70 mm
Placement precision
0.01mm
Max BGA weight
80g
Machine weight
25kg
Machine dimension
460 x 460 x 480 mm, L x W x H
Company Information:
