GP1207 BGA Rework System
Model: |
GP1207 BGA Rework System |
Part Number: |
GP1207 BGA Rework System |
Category: |
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Model Year: |
2016 |
Condition: |
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Location: |
China |
Offered by: |
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GP1207 BGA Rework System
Features
1. Color LCD monitor
2. Heaters movable, convenient operation, manual lifting X-Y regulator and PCB table and locking handle seat.
3. Color optical system, with functions of split vision, zoom in/out and micro-adjust,equipped with aberration detection device, with auto focus and software operation function
4. Three heating systems—upper / lower hot air heater, bottom IR heater—heating independently, time and temperature can be displayed in digital on touch screen.
5. 8 segments of temperature up-down and 8 segments constant temperature control, profile save is unlimited.
6. Built-in vacuum pump, the max suction up to 80g, 60 degree rotation in Φangle
7. Large movable IR heating area at the bottom, ensures PCB of whole piece could be heated equally .
8. Use of an infrared heat lamp. Heat is easy to pierce and distribute evenly, which overcome disadvantage (burn out elements) of traditional welding machines.
9. Easy operation. Your just need one-day training and you can operate it skillfully.
10. Infrared heating without heated air flowing. No. impact on circumjacent small elements. It is suitable for all of the elements, especially Micro BGA elements
11. Can handle 775 socket, 478 socket, XBOX360, PS2/3, PSP, etc
Specification
Applicable PCB
20 x 20 to 350 x 350 mm
PCB thickness
0.5 to 4mm
Working table adjustment
±10mm forward / backward,±10mm left/right
Temperature control
K-type thermocouple, colose cycle controlled
Upper heater(hot air)
800W
Lower heater(hot air)
800W
Bottom IR heater
3600W
Power supply
AC Single-phase 220V50/60HZ
Applicable BGA
1 x 1 to 70 x 70 mm
Placement precision
0.01mm
Max BGA weight
80g
Machine weight
80kg
Machine dimension
600 x 060 x 750 mm, L x W x H
Company Information:
