FOD Prevention in Electronics Assembly


PCB Assembly Courses

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Foreign Objects and Debris (FOD) can severely affect the reliability and functionality of any electronic device. This course provides the information and techniques to help eliminate FOD during electronic assembly, hand soldering, SMT & PTH assembly processes, as well as during box build and wire assembly. Eliminating FOD requires awareness of the problem and control of its sources through effective housekeeping. This course will explain the six steps of proper housekeeping as well as proper tool control, hardware control, material handling and ESD prevention. It is everyone’s responsibility to ensure that all assemblies are built free from FOD. The reliability of the finished products the company produces depends on it.

Learning Outcomes:

  • Become knowledgeable of Foreign Objects & Debris (FOD)
  • Demonstrate proper techniques to eliminate FOD
  • Demonstrate basic understanding of effective housekeeping
  • Demonstrate hardware and tool control
  • How to handle materials in a clean environment

Course Time: 37 Minutes

Testing & Certificate:

A Certificate of Completion will be issued to the student upon Completion of the testing requirement of the course. A passing grade of 70% is needed to receive the certificate. The student will be allowed to take the test a total of 3 times to achieve a passing grade.


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