Through-Hole Solder Joint Quality Standards, Class 3


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IPC-A-610F, Acceptability of Electronic Assemblies is one of the industry’s most popular used and recognized standard. This course will cover the requirements and acceptance criteria for Class 3 used in the electronics industry for plated-through hole solder joints. Section one will cover contents for through-hole solder joint terminology, industry specifications for solder joint acceptance standards, product classes and process indicators. Section two will cover details for min./max. acceptable dimensional and visual requirements for component side, barrel and solder side. Section three explains visual criteria for such defects as solder balls, projections, bridging, webbing, voids, cold/disturbed joints, exposed basis metal, fractures, lead protrusion and flux residues. This is an essential course for any operator using IPC-A-610F in the work place.

Learning Outcomes:

  • Improved understanding of through-hole solder joint acceptability
  • Demonstrate understanding of visual criteria for class 3 requirements
  • Able to explain visual criteria for solder defects
  • Become more fluent in through-hole solder joint terminology
  • Improved functional usage of IPC-A-610F

Course Time: 32 Minutes

Testing & Certificate:

A Certificate of Completion will be issued to the student upon Completion of the testing requirement of the course. A passing grade of 70% is needed to receive the certificate. The student will be allowed to take the test a total of 3 times to achieve a passing grade.


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