BGA Rework Training & Certification

Available at our facility or on-site at your facility.  This course is designed for students that require the hands-on skill and knowledge to reliably remove and install many types of the most complex BGA components. Students are taught methods for safe and reliable BGA component rework using a top of the line BGA Rework Systems. Topics include a review of thermal profiling, preheat considerations, process techniques, review and interpretation of x-ray results. This is a 2 or 3 day optional course. One day lecture and up to 2 - days hands on training. Each student will be able to practice installing, removing, and re-balling  BGA components using both Lead & Lead Free Solders.

Topics Include

• Review of the different BGA packages - ceramic, plastic, metal and micro.
• A review of the parameters for establishing a safe thermal profile.
• Circuit board preparation - masking, baking and other process steps.
• BGA site preparation.
• Solder mask breakdown - how to prevent it, how to fix it.
• Basic Design Considerations
• BGA removal and replacement process.
• Inspection and interpreting x-ray results.
• Equipment review
• BGA Re-Balling & BGA pad Repair

Call (888) 406-2830 to schedule your class.