Manual Cleaning of Printed Board Assemblies – Step By Step Guide

September 17th 2.30pm UK Standard Time

After rework, modification or second stage assembly cleaning may need to be considered. Ideally a no clean flux, gel or solder paste should be used to avoid the need to clean selected areas. If manual cleaning is to be conducted every effort should be made to use materials or application methods that result in the minimum residues from the soldering process

Planning and training staff in manual cleaning is very important to get the best possible result visually and to maintain product reliability. This is one of the first training sessions to cover manual cleaning of board assemblies, highlighting the problems and solutions to manual cleaning

To ensure you are equipped to get maximum benefit from the event, read our Webinar Guide https://www.bobwillis.co.uk/wp-content/uploads/2017/01/WebinarAttendance2017.pdf

Topics Covered

Why clean
Material selection
Manual cleaning techniques
Testing cleanliness
Inspection requirements
Component compatibility
Reliability test techniques

Presented by Bob Willis

The webinar will run for between 60-90min with question and answer session. If you have a specific issue you would like discussed they should be provided before the start of the webinar. The webinars are limited to 100 delegates/companies. A copy of each of the slides presented will be provided after the webinar