Non-Destructive BGA/Area Array Component Rework - Technical Workshop


PCB Rework and Hand Soldering Courses

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This Workshop will review current techniques and procedures for performing highly reliable, high-quality rework and repair on some of the more difficult BGA packages and will include live demonstrations of PACE’s TF1800 BGA Rework System.

The presentation will address typical BGA/area array components, heating technologies (convection and infrared), the importance of bottom side preheating, flux application, solder paste stenciling, device alignment methods and thermal profiling techniques, followed by a live demonstration of BGA rework. Workshop participants are encouraged to bring a sample pcb for hands-on BGA removal or installation using the TF1800.

In addition, a short demonstration on cleaning circuit boards at the lowest possible cost will be presented by MicroCare, an industry leader in critical cleaning products.

The Technical Workshop is free, but registration is required:


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