Electronics Forum | Thu Jan 10 18:32:20 EST 2008 | stevek
Our layout guy recently started making land patterns with the corner lands oversized. These are for leadless and various flatpack parts. He claims this is to improve manufacturing. I had seen a few boards with this just as I got out of the CM worl
Electronics Forum | Tue Apr 27 12:32:53 EDT 1999 | Frank Hinojos
What is the current spec for sizing PCB pads for a land grid array? How about for a ball grid array? Are there industry spec's I can reference? Thanks, Frank
Electronics Forum | Wed Mar 20 15:18:09 EST 2002 | angiewest
You may want to check out IPC-SM-782 "Surface Mount Design and Land Pattern Standard" http://www.ipc.org Good Luck
Electronics Forum | Mon Oct 06 08:51:26 EDT 2003 | davef
The EIA does not provide that information. EIA standards focus on component dimensions. Alternately consider: ...cut... SM-782A - Surface Mount Design & Land Pattern Standard, Inc. Am. 1 & 2 ANSI Approved Get up-to-date land pattern recommendat
Electronics Forum | Tue Apr 27 13:00:05 EDT 1999 | Justin Medernach
| What is the current spec for sizing PCB pads for a land grid array? How about for a ball grid array? Are there industry spec's I can reference? | | Thanks, | | Frank | Frank, Refer to the device manufacturers. they are going to have a recomme
Electronics Forum | Thu Sep 06 01:12:43 EDT 2001 | Dreamsniper
Hi, What's the maximum track width that is allowed to be attached to a 0805 component land pattern. I have a 70 mil x 45 mil Land for my 0805 and is attached to a 50 mil wide track with a length of 300 mil to 1500 mil. Components affected are mostly
Electronics Forum | Mon Sep 29 20:06:22 EDT 2008 | davef
One common definition of a SMD footprint is: A typical SMD footprint, is composed of: * Solder lands (conductive pattern) * Solder resist pattern * Occupied area of the component * Solder paste pattern (for reflow soldering only) * Area underneath th
Electronics Forum | Fri Jan 19 06:52:36 EST 2001 | pteerink
We have had the same problem with several boards, and the problem was with the land pattern design on the PCB, not the stencil. We found that the part tends to center itself on the one large pad, and if the two smaller pads are not the right distance
Electronics Forum | Tue Sep 18 19:32:49 EDT 2007 | davef
Welcome Jimmy Let's mince words to help focus on the issues. When you say "QFP area solder paste shifted," do you mean: * Paste printed on land pattern perfectly, but moves after printing. * Paste printed off the land pattern, even though the stenci
Electronics Forum | Mon Dec 13 00:48:33 EST 1999 | armin
Hi All I have a 0.7 mm diameter hole for vias, what�s the minimum annular ring for this hole diameter? What�s the term unsupported and supported holes refer to in IPC-2221 9.1.2 Annular Ring Requirements? I have a proto-type PCB (designed by our R&
