Technical Library | 2015-11-19 18:15:07.0
The move to lead free (Pb-free) electronics by the commercial industry has resulted in an increasing number of ball grid array components (BGAs) which are only available with Pb-free solder balls. The reliability of these devices is not well established when assembled using a standard tin-lead (SnPb) solder paste and reflow profile, known as a backward compatible process. Previous studies in processing mixed alloy solder joints have demonstrated the importance of using a reflow temperature high enough to achieve complete mixing of the SnPb solder paste with the Pb-free solder ball. Research has indicated that complete mixing can occur below the melting point of the Pb-free alloy and is dependent on a number of factors including solder ball composition, solder ball to solder paste ratio, and peak reflow times and temperatures. Increasing the lead content in the system enables full mixing of the solder joint with a reduced peak reflow temperature, however, previous research is conflicting regarding the effect that lead percentage has on solder joint reliability in this mixed alloy solder joint.
The analysis of friction and wear properties of materials at elevated temperatures has become increasingly important, especially for the development and quality control of combustion engine and power plant constituent parts. To meet the resulting nee
Industry News | 2020-12-23 19:09:09.0
Sumida Surface Mount Automotive Power Inductors Handle High Temperatures, High Currents
New Equipment | Cleaning Equipment
High Temperature, High Pressure Aqueous/Semi-Aqueous Batch Electronics Cleaning Systems Forget the limitations of the past and experience a batch system that offers multiple cleaning technologies for capability previously unachieved in a compact fo
New Equipment | Industrial Automation
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Industry News | 2023-05-01 14:29:08.0
The Robotic Soldering, Inspection & Defect Guide is the latest free process guide produced by Bob Willis
Industry News | 2005-04-26 15:48:02.0
New family of high-threshold, low on-resistance power MOSFETs for automotive and other high-current, high-temperature applications was issued by Siliconix.
Industry News | 2016-05-04 12:59:35.0
CAMI Research has issued its latest catalog featuring new products and services. Available immediately, the catalog showcases their expanding CableEye suite of Low and High Voltage (HiPot) test system products for cable & wire harness manufacturing.
New Equipment | Industrial Automation
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Industry News | 2014-08-07 11:41:44.0
Indium Corporation's Sze Pei Lim, technical manager - Southeast Asia; and Sehar Samiappan, area technical manager, will present at the IPC Southeast Asia High Reliability Conference on August 20 in Penang, Malaysia.