Electronics Forum | Wed Dec 13 13:42:57 EST 2000 | Mike Ihm
The dielectic absorption characteristic of printed circuit board materials is usually not listed on the manufacturers spec. sheets. Can anyone point me in a direction to help determine which laminate materials might exhibit better dielectric absorpt
Electronics Forum | Fri May 29 15:03:46 EDT 2009 | rway
We have recently begun using X5R dielectric capacitors. Although they have a better temperature coefficient over Y5V, they age much faster (5-7% logarithmically per decade). I assume the reason for using the X5R was the availability of the capacita
Electronics Forum | Mon Jun 01 22:56:39 EDT 2009 | davef
Reflow soldering de-ages the capacitors. Two things may be affecting your testing. * Capacitance measurements are often erratic during testing for about 10 hours after de-aging. * Test limits should be set so that the capacitance value is within the
Electronics Forum | Wed Dec 13 20:42:57 EST 2000 | Dave F
Material Dk @ 1GHz tan d @ 1GHz Difunctional 4.40 0.020 Multifunctional 4.43 0.018 Polyimide 4.06 0.006 Cyanate ester 3.65 0.005 Bismaleimide triazine 2.94 0.011 PPO-epoxy 3.85 0.012 PTFE-glass 2.60 0.001 PTFE-mat-CE 2.79 0.003 PTFE-ceramic 4.06 0.00
Electronics Forum | Tue Oct 07 12:32:39 EDT 2003 | Don Beane
I'm looking for the dielectric values of materials for flex, rigid and flex/rigid pcb construction. Has anyone put together tables for this information? Where can I find the information to figure out what dielectric resistances I need based on altitu
Electronics Forum | Tue Oct 14 16:38:49 EDT 2003 | MA/NY DDave
Hi I don't understand your question. I do understand dielectrics and flex. What is "dielectric resistance". I might know it by a different name. YiEngr, MA/NY DDave
Electronics Forum | Mon Dec 26 10:45:40 EST 2005 | davef
+85*C. * Wave solder preheats are >100*C just prior to entering the wave * Temperature changes between exiting the chip wave and the laminar wave can swing through >100*C * Do not exceed 3*C per second maximum rate of change in temperature. Generall
Electronics Forum | Wed Oct 20 10:49:04 EDT 1999 | Brian
Hi! Stu's method is a half-truth. What it measures is the aggregate of all volatile material with a significant vapour pressure at the baking temperature, not just H2O. Short of very complex methods, it could be complemented by a comparitive measur
Electronics Forum | Mon Dec 26 12:58:17 EST 2005 | davef
As an alternative theory to the boards being damaged in the wave soldering process, it's possible that the panels are being handled in a way that flexes the panel and breaks the capacitors. In this possibilty, we'd expect capacitors in specific loca
Electronics Forum | Fri Feb 05 21:34:25 EST 1999 | Raymond Bellamy
I am looking for a piece of equipement that can safely remove silicon die(200mil by 200mils) from a LTCC board. My present method involves a dental drill which often goes through the dielectric layers and causes scrap.
