Electronics Forum | Thu Aug 05 17:33:10 EDT 2004 | russ
We get this from time to time and I have found that a lot of times the customer or somebody has broken the joints from flexing or other handling. Is this component in the center of the PCBA? Russ
Electronics Forum | Thu Aug 05 21:47:35 EDT 2004 | KEN
Agreed. Joint failure can happen when un-bagging or durig box-build (at customer site). Careful handling should be used. In one case I had boards returned to me for evaluation and failure analysis. Too bad our site never built the boards!!! (jacka
Electronics Forum | Wed May 16 00:14:45 EDT 2018 | leeg
We have a Dek Horizon and we have started getting a data file open error when trying to save files. This is resulting in us having to re-teach board fiducials etc in every time we switch back to a previous job. Any ideas?
Electronics Forum | Wed Aug 09 09:59:23 EDT 2006 | russ
Trace repair is dependent upon the operator. A highly skilled operator can repair a trace with no adverse effects on assembly. IPC has a manual on reapir methods and there associated risk relating to reliabilty. I wil try and find number when time
Electronics Forum | Mon Sep 23 22:31:48 EDT 2002 | davef
Comments are: * It�s interesting, but not surprising that your time above liquidous varies around the sides of this component. * You are correct in thinking that it is better to reduce than to increase the temperature differences around the component
Electronics Forum | Sat Feb 12 09:08:47 EST 2000 | Sal
Experiencing a problem with a 208 PBGA device. I am achieving good wetting with the exception of one ( damn) pin on the outer corner.I have a really good profile but the worrying thing is that it is so inconsistant. Once this open pin failure is dete
Electronics Forum | Mon Sep 23 03:12:01 EDT 2002 | surachai
We encounter this problem also , I know that it 's acceptable per IPC standard but sometime it fail at ICT and FCT , then this problem should be prevent , we found it with QFP 16 mil pitch and the defect looklike negative wetting at the front of lead
Electronics Forum | Mon Nov 06 09:38:55 EST 2000 | Dean Stadem
We have seen this problem several times. It always goes back to pad solderability, very seldom does it have anything to do with ball size. If there is no evidence of wetting on that pad, but all of the other pads did solder, you need to ask yourself
Electronics Forum | Tue Jan 30 02:38:50 EST 2001 | arul2000
This BGA could have gone through the reflow cycle two times as we understand from the BGA manufacturer, during the BGA ball attachment process. (If any ball is found missing, they replace the missed ball manually after applying flux manually and refl
Electronics Forum | Tue Nov 07 21:49:05 EST 2000 | Dave F
Cheers to you Your gold plating is specified for the gold wire bonding between the die of your BGA and the pads on the BGA substrate. For solderable surfaces this is heavy on gold for use on pads. Gold SB thinner on pads to limit the amount of gol
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