Electronics Forum | Tue Nov 21 09:45:46 EST 2006 | russ
nope, but why such a high reflow temp for lead paste?
Electronics Forum | Wed Nov 22 02:37:20 EST 2006 | brodalvin
Thanks a lot for the responses...��
Electronics Forum | Mon Nov 20 21:55:21 EST 2006 | brodalvin
Does SnPbAg solder paste have a reliability risk if subjected 2 times in reflow oven at 230�C? I want to implement my project immediately. If samples will be subjected to our reliability it would take three months before I can implement my project.
Electronics Forum | Tue Nov 21 12:35:59 EST 2006 | CK the Flip
It probably depends on the Silver content. We are also using Sn62Pb36Ag2. The paste manufacturer told us that the reason for the small silver content was so that it could wet better to the lead-free component and board finishes bearing silver.
Electronics Forum | Tue Nov 21 09:46:19 EST 2006 | jax
I assume you are talking about Sn62Pb36Ag2 solder. You should not see any added concerns when subjecting Sn62 to multiple reflow cycles as compared to Sn63. As compared to Sn63Pb37: Reduced leaching issues Increased Wetting due to lo
Electronics Forum | Tue Jan 23 17:21:30 EST 2007 | russ
Which characteristics? Russ
Electronics Forum | Tue Jan 23 16:22:01 EST 2007 | asir
I'm looking for a PbF solder paste with similar characteristic as the 63/37Pb alloy. What alloy composition would you recommend?
Electronics Forum | Tue Jan 23 17:16:07 EST 2007 | darby
Check out the web sites of the major solder manufacturers. From a quick glance most of the pastes around that temperature range have problems with Zn content and may not be available as pastes???? Depending on your application, some of the lower melt
Electronics Forum | Tue Jan 23 16:28:14 EST 2007 | Jim
If by any chance you happen to find one, please let me know.
Electronics Forum | Tue Jan 23 16:53:45 EST 2007 | patrickbruneel
Can not be done without drastic alterations to the laws of physics Patrick
