Partner Websites: .275-.500 (164)

Case study: How to Create a Reflow Profile for a 16-layer, 2mm Thickness PCB with a High Density SMT

| http://etasmt.com/cc?ID=te_news_industry,23961&url=_print

High Speed High Density Open Pin Field Array, has up to 500 I/O contact pins with a solder charge termination. This type of connector looks like a standard BGA type of SMT device

Unisoft XML export definitions specifications | Unisoft

| https://unisoft-cim.com/exports_xml-definition.html

="1519" y1="869" x2="1119" y2="931"/> 500" y="-500" rotation="0" devicetype="SMD" partno="MOIRE" layer="BOTTOM">


.275-.500 searches for Companies, Equipment, Machines, Suppliers & Information

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