Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


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994 SMT / PCB Assembly Related Technical Articles

Electronics X-Ray inspection

Apr 19, 2019 | Joy Rong +8618779975930

Electronics X-Ray inspection Tianjin Min Woo Electronics Co.,Ltd. Is located in 28R4+22 Jinnan, Tianjin, China since 2003. And specializes in the development and production of flat panel displays. Tianjin Min Woo Electronics purchased ZM X6600 for inspect their products quality. Family of Industrial X-ray inspection machine & BGA rework station Last Article: Method for detecting electronic components quickly Next Article: Formation and prevention of SMT BGA voids Hot: The Reason for BGA insufficient solder & short Maybe you still are interested in: Solder paste printing defects and solutions in SMT chip processing process Advantages of X-ray SMD counter The difference between the detection equipment AOI & X-RAY ...

Publisher: Seamark zm Tech Group

Seamark zm Tech Group

Seamark ZM PCB BGA X-ray Inspection system Equipment -14 years experience in SMT field, Our experience will provide good solutions. X-Ray Inspection, BGA reworks tation,Full auto X ray SMD component machine

Shenzhen, China, China

Inspection

The working principle of IPX9K Rain Test Chamber

Apr 18, 2019 | Climatest Symor

IPX9K Rain Spray Test Chamber(high Pressure high temperature water jet) simulates the use of pressure washer steam cleaning onto the enclosure, It is recognised as the harshest of all ingress protection tests. However the requirement is becoming more prevalent across many industries. Test method for IPX9K : Make sure the water temperature inside the water tank +80°C, water flow rate with 14L-16L per min, water pressure: 8000 Kpa -10000 Kpa (80–100 bar) at distance of 100mm~ 150mm, The test duration is 30 seconds in each of 4 angles, total spray testing time is 2 minutes. IPX9 rain test chamber applicable standards: IEC 60529 – Degrees of protection provided by enclosures (IP Code).Here is working principle in picture. ...

Publisher: Symor Instrument Co.,Ltd

Symor Instrument Co.,Ltd

Manufacturer of electronic dry cabinets,our dry cabinets includes J-STD-033 and RoHS compliant dry cabinets,such as 1%-5%RH,1%-10%RH,10%-20%RH,20%-60%RH,1%-60%RH Nitrogen cabinets.our company is ISO 9001:2015 certified.

Hefei, China

Antistatic

Reliability of ENEPIG by Sequential Thermal Cycling and Aging

Apr 17, 2019 | Reza Ghaffarian, Ph.D.

Electroless nickel electroless palladium immersion gold (ENEPIG) surface finish for printed circuit board (PCB) has now become a key surface finish that is used for both tin-lead and lead-free solder assemblies. This paper presents the reliability of land grid array (LGA) component packages with 1156 pads assembled with tin-lead solder onto PCBs with an ENEPIG finish and then subjected to thermal cycling and then isothermal aging....

Publisher: Jet Propulsion Laboratory

Jet Propulsion Laboratory

The JPL is the lead U.S. center for robotic exploration of the solar system, and conducts major programs in space-based Earth sciences and astronomy.

Pasadena, California, USA

IPC Standards Certification Center, Training Provider

What should I pay attention to when purchasing the ic shipping tubes?

Apr 15, 2019 | James tong

The choice of supplier, first of all, is to choose the products offered by suppliers in the market. Since materials that meet certain product functional requirements are not unique, there are many alternatives. There are many factors to consider when purchasing, such as product quality, supply capacity, price, delivery time, reputation, supplier strength, after-sales service and other factors, but specific to the procurement of shipping tubes, we feel the following four points need special attention:...

Publisher: Sewate Technology Co.,Ltd

Sewate Technology Co.,Ltd

Sewate professionally produce ic shipping tubes, plastic anti static ic tubes, clear plastic tubes,PVC /PS/ABS/PP/PETG plastic tubes,anti-static ic tubes and ESD packaging tube for electronic components.

Shenzhen, China

Antistatic, Component Packaging, Tape and Reel Services

x ray inspect PCB and SMT patch module JIJONQ

Apr 11, 2019 | Joy Rong +8618779975930

x ray inspect PCB and SMT patch module JIJONQ Technology Co., Ltd offer SMT & DIP manufacturing Service since 1997, Scope of Business: PCB / FPC SMT、DIP、Testing、Assembly、OEM Autotronics processing、Purchasing of material. ...

Publisher: Seamark zm Tech Group

Seamark zm Tech Group

Seamark ZM PCB BGA X-ray Inspection system Equipment -14 years experience in SMT field, Our experience will provide good solutions. X-Ray Inspection, BGA reworks tation,Full auto X ray SMD component machine

Shenzhen, China, China

Inspection

Noise Fault Detection of High Low Temperature Test Chamber(Climatic chamber)

Apr 11, 2019 | Climatest Symor

With the development of science and technology, the climatic chamber quality has been improved, and the failure rate is reduced, but there still have the failure probability.today we introduce what are the mian factors for big noise high low temperature test chamber: 1.External factors: the bottom angle is uneven, the ground is uneven, adjust the bottom angle, ensure the equipment is in a horizontal position; 2.The equipment is touched other objects or pushed against the wall,pls remove the objects and keep a certain distance from the wall. 3.Compressor noise:check whether the compressor collides with the pipeline,and evaporator dish is loose or not. 4.Check whether compressor shock absorbers are aging and replace them. 5.Solenoid valve noise: solenoid valve reversing caue loud sound, pls add damping glue, if no effect, need to replace solenoid valve. If there is AC noise, need to replace the power board. 6.Check wether the fan or the fan string shaft make noise,whether the fan blades are touched and deformed, whether the fan is fixed or not, pls adjust accordingly or add the rubber pad. If further technical questions,contact us without hesitation!---Climtest Symor® technical team...

Publisher: Symor Instrument Co.,Ltd

Symor Instrument Co.,Ltd

Manufacturer of electronic dry cabinets,our dry cabinets includes J-STD-033 and RoHS compliant dry cabinets,such as 1%-5%RH,1%-10%RH,10%-20%RH,20%-60%RH,1%-60%RH Nitrogen cabinets.our company is ISO 9001:2015 certified.

Hefei, China

Antistatic

What is the application of moisture proof dry cabinet?

Apr 11, 2019 | Climatest Symor

Are your MSD safely stored? As humidity is found to be one of the key reasons for rejected products, many manufacturers are taking measures to control the humidity to increase their production efficiency and save the cost. In the industries of semi-conductor and electronics, the key section in which the rejected products are most probably to be made is that during the heating process of SMT, the IC(e.g.,PBGA,BGA,or TQFD) is likely to crack and thus cause non-effective welding because of the humidity. Climatest Symor® auto dry cabinet is the best solution to avoid the cracking and noneffective welding by dehumidifying the surface of your components. The dry unit can be used for 20 years without replacement,and controller is calibration free within 5 years.We attach dry cabinet application with different humidity range,welcome to download....

Publisher: Symor Instrument Co.,Ltd

Symor Instrument Co.,Ltd

Manufacturer of electronic dry cabinets,our dry cabinets includes J-STD-033 and RoHS compliant dry cabinets,such as 1%-5%RH,1%-10%RH,10%-20%RH,20%-60%RH,1%-60%RH Nitrogen cabinets.our company is ISO 9001:2015 certified.

Hefei, China

Antistatic

Soldering Immersion Tin

Apr 10, 2019 | Rick Nichols, Sandra Heinemann

The stimulating impact of the automotive industry has sharpened focus on immersion tin (i-Sn) more than ever before. Immersion tin with its associated attributes, is well placed to fulfill the requirements of such a demanding application. In an environment dominated by reliability, the automotive market not only has very stringent specifications but also demands thorough qualification protocols. Qualification is ultimately a costly exercise. The good news is that i-Sn is already qualified by many tier one OSATs.

The focus of this paper is to generate awareness of the key factors attributed to soldering i-Sn. Immersion tin is not suitable for wire bonding but ultimately suited for multiple soldering applications. The dominant topics of this paper will be IMC formations in relation to reflow cycles and the associated solderability performance. Under contamination free conditions, i-Sn can provide a solderable finish even after multiple reflow cycles. The reflow conditions employed in this paper are typical for lead free soldering environments and the i-Sn thicknesses are approximately 1 μm....

Publisher: Atotech

Atotech

One of the world's leading suppliers of integrated production systems, chemistry, equipment, know-how and service for electroplating, semiconductor and printed circuit board manufacturing.

Berlin, Germany

Manufacturer of Assembly Material, Manufacturer of Components, Components/Substrates

Symor ESD storage dry cabinet(Working principle)

Apr 08, 2019 | Climatest Symor

Climatest Symor® adopts molecular sieve to dry air, the whole system is controlled by microcomputer, when humidity is high, It will start to absorb moisture,when the humidity reach the pre-set value, it will stop absorbing, and then discharge the water to outside the cabinet by heating,again and again by automatic control. The most effective and environment-friendly moisture-absorbing desiccant is molecular sieve, molecular sieve is the microporous crystal material synthesized by silicon and aluminium oxide. In order to keep the crystal net discharge to be zero, atoms with cations are located in the crystal structure.and the cation used in these synthetic crystals is usually sodium. At present, there are two kinds of molecular sieves widely used in the dry box industry: Class A and Class X. Molecular sieves are synthesized, shaped and activated under strictly controlled production processes. The whole controlled sythesis process can ensure consistency of the three-dimensional pore size. 3A molecular sieve pore size is 3 angstroms, 4A molecular sieve pore size is 4 angstroms; 13X molecular sieve pore size is 8.5 angstroms. The working principle of molecular sieve: Molecular sieves adsorb molecules onto the crystal surface by physical attraction force. Since 95% surface area of the molecular sieve is within aperture,it needs to screen the adjacent molecules by different size. Only small size molecules can enter into the inner adsorption surface of the molecular sieve through the crystal aperture. This selective adsorption phenomenon is called molecular sieve effect. The molecular sieve adsorption capacity and charge density (polarity) are further related to the adsorbed molecules. The molecular sieves can further distinguish which of the mixed molecules can be adsorbed and determine to what extent the charge density can allow the molecules to be adsorbed onto the crystal. Water molecules are particularly small (2.6 angstroms), that belong to highly polar molecules (very strong positive and negative electron density), and are easily adsorbed by molecular sieves, even under very low moisture condition,once the water molecules are adsorbed,they will be firmly fixed on the crystal. The environment-friendly moisture absorption device is equipped with molecular sieve. When it’s absorbing, the memory alloy controller is in tensile state, and the spring is in contractive state,which just make the valve contact the outer baffle, this insulates the outside air from inside dry box air to achieve dehumidification purpose; and after molecular sieve absorbed moisture inside dry box and become saturated, the program will automatically control the memory alloy device to shrink it so that the valve reaches the inner baffle position. Meanwhile, due to the shrinkage of the memory alloy, the spring is stretched and the valve is pulled out of the outer baffle,so that the moisture in molecular sieve will be discharged into the outside. after the dehumidifying process finished, the program automatically control and reset the memory alloy and spring,to restart absorbing status....

Publisher: Symor Instrument Co.,Ltd

Symor Instrument Co.,Ltd

Manufacturer of electronic dry cabinets,our dry cabinets includes J-STD-033 and RoHS compliant dry cabinets,such as 1%-5%RH,1%-10%RH,10%-20%RH,20%-60%RH,1%-60%RH Nitrogen cabinets.our company is ISO 9001:2015 certified.

Hefei, China

Antistatic

Ingress Protection (IP) test for electronic enclosure test

Apr 07, 2019 | Climatest Symor

Ingress Protection Test Chamber is used to determine the protection degree of product enclosures,the protection level provided by the enclosure is called IP code,our IP test chamber compeletely follow the standard IEC60529 and others. IP protection grade is an important index of electrical equipment safety protection. Protective-grade systems such as ip, which provide a method of classifying products in terms of dust-proof, waterproof and anti-collision levels of electrical equipment and packaging, which have been recognized by most European countries, as drafted by the International Electrotechnical Association (iec (international electro technical commission). And announced in ied529 (bs en 60529 / 1992) outer packing protection grade (ip code). The level of protection is expressed in terms of IP followed by two numbers, which are used to define the level of protection. The first number indicates the extent of the equipment‘s resistance to dust, or the degree to which people are protected from harm in sealed environments. I represents a level that prevents solid foreign matter from entering, with a maximum level of 6; The second number indicates the extent to which the equipment is waterproof. P represents the level of protection against influent and the highest level is 8. Such as the protection level of the motor ip65. Contact electrical equipment protection and external material protection level (first digit) Electrical equipment waterproof protection level (second digit) . IP is the international code used to identify the protection grade ip grade consists of two numbers, the first number for dust, and the second number for waterproof, the larger the number means the better protection level. ...

Publisher: Symor Instrument Co.,Ltd

Symor Instrument Co.,Ltd

Manufacturer of electronic dry cabinets,our dry cabinets includes J-STD-033 and RoHS compliant dry cabinets,such as 1%-5%RH,1%-10%RH,10%-20%RH,20%-60%RH,1%-60%RH Nitrogen cabinets.our company is ISO 9001:2015 certified.

Hefei, China

Antistatic

How to protect your PCB from moisture related damage?

Apr 07, 2019 | Climatest Symor

How to protect your PCB from moisture related damage? J-STD-033 put forward stricter regulation on the MSD exposure environment,when the exposure time exceed the tolerated,the moisture will penetrate into electronics,Moreover, the newest RoHS regulation will rise soldering temperature,the sudden high temperature will lead to expansion and cracking on electronic components. In order to decrease the moisture defect on PCB for the manufacturers in China,Climatest Symor® begin to concentrated on electronic dry cabinet R&D since early 1990s,we specialize in handling temperature and humidity for 20 years,and we provide best solution for PCB storage....

Publisher: Symor Instrument Co.,Ltd

Symor Instrument Co.,Ltd

Manufacturer of electronic dry cabinets,our dry cabinets includes J-STD-033 and RoHS compliant dry cabinets,such as 1%-5%RH,1%-10%RH,10%-20%RH,20%-60%RH,1%-60%RH Nitrogen cabinets.our company is ISO 9001:2015 certified.

Hefei, China

Antistatic

Realizing Smart Manufacturing for Electronics

Apr 04, 2019 | Siemens AG

Siemens announced today the introduction of Camstar™ Electronics Suite software, an innovative manufacturing execution system (MES) for electronics. Building on the successful enterprise-level platform for integrated circuit (IC) manufacturing, this powerful, configurable and scalable MES solution enables printed circuit board (PCB) and box assemblers to meet traceability requirements, improve efficiency levels and control manufacturing operations through direct Internet of Things (IoT) connectivity with machines and production lines....

Publisher: Siemens PLM Software

Siemens PLM Software

A leading global provider of product lifecycle management (PLM) and manufacturing operations management (MOM) software. Our Smart Innovation Portfolio helps manufacturers optimize their Digital Enterprise and realize innovation.

Plano, Texas, USA

Consultant, OEM, Software Manufacturer

TSI Mexico-X ray detects Dell computer motherboard defects

Apr 04, 2019 | Joy Rong +8618779975930

TSI Mexico use Seamark x ray www.seamarkxray.com email: sales25@zhuomao.com.cn Tel/wechat/whsatspp +861879975930 TSI Mexico-X ray detects Dell computer motherboard defects. MISIÓN Proporcionar servicios de almacenamiento, embalaje, administración de inventarios, distribución, logística, remozamiento, reparación y mantenimiento de equipos electrónicos en alto volumen, de alta tecnología a nivel componente; ofreciendo oportunidad, calidad, y precio. VISIÓN Ser líder a nivel nacional e internacional ofreciendo soluciones integrales e innovadoras que nos permitan satisfacer las necesidades de los clientes y socios estratégicos cumpliendo y excediendo consistentemente sus expectativas. MISSION Provide storage services, packaging, inventory management, distribution, logistics, refurbishment, repair and maintenance of electronic equipment in high volume, high-tech component; offering opportunity, quality, and price. VISION To be a national and international leader offering integral and innovative solutions that allow us to satisfy the needs of our clients and strategic partners, consistently fulfilling and exceeding their expectations. Seamark ZM Technology Group (HK,) Co.,Ltd is one of national high-tech enterprises of development, production and sales Since 2005, with its strong technical force, efficient management, perfect sales network and after-sales service. We win the trust and support of the majority, and improved ourselves by introducing and absorbing overseas advanced technology. At the same time, we would like strengthening product research and development to improve product quality, and constantly opening up the domestic market, in the global electronic, the multi-function BGA rework field & X ray inspection equipment & X-ray SMD counter & Laser TV LCD repair ect. Seamark ZM has passed ISO9001: 2000 Quality management system and ISO14001:2004, CE, environmental management system standard certification. Many thanks TSI Mexico’ trust and support! Family of Industrial X-ray inspection machine & BGA rework station Last Article: Method for detecting electronic components quickly Next Article: Formation and prevention of SMT BGA voids Hot: The Reason for BGA insufficient solder & short Maybe you still are interested in: Solder paste printing defects and solutions in SMT chip processing process Advantages of X-ray SMD counter The difference between the detection equipment AOI & X-RAY ...

Publisher: Seamark zm Tech Group

Seamark zm Tech Group

Seamark ZM PCB BGA X-ray Inspection system Equipment -14 years experience in SMT field, Our experience will provide good solutions. X-Ray Inspection, BGA reworks tation,Full auto X ray SMD component machine

Shenzhen, China, China

Inspection

Database Driven Multi Media Work Instructions

Mar 25, 2019 | Tommy Fox

Work instructions are time consuming to generate for engineers, often requiring regeneration from scratch to address very minor changes. They need to be produced in varying levels of detail, with varying guidelines, for multiple stations, operators and lines. Minor component, station or process changes – down to the modification of an individual BOM component – can cause headaches when attempting to maintain consistency across multiple work instructions that are touched by the change.

The solution presented here improves efficiency and saves engineering time by making use of a database driven approach. Manufacturing details, component information, process guidelines, annotations, machine-specific data, and more can be stored in one central database. Any information stored in this single repository can then be modified quickly in one location and automatically propagate seamlessly throughout multiple work instructions. These can be instantly printed out or displayed on screens at appropriately affected stations with the simple click of a button, as opposed to regenerating from scratch, or going in and reviewing many documents to find and update with the change....

Publisher: Optimal Electronics Corporation

Optimal Electronics Corporation

A global provider of innovative manufacturing execution system (MES) solutions for the electronics assembly industry.

Austin, Texas, USA

Software Manufacturer

Persang Alloy Industries X ray 6600 for PCB

Mar 21, 2019 | Joy Rong +8618779975930

Persang Alloy Industries X ray 6600 for PCB Persang Alloy Industries Pvt. Ltd. (PAI) is one of India’s largest manufacturers / exporter of solders, soldering chemicals and alloys. Based in Vadodara, Customers include Sony, HP, Siemens, Asus, Foxconn and so on, with high recognition since 1989. PAI manufactures a wide variety of solders, lead free alloys and fluxes in various forms which perform critical tasks in the electronic, electrical and automobile industries. Persang Alloy Industries X ray 6600 The most common problem with solder paste/solder is the inclusion of impurities, which is very detrimental to the soldering effect. This is a special concern for solder paste manufacturers. The solder paste contains impurities, which will not only affect the soldering effect but also affect the customer’s experience with the product. Thanks to the manufacturer – PAI for being responsible for products quality, let us experience good product quality. Family of Industrial X-ray inspection machine & BGA rework station Last Article: Method for detecting electronic components quickly Next Article: Formation and prevention of SMT BGA voids Hot: The Reason for BGA insufficient solder & short Maybe you still are interested in: Solder paste printing defects and solutions in SMT chip processing process Advantages of X-ray SMD counter The difference between the detection equipment AOI & X-RAY ...

Publisher: Seamark zm Tech Group

Seamark zm Tech Group

Seamark ZM PCB BGA X-ray Inspection system Equipment -14 years experience in SMT field, Our experience will provide good solutions. X-Ray Inspection, BGA reworks tation,Full auto X ray SMD component machine

Shenzhen, China, China

Inspection

Embracing a New Paradigm: Electronic Work Instructions (EWI)

Mar 15, 2019 | Jeffrey Rupert, Travis Loving

While there have been quite dramatic and evident improvements in almost every facet of manufacturing over the last several decades owing to the advent and mass adoption of computer automation and networking, there is one aspect of production that remains stubbornly unaffected. Massive databases track everything from orders, to inventory, to personnel. CAD systems allow for interactive and dynamic 3D rendering and testing, digital troubleshooting, and simulation and analysis prior to mass production. Yet, with all of this computational power and all of this networking capability, one element of production has remained thoroughly and firmly planted in the past. Nearly all manufacturing or assembly procedures are created, deployed, and stored using methodologies derived from a set of assumptions that ceased to be relevant fifty years ago. This set of assumptions, referred to below as the “Paper Paradigm” has been, and continues as the dominant paradigm for manufacturing procedures to this day. It is time for a new paradigm, one that accounts for the vastly different technological landscape of this era, one that provides a simple, efficient interface, deep traceability, and dynamic response to rapidly changing economic forces.

This paper seeks to present an alternative. Instead of enhancing and improving on systems that became irrelevant with the invention of a database, instead of propping up an outdated, outmoded and inefficient system with incremental improvements; rewrite the paradigm. Change the underlying assertions to more accurately reflect our current technological capability. Instead of relying on evolutionary improvements, it is time for a revolution in manufacturing instructions....

Publisher: ScanCAD International, Inc.

ScanCAD International, Inc.

Global provider of Legacy PCB Re-Engineering Systems & Process Control Tools since 1990.

Conifer, Colorado, USA

Other, Assembly, Drilling/Routing, Inspection, Software Manufacturer

An Investigation Into The Durability Of Stencil Coating Technologies

Mar 13, 2019 | Greg Smith, Tony Lentz

It is well documented that Nano coatings on SMT stencils offer many benefits to those assembling PWBs. With reduced standard deviation and improved transfer efficiency nano coatings can provide, there is also a cost. As PWB assemblers work to justify the return on investment, one key question continues to arise. What is the durability or life of these coatings and what can be done in the print process to maximize the life of the coatings?

This paper addresses durability of the coatings in relation to the number of print cycles and underside wipe cycles applied as well as materials used on the underside wipe process. Different parameters will be applied and data will be collected. The results of this study will be summarized to help those using or considering the use of these nano coatings to improve their print process and suggestions will be given to maximize the life of the coatings....

Publisher: FCT ASSEMBLY, INC.

FCT ASSEMBLY, INC.

With numerous facilities in the United States, we are one of the electronics industry's leading manufacturers of lead-free solder products, superior quality stencils, and precision cut parts.

Greeley, Colorado, USA

Manufacturer of Assembly Material, Soldering

Methods for detecting electronic components quickly

Mar 12, 2019 | Joy Rong +8618779975930

Method for detecting electronic components quickly www.seamarkxray.com Contact:Joy Tel/WhatsApp/wechat:+86 18779975930 X-ray is a kind of light with super penetrating power, which can directly penetrate the appearance of the product and directly reach the internal structure of the product. It can play a very important role in the identification of the internal structure of the product. At present, high imitation products are endless, many high Imitation products have similar appearance, but the internal structure design is different, especially the precision products, it is impossible to disassemble at will, so only the advanced technical means can be used to distinguish the product details. Now, the non-destructive testing ( NDT ) method has X-ray inspection machine and ultrasonic detection, magnetic particle testing, NDT x ray detection are as follows: For example, the internal structure of several electronic components is different: Terminal 3D detection: IC chip detection: The chip to be tested and the genuine chip are compared under the X-ray inspection machine. As can be seen from the figure, the internal structure of the chip under X-ray detection is quite different....

Publisher: Seamark zm Tech Group

Seamark zm Tech Group

Seamark ZM PCB BGA X-ray Inspection system Equipment -14 years experience in SMT field, Our experience will provide good solutions. X-Ray Inspection, BGA reworks tation,Full auto X ray SMD component machine

Shenzhen, China, China

Inspection

Compared with manual SMD counter machine, Advantages of X-ray SMD counter

Mar 08, 2019 | Joy Rong +8618779975930

Compared with manual SMD counter machine, Advantages of X-ray SMD counter I believe that many companies have experienced the mid-year inventory and year-end inventory. For electronic companies, the statistics of electronic components are very time-consuming, scattered small components, making the inventory of personnel time-consuming and laborious, seriously affecting the quality of work. And the efficiency of the enterprise, the X-RAY spot machine can solve these problems very well. Advantages of X-ray SMD counter: 1.No need to disassemble the package, component reel raw materials directly into the warehouse, directly inventory 2. It can better maintain the integrity of the product without affecting the moisture and pollution of the product. 3. Reduce inventory staff. It can directly arrange one or two Staff to operate the X-ray spotting machine to increase the counting speed and achieve higher efficiency; The inventory data can be directly uploaded to the enterprise ERP system, which is very helpful for all departments of the enterprise to understand the quantity of the products, especially the production-related operators. Family of Industrial X-ray inspection machine & BGA rework station Last Article: SMT BGA solder ball inspection method Next Article: Formation and prevention of SMT BGA voids Hot: The Reason for BGA insufficient solder & short Maybe you still are interested in: Solder paste printing defects and solutions in SMT chip processing process Highest Quality levels Tool X-ray for industries-SMT/batteries/ceramic/Electronic /semiconductor; The difference between the detection equipment AOI & X-RAY ...

Publisher: Seamark zm Tech Group

Seamark zm Tech Group

Seamark ZM PCB BGA X-ray Inspection system Equipment -14 years experience in SMT field, Our experience will provide good solutions. X-Ray Inspection, BGA reworks tation,Full auto X ray SMD component machine

Shenzhen, China, China

Inspection

Effect of Encapsulation Materials on Tensile Stress during Thermo-Mechanical Cycling of Pb-Free Solder Joints

Mar 06, 2019 | Maxim Serebreni, Dr. Nathan Blattau, Dr. Gilad Sharon, Dr. Craig Hillman

Electronic assemblies use a large variety of polymer materials with different mechanical and thermal properties to provide protection in harsh usage environments. However, variability in the mechanical properties such as the coefficient of thermal expansion and elastic modulus effects the material selection process by introducing uncertainty to the long term impacts on the reliability of the electronics. Typically, the main reliability issue is solder joint fatigue which accounts for a large amount of failures in electronic components. Therefore, it is necessary to understand the effect of polymer encapsulations (coatings, pottings and underfills) on the solder joints when predicting reliability.

This paper presents the construction and validation of a thermo-mechanical tensile fatigue specimen. The thermal cycling range was matched with potting expansion properties in order to vary the magnitude of tensile stress imposed on solder joints...

Publisher: DfR Solutions

DfR Solutions

DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry.

College Park, Maryland, USA

Service Provider

Evaluation, Selection and Qualification of Replacement Reworkable Underfill Materials

Feb 27, 2019 | Jeffrey Colish, Luis Lopez, Carlo Viola

A study was performed to investigate, evaluate and qualify new reworkable underfill materials to be used primarily with ball grid arrays (BGAs), Leadless SMT devices, QFNs, connectors and passive devices to improve reliability. The supplier of the sole source, currently used underfill, has indicated they may discontinue its manufacture in the near future. The current underfill material is used on numerous circuit card assemblies (CCAs) at several sites and across multiple programs/business areas. In addition, it is used by several of our contract CCA suppliers.

The study objectives include evaluation of material properties for down select, dispensability and rework evaluation for further down select, accelerated life testing for final selection and qualification; and process development to implement into production and at our CCA suppliers. The paper will describe the approach used, material property test results and general findings relative to process characteristics and rework ability....

Publisher: Northrop Grumman Corporation

Northrop Grumman Corporation

Northrop Grumman is a global aerospace and defense technology company providing innovative systems, products and solutions to government and commercial customers.

Blacksburg, Virginia, USA

Other

The Influence of Clean Air on the Value-Added Chain in Electronics Production

Feb 25, 2019 | ULT

“The idea of the value chain is based on the process view of organizations, the idea of seeing a manufacturing (or service) organization as a system, made up of subsystems each with inputs, transformation processes and outputs”.[1] The definition of a value-added chain by Michael E. Porter is one of many to be found in reference books, works and on websites. In principle, it involves a sequence of activities, executed by a manufacturing company to develop, produce, sell, ship, and maintain products or services. Three main parameters essentially influence a value-added chain: Direct activities − research, development, production, shipment etc. Indirect activities − maintenance, operation, occupational safety, environment etc. Quality assurance − monitoring, test/inspection; quality management etc. In particular, indirect activities and quality assurance generate a greater part of the costs in product manufacturing. This article principally focusses on the indirect activities, among them air purification....

Publisher: ULT LLC

ULT LLC

ULT is a vendor of fume extraction solutions for air purification. The company's systems are utilized for the removal of laser fumes, soldering fumes, odors, vapors, gases, dusts etc. in electronics production.

Mequon, Wisconsin, USA

Cleaning, Environmental Resources, OEM

The Impact of New Generation Chemical Treatment Systems on High Frequency Signal Integrity

Feb 20, 2019 | Jim Fuller, Sanmina-SCI; Karl Sauter, Oracle Corporation; Scott Hinaga, Cisco; Tian Qingshan, Huawei; John J Davignon, HDP User Group; Brian Butler, Introbotix; Ted Antonellis, Michael Coll, John Marshall, John Marshall, MacDermid Enthone; Joseph Smetana,

The High Density Packaging (HDP) User Group has completed a project evaluating the high frequency loss impacts of a variety of imaged core surface treatments (bond enhancement treatments, including chemical bonding and newer low etch alternative oxides) applied just prior to press lamination. Initial high frequency Dk/Df electrical test results did not show a strong correlation with any of the methods utilized within this project to measured surface roughness. The more significant factor affecting the measured loss is the choice of pre-lamination surface treatment. Most of the new chemical treatment systems outperform the older existing systems which depend upon surface roughness techniques to promote adhesion....

Publisher: Sanmina-SCI

Sanmina-SCI

Sanmina-SCI is a tier 1 provider of EMS and PWB along with vertically integrated capabilities from design through qualification.

San Jose, California, USA

Influence of Copper Conductor Surface Treatment for High Frequency PCB on Electrical Properties and Reliability

Feb 13, 2019 | Seiya Kido, Tsuyoshi Amatani

Development of information and telecommunications network is outstanding in recent years, and it is required for the related equipment such as communication base stations, servers and routers, to process huge amount of data in no time. As an electrical signal becomes faster and faster, how to prevent signal delay by transmission loss is a big issue for Printed Circuit Boards (PCB) loaded on such equipments. There are two main factors as the cause of transmission loss; dielectric loss and conductor loss. To decrease the dielectric loss, materials having low dielectric constant and low loss tangent have been developed. On the other hand, reducing the surface roughness of the copper foil itself to be used or minimizing the surface roughness by modifying surface treatment process of the conductor patterns before lamination is considered to be effective in order to decrease the conductor loss. However, there is a possibility that reduction in the surface roughness of the conductor patterns will lead to the decrease in adhesion of conductor patterns to dielectric resin and result in the deterioration of reliability of PCB itself.

In this paper, we will show the evaluation results of adhesion performance and electrical properties using certain type of dielectric material for high frequency PCB, several types of copper foil and several surface treatment processes of the conductor patterns. Moreover, we will indicate a technique from the aspect of surface treatment process in order to ensure reliability and, at the same time, to prevent signal delay at the signal frequency over 20 GHz. ...

Publisher: MEC Company Ltd.

MEC Company Ltd.

R&D, production and sales of chemicals, equipment and related materials used in the production of PCB

Hyogo, Japan

Manufacturer of Assembly Material

Anti static IC shipping tube customization guidelines

Feb 07, 2019 | James tong

Antistatic plastic IC shipping tube customization, need to provide the following four aspects of information: First, the choice of pipe material; Second, the size of the parts or physical; Third, the length of the pipe; Fourth, the choice of plug....

Publisher: Sewate Technology Co.,Ltd

Sewate Technology Co.,Ltd

Sewate professionally produce ic shipping tubes, plastic anti static ic tubes, clear plastic tubes,PVC /PS/ABS/PP/PETG plastic tubes,anti-static ic tubes and ESD packaging tube for electronic components.

Shenzhen, China

Antistatic, Component Packaging, Tape and Reel Services

High Frequency Dk and Df Test Methods Comparison High Density Packaging User Group (HDP) Project

Feb 06, 2019 | Karl Sauter

The High Density Packaging (HDP) user group has completed a project to evaluate the majority of viable Dk (Dielectric Constant)/Df (Dissipation Factor) and delay/loss electrical test methods, with a focus on the methods used for speeds above 2 GHz. A comparison of test methods from 1 to 2 GHz through to higher test frequencies was desired, testing a variety of laminate materials (standard volume production with UL approval, low loss, and "halogen-free" laminate materials). Variations in the test board material resin content/construction and copper foil surface roughness/type were minimized. Problems with Dk/Df and loss test methods and discrepancies in results are identified, as well as possible correlations or relationships among these higher speed test methods....

Publisher: Oracle Corporation

Oracle Corporation

Oracle Corporation is an American multinational computer technology corporation specializing primarily in developing and marketing database software and technology, cloud engineered systems, and enterprise software products.

Redwood Shores, California, USA

Software Manufacturer

Adapting Wave Soldering to High-Flexibility Manufacturing

Feb 05, 2019 | Bennett Bruntil, VP, Sono-Tek Corp

SonoFlux Servo with InSight automated board recognition system helps PCB manufacturers take steps toward greater automation and traceability and the goal of Industry 4.0....

Publisher: SONO-TEK CORPORATION

SONO-TEK CORPORATION

Manufacturer of precision ultrasonic spraying systems for a myriad of applications. Our patented technologies produce micron size uniform droplets, creating ultra thin layers onto any size or shape substrate.

Milton, New York, USA

Manufacturer of Assembly Equipment

Novel Pogo-Pin Socket Design for Automated Low Signal Linearity Testing of CT Detector Sensor

Jan 30, 2019 | Mahesh Narayanaswamy

Due to the arrayed nature of the Computed Tomography (CT) Detector, high density area array interconnect solutions are critical to the functionality of the CT detector module. Specifically, the detector module sensor element, hereby known as the Multi-chip module (MCM), has a 544 position BGA area array pattern that requires precise test stimulation. A novel pogo-pin block array and corresponding motorized test socket has been designed to stimulate the MCM and acquire full functional test data. (...) This paper and presentation will focus on the socket design challenges and also key learnings from the design that can be applied to general test systems, including reliability testing. The secondary focus will be on the overall data collection and graphical user interface for the test equipment....

Publisher: General Electric

General Electric

What makes GE great? According to a survey in FORTUNE magazine, GE is the most admired company in the world. We have great products and great processes, but most importantly, we have great people! To View Our Current Job Openings Please Visit Our Web

SCHENECTADY, New York, USA

Manufacturer of Components, Manufacturer of Assembled PCBs, Other, Recruiter / Employment Company

AOI Capabilities Study with 03015 Component

Jan 23, 2019 | David Geiger, Vincent Nguyen, Hung Le, Stephen Chen, Robert Pennings, Christian Biederman, Zhen (Jane) Feng, Ph. D., Alan Chau, Weifeng Liu, Ph. D., William Uy, Anwar Mohammed, Mike Doiron

Automated Optical Inspection (AOI) is advantageous in that it enables defects to be detected early in the manufacturing process, reducing the Cost of Repair as the AOI systems identify the specific components that are failing removing the need for any additional test troubleshooting1-3. Because of this, more Electronic Contract Manufacturing Services (EMS) companies are implementing AOI into their SMT lines to minimize repair costs and maintain good process and product quality, especially for new component types. This project focuses on the testing of component package 03015 which is challenging for AOI....

Publisher: Flex (Flextronics International)

Flex (Flextronics International)

Flextronics is a global full-service supplier of a full spectrum of value-added Electronic Manufacturing Services.

Singapore, Singapore

Design, Service Provider

Introduction to the manufacturing process of anti static ic tubes

Jan 20, 2019 | James tong

With the rapid development of the electronics industry, more and more components such as integrated circuits and connectors, relays, power modules, etc. need to be packaged with IC tubes. The anti static ic tubes is actually a kind of pvc plastic(reference to : What are the materials for IC tubes) profile, the size varies with the shape of the installed product, the precision requirement is high, the wall thickness should be controlled within ±0.1mm, and the surface is required to have no impurity spots, smooth and transparent. The IC packaging tubes produced by Sewate Technology Co., Ltd. are extruded. The typical process flow is: extrusion, vacuum adsorption setting, traction, fixed length cutting and directional discharge, deburring, immersion antistatic liquid, drying, testing, packaging and storage ...

Publisher: Sewate Technology Co.,Ltd

Sewate Technology Co.,Ltd

Sewate professionally produce ic shipping tubes, plastic anti static ic tubes, clear plastic tubes,PVC /PS/ABS/PP/PETG plastic tubes,anti-static ic tubes and ESD packaging tube for electronic components.

Shenzhen, China

Antistatic, Component Packaging, Tape and Reel Services

Optical Bonding

Jan 10, 2019 | Scheugenpflug

We notice that the quantities of material that are to be dosed are becoming more and more divergent. In addition to large media volumes, small and very small quantities are also increasingly coming into focus. For example autonomous driving: These vehicles already produce an immense amount of data today. When potting the associated sensors, cameras, and ECUs, it is important to ensure a precise and repeatable media application – even with volumes of only 0.03 ml. In contrast, when high-voltage batteries for electric cars are potted, 5 to 10 litres of heat-conducting paste are required per vehicle – and the trend is rising. Optical bonding used in display production, on the other hand, is in the medium volume range. The challenge now is to cover the entire volume spectrum reliably and in compliance with the required cycle times. This is remedied by a modular system of scalable modules, which offers the customer the necessary flexibility and enables him to plan a system according to his needs....

Publisher: Scheugenpflug Inc.

Scheugenpflug Inc.

Specializes in automated metering & dispensing solutions, supplier of resin metering systems, global expert in production and process automation, vacuum dispensing production systems, and systems for dispensing of abrasive media.

Kennesaw, Georgia, USA

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Assembly

Bad Block Management in SSD

Jan 10, 2019 | Miya

Why do large number of bad blocks generate when SSDs close their lifespan? What's impact on SSDs nomral usage? And how does SSD manage the bad blocks? Just let's take a look at the bad block management in SSDs....

Publisher: Renice Technology Co., Ltd

Renice Technology Co., Ltd

RENICE SSDs line vary on form factor, interface, MLC or SLC NAND, industrial temperature and with or without Secure erase/ Power-failure protection, AES Encryption, Write-protect function.Your best partner on storage devices.

Shenzhen, China

Manufacturer of Components

An Investigation into Lead-Free Low Silver Cored Solder Wire for Electronics Manufacturing Applications

Jan 09, 2019 | Shantanu Joshi, Jasbir Bath, Kimiaki Mori, Kazuhiro Yukikata, Roberto Garcia, Takeshi Shirai

The electronics industry has widely adopted Sn-3.0Ag-0.5Cu solder alloys for lead-free reflow soldering applications and tin-copper based alloys for wave soldering applications. In automated soldering or rework operations, users may work with Sn-Ag-Cu or Sn-Cu based alloys. One of the challenges with these types of lead-free alloys for automated / hand soldering operations, is that the life of the soldering iron tips will shorten drastically using lead-free solders with an increased cost of soldering iron tool maintenance/ tip replacement. Development was done on a new lead-free low silver solder rework alloy (Sn-0.3Ag-0.7Cu-0.04Co) in comparison with a number of alternative lead-free alloys including Sn-0.3Ag-0.7Cu, Sn-0.7Cu and Sn-3.0Ag-0.5Cu and tin-lead Sn40Pb solder in soldering evaluations....

Publisher: Koki Company LTD

Koki Company LTD

Suppliers of solder pastes, wave soldering liquid fluxes and SMT adhesives and cored solder wires for all soldering requirements.

Tokyo , Japan

Manufacturer of Assembly Material, Adhesives/Dispensing, Soldering

What are the materials for plastic anti static ic tubes?

Jan 08, 2019 | James tong

Plastic ic tubes can be made of plastics of various materials such as PVC, PS, PET, PC, ABS, etc. The shipping tubes of different materials will have different performances. The characteristics of various materials and their packaging tubes are described in detail below;...

Publisher: Sewate Technology Co.,Ltd

Sewate Technology Co.,Ltd

Sewate professionally produce ic shipping tubes, plastic anti static ic tubes, clear plastic tubes,PVC /PS/ABS/PP/PETG plastic tubes,anti-static ic tubes and ESD packaging tube for electronic components.

Shenzhen, China

Antistatic, Component Packaging, Tape and Reel Services

Casting NDT inspection

Jan 07, 2019 | Joy Rong +8618779975930

Casting NDT inspection Original: Casting NDT inspection Casting refers to the casting of metal. In the process of manufacturing, due to the gas generated during the cold casting and forging process, many small pores are easily caused in the casting, which has a certain influence on the overall tightness of the casting. Casting NDT inspection method: There are problems with castings. If some problems are more serious, the quality defects of the products will be increased. Generally, non-destructive testing equipment is used in the market to detect the quality of castings, such as X-RAY, ultrasonic, etc. Loose casting: During the solidification process of the casting, due to solidification shrinkage or the presence of gas, the castings produce voids, resulting in insufficient tightness of the casting; Impurities: Castings are mixed with other fine particles, foreign matter, etc., affecting product quality; Internal defects: After the castings are manufactured, the process technology lags behind, causing defects such as bubbles, cracks and delamination of the castings; Small defects won’t affect the normal use of the product, but for the precision of scientific research, the product’ quality is very important, in order to ensure the quality of the casting, X-RAY inspection equipment, ultrasonic non-destructive testing can be used to test the casting. Family of Industrial X-ray inspection machine & BGA rework station Last Article: SMT BGA solder ball inspection method Next Article: Formation and prevention of SMT BGA voids Hot: The Reason for BGA insufficient solder & short Maybe you still are interested in: Solder paste printing defects and solutions in SMT chip processing process Highest Quality levels Tool X-ray for industries-SMT/batteries/ceramic/Electronic /semiconductor; The difference between the detection equipment AOI & X-RAY ...

Publisher: Seamark zm Tech Group

Seamark zm Tech Group

Seamark ZM PCB BGA X-ray Inspection system Equipment -14 years experience in SMT field, Our experience will provide good solutions. X-Ray Inspection, BGA reworks tation,Full auto X ray SMD component machine

Shenzhen, China, China

Inspection

How to identify quality IC Shipping Tube guide

Jan 03, 2019 | James tong

With the increase of labor costs, the popularity of automated production lines, • Antistatic ic tubes, connector shipping tubes, power module shipping tubes, LED shipping tubes, relay shipping tubes and other electronic components tubes are also becoming more widely used. Many small companies blindly pursue low-priced packaging materials, and there is no requirement for quality. When it is later discovered that the parts are stuck in the packaging process, they will regret it when they crush the parts during transportation. Shenzhen Sewate Technology Co., Ltd. tells you about six ways to identify quality packaging tubes....

Publisher: Sewate Technology Co.,Ltd

Sewate Technology Co.,Ltd

Sewate professionally produce ic shipping tubes, plastic anti static ic tubes, clear plastic tubes,PVC /PS/ABS/PP/PETG plastic tubes,anti-static ic tubes and ESD packaging tube for electronic components.

Shenzhen, China

Antistatic, Component Packaging, Tape and Reel Services

Risk Mitigation in Hand Soldering

Jan 02, 2019 | Robert Roush

Failed solder joints remain a constant source of printed circuit board failure. Soldering is the bonding of metallic surfaces via an intermetallic compound (IMC). The interaction between thermal energy delivery, flux chemistry, and solder chemistry creates the solder bond or joint. Today, reliability relies on visual inspection; operator experience and skill, control of influencers e.g. tip geometry, tip temperature, and collection and analysis of process data. Each factor involved with the formation of the solder joint is an element of risk and can affect either throughput or repeatability. Mitigating this risk in hand soldering requires the identification of these factors and a means to address them....

Publisher: Metcal

Metcal

Manufacturer of high-performance precision rework systems for the electronics bench. Product lines include: Hand Soldering and Desoldering, Convection Rework products, Fume Extraction and Fluid Dispensing tools.

Cypress, California, USA

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Repair/Rework, Soldering

Jetting of Isotropic Conductive Adhesives with Silver Coated Polymer Particles

Dec 26, 2018 | Gustaf Mårtensson

The development of novel interconnection materials for production of electronics is of considerable interest to fulfill increasing demands on interconnect reliability in increasingly demanding environments with respect to temperature extremes, mechanical stresses and/or production limitations. Adhesives are playing an increasingly significant role in the continuously evolving electronics industry. (...)

Specific applications will be presented that highlight the feasibility of the technology with respect to conductivity, structural reliability and lifetime standards. The deposition of the novel ICA has been performed using a jet printing technology to ensure both precise and accurate positioning, size and volume delivery....

Publisher: Mycronic Technologies AB

Mycronic Technologies AB

Mycronic, formerly MYDATA, is the key manufacturer of assembly machine for electronics. Our product portfolio contains Pick&Place machines, Jet-printing machines and component storage towers.

Täby, STOCKHOLM, Sweden

Manufacturer of Assembly Equipment, Assembly, OEM

Process Optimization for Fine Feature Solder Paste Dispensing

Dec 19, 2018 | Maria Durham, Greg Wade, and Brandon Judd; Indium Corporation, John Boggiatto; ITW EAE - Speedline Technologies

With the rapid trend towards miniaturization in surface mount and MEMs lid-attach technology, it is becoming increasingly challenging to dispense solder paste in ultra-fine dot applications such as those involving chip capacitors or BGA packages, as well as dispensing ultra-fine lines in MEMs lid-attach applications. In order to achieve ultra-fine dots and fine line widths while dispensing solder paste, both the solder material and dispensing equipment need to be optimized. Optimizing the equipment can be very challenging, as there are many input variables that can affect the dispense quality of the solder paste. In this paper we will evaluate the many equipment variables involved in the solder paste dispensing process, and the impact these variables have on the dispense quality of the solder paste....

Publisher: Indium Corporation

Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, USA

Manufacturer of Assembly Material, Soldering

Why LED Lamps Are Getting Darker

Dec 17, 2018 | Joy Rong +8618779975930

The LED light source module is generally composed of a substrate, a chip, a packaging material, a lens, etc. In daily use, the long-time operation of the LED easily causes the LED to become darker and darker, and even the light fails. For this problem, D.L. Barton has done research experiments....

Publisher: Seamark zm Tech Group

Seamark zm Tech Group

Seamark ZM PCB BGA X-ray Inspection system Equipment -14 years experience in SMT field, Our experience will provide good solutions. X-Ray Inspection, BGA reworks tation,Full auto X ray SMD component machine

Shenzhen, China, China

Inspection

Assembly Reliability of TSOP/DFN PoP Stack Package

Dec 12, 2018 | Reza Ghaffarian, Ph.D.

Numerous 3D stack packaging technologies have been implemented by industry for use in microelectronics memory applications. This paper presents a reliability evaluation of a particular package-on-package (PoP) that offers a reduction in overall PCB board area requirements while allowing for increases in functionality. It utilizes standard, readily available device packaging methods in which high-density packaging is achieved by: (1) using standard "packaged" memory devices, (2) using standard 3-dimensional (3-D) interconnect assembly. The stacking approach provides a high level of functional integration in well-established and already functionally tested packages. The stack packages are built from TSOP packages with 48 leads, stacked either 2-high or 4-high, and integrated into a single dual-flat-no-lead (DFN) package....

Publisher: Jet Propulsion Laboratory

Jet Propulsion Laboratory

The JPL is the lead U.S. center for robotic exploration of the solar system, and conducts major programs in space-based Earth sciences and astronomy.

Pasadena, California, USA

IPC Standards Certification Center, Training Provider

Multilayer Ceramic Capacitors: Mitigating Rising Failure Rates

Dec 05, 2018 | Dock Brown

The multilayer ceramic capacitor (MLCC) has become a widely used electronics component both for surface mount and embedded PCB applications. The MLCC technologies have gone through a number of material and process changes such as the shift from precious metal electrode (PME) configurations which were predominantly silver/palladium to base metal electrodes (BME) dominated by nickel. Each of these changes were accompanied by both quality and reliability problems. The MLCC industry is now in the midst of an unprecedented set of challenges similar to the Moore’s Law challenges being faced by the semiconductor industry. While capacitor failures have historically been responsible for a significant percentage of product field failures (most estimates are ~30%) we are seeing disturbing developments in the low voltage (<250V) commodity part infant mortality and wearout failure rates....

Publisher: DfR Solutions

DfR Solutions

DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry.

College Park, Maryland, USA

Service Provider

Process Control of Ionic Contamination Achieving 6-Sigma Criteria in The Assembly of Electronic Circuits

Nov 29, 2018 | P. Eckold, M. Routley, L. Henneken, G. Naisbitt, R. Fritsch, U. Welzel

Ionic contamination testing as a process control tool a newly developed testing protocol based on IPC-TM 650 2.3.25, was established to enable monitoring of ionic contamination within series production. The testing procedure was successfully implemented within the production of high reliability, safety critical electronic circuits, involving multiple production sites around the world. I will be shown in this paper that the test protocol is capable for meeting Six-Sigma-Criteria....

Publisher: Robert Bosch LLC Automotive Electronics Division

Robert Bosch LLC Automotive Electronics Division

Within the Bosch-Group, the Automotive Electronics Division develops, produces, and sells microelectronic products for automotive and non-automotive applications.

Stuttgart, Germany

Other

How to choose a reliable CF Card for VDR

Nov 22, 2018 | Miya

VDR (Voyage Data Recorder) is an instrument continuously recording real-time data of ship body, including speech communication signal of cockpit, sensors data, alarm status and radar images, etc.. So what's types of storage devices may meet VDR's requirement?...

Publisher: Renice Technology Co., Ltd

Renice Technology Co., Ltd

RENICE SSDs line vary on form factor, interface, MLC or SLC NAND, industrial temperature and with or without Secure erase/ Power-failure protection, AES Encryption, Write-protect function.Your best partner on storage devices.

Shenzhen, China

Manufacturer of Components

Bead probe technology - increase ICT test coverage

Nov 21, 2018 | Joy Rong +8618779975930

Bead probe technology - increase ICT test coverage www.seamarkxray.com Bead probe technology is an exclusive patent application by Agilent (Keysight Technologies). Using existing wiring to increase ICT (In-Circuit-Test) test point coverage without additional board space, to increase printing. Test points on the board to achieve assembly ICT testing can be used for ICT testing purposes. he density of the parts on the board is getting denser and denser, but the space is getting smaller and smaller, especially the board of the mobile phone. The first thing to be sacrificed is the test point that does not have any function. Many bosses think: "Quality is manufactured, As long as the quality of the board assembly is completed, there is no need for subsequent electrical testing. Which engineer can guarantee that the product does not have a bug? The assembly plant also cannot guarantee that they have zero defects in assembling the board. Various design and assembly challenges are showing that it is difficult to abandon the traditional ICT, and only other methods (such as AOI, AXI) to ensure the quality of the PCB assembly, so more and more Many companies are starting to use ICT again, but the space on the board will get smaller and smaller only, and there is room for test points, so smart Agilent came up with this kind of trace on the existing trace. The method of printing solder paste replaces the "bead probe" method of the test point. The purpose of Agilent is of course to hope that the entire electronics industry can continue to maintain ICT operations, and purchase more of its 3070 series ICT test machine from them. The traditional ICT test method uses a pointed probe to form a loop on a circular test point. This method requires a large area of test point, and then the probe must be shot like a target. , it needs to use more board space; the bead probe technology is just reversed, it wants the test point to try not to occupy the space of the board, in order to form a loop with the probe, so the solder paste is printed, let test point becomes higher, and larger diameter flat probe (50, 75, 100 mils) is used to increase the chance of contact with the test point. In theory, this is really a big breakthrough in test points, but there are still many techniques to overcome in practice. Printing solder paste on the wiring is likely to cause poor contact between the probe and the test point due to the residual flux. For this point, a number of probe manufacturers have designed probes for use with bead probes.  (Image taken from ingun)  The printing of solder paste needs to be very precise. In particular, the lead-free solder paste cohesion is worse than tin-lead solder paste, which requires more precise solder paste printing. The high tin-printing amount determines the solder height. If the soldering height at the test point is not enough, the ICT misjudgment rate will increase. . This involves the solder paste printing process, the accuracy of the steel plate, and the tolerances of the board. If the width of the wiring is too small, it is easy to be inadvertently inferred by the probe, or other external force due to insufficient adhesion. In generally, it recommended that the minimum wiring width be more than 5 mils. It is said that some operators have successfully tested 4 mils, but as the width of the wiring is smaller, the misjudgment rate of ICT is higher. It is recommended to increase the width of the wiring and then mask it with green paint, which will be stronger.   (Image taken from ingun,These beads were pressed into the shape of the probe beads with a force of 2.0 N on the left and a force of 3.0 N on the right.) Does the use of bead probe technology affect the quality of high frequencies? According to Agilent's test report, it will not affect the performance of high frequencies. Is there a capacitive or antenna effect using the bead probe technology? According to Agilent's response, there is no such problem in the current test and customer response. What is the reliability of the bead probe technology? According to Agilent's reply, there were no problems with testing 200 cycles. In addition, Agilent strongly recommends that the factory use this bead probe technology. It is best to have a test period of more than six months, because it needs to choose solder paste, fine-tuning the opening of the steel plate, the amount of solder paste, and Adjust the type and accuracy of the ICT test probe. Therefore, in the initial experiment, it is best to have both traditional round test points and new bead test points on the board....

Publisher: Seamark zm Tech Group

Seamark zm Tech Group

Seamark ZM PCB BGA X-ray Inspection system Equipment -14 years experience in SMT field, Our experience will provide good solutions. X-Ray Inspection, BGA reworks tation,Full auto X ray SMD component machine

Shenzhen, China, China

Inspection

Understanding the Effect of Different Heating Cycles on Post-Soldering Flux Residues and the Impact on Electrical Performance

Nov 20, 2018 | Brook Sandy-Smith, Indium Corporation and Terry Munson, Foresite Inc.

There are several industry-accepted methods for determining the reliability of flux residues after assembly. The recommended methods of test sample preparation do not always closely mimic the thermal cycle experienced by an assembly. Therefore, extraction from actual assemblies has become a popular method of process control to assess consistency of post-reflow cleanliness. Every method of post-reflow flux residue characterization will depend on the reflow process followed to prepare the coupon.

This investigation will focus on the effect of thermal conditions on the remainder of active ingredients in flux residues after assembly with no-clean solder pastes....

Publisher: Indium Corporation

Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, USA

Manufacturer of Assembly Material, Soldering

Status and Outlooks of Flip Chip Technology

Nov 14, 2018 | John H. Lau

Status of flip chip technology such as wafer bumping, package substrate, flip chip assembly, and underfill will be reviewed in this study. Emphasis is placed on the latest developments of these areas in the past few years. Their future trends will also be recommended. Finally, the competition on flip chip technology will be briefly mentioned....

Publisher: ASM Pacific Technology

ASM Pacific Technology

ASMPT is a world leader in the supply of semiconductor assembly and packaging equipment and materials as well as surface mount technology solutions.

Kwai Chung, Hong Kong

Manufacturer's Rep

SMT BGA voids Formation and prevention

Nov 13, 2018 | Joy Rong

Address: 10 Building, Huaide Cuihai Industrial Park, Fuyong Street, Bao'an, Shenzhen, China Tel: +8618779975930 E-mail: Sales25@zhuomao.com.cn Written by Joy Rong More details: www.seamarkxray.com SMT BGA voids Formation and prevention News: The 2nd China Manufacturing Technology-Automation Exhibition (CMM) & the 1st China Electronics Manufacturing Resource Exhibition (CEM) was held at the Dongguan International Convention and Exhibition, such as B&P, Anda, Huancheng, Deshen Huawei, OPPO, VIVO, Xiaomi, ZTE, Foxconn, Flextronics, Lenovo and so on, More than 500 electronic manufacturing companies participated in the exhibition. In the annual feast of the field, the realization of mobile phone production automation can reduce 60% of employees? BGA voids cause current-intensive effects and reduce the mechanical strength of the solder joint. Therefore, from the perspective of reliability, the cavity should be reduced. So how can you reduce BGA voids? There are many reasons for the formation of BGA voids, such as the crystal structure of the solder joint alloy, the design of the PCB, the deposition amount of the solder paste, the reflow soldering process used, and the voids in the soldering process. Next, we will explain the formation and prevention of BGA solder joint voids from the layer of solder paste to reduce the number of BGA solder joint void formation. 1.Furnace temperature curve is improperly set ① In the temperature rising section, the gradient is set too high, causing the rapidly escaping gas to detach the BGA from the pad; ② The duration of the heating section is not long enough. When the temperature rises, the gas that should be volatilized has not completely escaped. This part of the gas continues to escape during the reflow phase, affecting the fluxing system to play a role in the reflow phase. 2. The solder paste solvent is not properly matched ① During the heating phase, the rapidly escaping gas propels up the BGA, causing misalignment and barriers; ② During the reflow phase, a considerable amount of gas still escapes from the solder paste system, but is limited by the narrow space between the BGA and the pad. These volatile gases cannot smoothly escape through this space, causing them to be squeezed. Molten solder joints. 3. Insufficient ability of solder paste to wet the pad 4. The surface tension of the solder paste system is too high during the reflow phase 5. The solder paste system has a high non-volatile content 6. Carrier rosin quality 7. The amount of rosin used Another reason for the BGA cavity is the back-wetting phenomenon during the welding process. The formation of this phenomenon is related to the duration of action of the active material in the solder paste system and the duration of action. During the BGA reflow soldering process, BGA pads are more prone to this undesirable phenomenon than SMT solder paste soldering. After realizing these influencing factors, the corresponding testing measures were added in the research and development. For example, we introduced a thermogravimetric analyzer to conduct thermal analysis on the materials to be used and the solder paste produced, to visually understand these thermal characteristics, and to test Differences between design assumptions and actual performance, measures are taken to overcome them to ultimately meet the process requirements; and surface tension measurements are performed. The appropriate surface tension range is finally determined by measuring the surface tension of the solder paste system and its affected objects at different temperatures. Family of Industrial X-ray inspection machine & BGA rework station Last Article: SMT BGA solder ball inspection method Next Article: Detecting advantages of AOI and X-ray Inspection Equipment Maybe you still are interested in: Importance of X-ray inspection technology in the SMT FAI/ First Article Inspection Highest Quality levels Tool X-ray for industries-SMT/batteries/ceramic/Electronic /semiconductor; The difference between the detection equipment AOI & X-RAY ...

Publisher: Seamark zm Tech Group

Seamark zm Tech Group

Seamark ZM PCB BGA X-ray Inspection system Equipment -14 years experience in SMT field, Our experience will provide good solutions. X-Ray Inspection, BGA reworks tation,Full auto X ray SMD component machine

Shenzhen, China, China

Inspection

Reasons for BGA insufficient solder & short

Nov 13, 2018 | Joy Rong

Reason for BGA insufficient solder & short-There are cases of insufficient solder & solder short in BGA, and some BGA solder ball inspection methods. Written by Joy Rong Reasons for BGA insufficient solder & short There are cases of insufficient solder and solder short in BGA soldering, but it is also possible. Because the PCB BGA board has too much gap due to heat shrinkage (CTE), the edge of the BGA board is upturned. The smile curve is formed, and the circuit board is too long due to TAL (Time Above Liquidus), and the temperature difference between the upper and lower furnaces of the reflow furnace is too large, and the two-phase interaction forms a circuit board to bend down,Caused the so-called cry curve. If the cry curve, smile curve is severely deformed, short-circuit and air-welding of the BGA will be formed at the same time, which is usually the case when both occur at the same time. The picture shows that the BGA smile curve and the cry curve on the printed circuit board strongly squeeze the BGA solder balls, causing several short circuits. In general, consider reducing the slope of the reflow oven, either by preheating the BGA to eliminate thermal stress, or by requiring BGA manufacturers to use higher Tg to overcome it. Other reasons for BGA insufficient solder: 1.Circuit board pads or BGA solder balls are oxidized. In addition, printed circuit boards or BGAs with improper moisture resistance will have similar problems. 2.Solder paste expired. 3.Insufficient solder paste printing. 4.The temperature profile is poorly set, and the furnace temperature should be measured at the insufficient solder. In addition, when the temperature rises too fast, it is more likely to cause the above-mentioned cry curve, smile curve problems. 5.Design issues. For example, Via-in-pad will cause a decrease in solder paste, which may also cause the solder ball to be hollow and blow up the solder ball. 6.Head in Pillow. This phenomenon often occurs when the BGA board or printed circuit board is deformed by reflow. When the solder paste is melted, the BGA solder ball does not touch the solder paste. When cooling, the BGA carrier board and the board are deformed. Decrease, the solder ball falls back to the cured solder paste. In general, there are several methods for analyzing insufficient solder and solder short (for details, please refer:SMT BGA solder ball inspection method): 1.Microscope. 2.X-Ray inspection machine. ( Tel/whatspp/wechat +8618779975930 ) 3.Red Dye Penetration. 4.Cross section. Family of Industrial X-ray inspection machine & BGA rework station Last Article: SMT BGA solder ball inspection method Next Article: Formation and prevention of SMT BGA voids Maybe you still are interested in: As PCB designer and technician/Buyer, you do not know technologies Skills? Highest Quality levels Tool X-ray for industries-SMT/batteries/ceramic/Electronic /semiconductor; The difference between the detection equipment AOI & X-RAY More details: www.seamarkxray.com...

Publisher: Seamark zm Tech Group

Seamark zm Tech Group

Seamark ZM PCB BGA X-ray Inspection system Equipment -14 years experience in SMT field, Our experience will provide good solutions. X-Ray Inspection, BGA reworks tation,Full auto X ray SMD component machine

Shenzhen, China, China

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Laser-Based Methodology for the Application of Glass as a Dielectric and Cu Pattern Carrier for Printed Circuit Boards

Nov 07, 2018 | Joel Schrauben, Cameron Tribe, Christopher Ryder and Jan Kleinert

Glass offers a number of advantages as a dielectric material, such as a low coefficient of thermal expansion (CTE), high dimensional stability, high thermal conductivity and suitable dielectric constant. These properties make glass an ideal candidate for, among other things, package substrate and high-frequency PCB applications.

We report here a novel process for the production of printed circuit boards and integrated circuit packaging using glass as both a dielectric medium and a platform for wiring simultaneously....

Publisher: Electro Scientific Industries

Electro Scientific Industries

Captial equipment for the gobal electronics marketplace

Portland, Oregon, USA

Manufacturer of Assembly Equipment

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