Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


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1776 SMT / PCB Assembly Related Technical Articles

Engineering Services

May 23, 2024 | A-Laser

Information on how A-Laser can help support your next laser manufacturing project....

Publisher: A-Laser, Inc.

A-Laser, Inc.

Custom laser cutting services and precision parts manufacturing.

Milpitas, California, USA

Consultant / Service Provider, Manufacturer

Ultraviolet Laser Technology Overview

May 22, 2024 | A-Laser

This article reviews UV or ultraviolet laser technology. Is on method that can be used for laser depaneling or singulation for precision control....

Publisher: A-Laser, Inc.

A-Laser, Inc.

Custom laser cutting services and precision parts manufacturing.

Milpitas, California, USA

Consultant / Service Provider, Manufacturer

Thick Film Printing Filter , size 6mmx10mm

May 17, 2024 | Max.

Applications: Realize standard thick film printing system, ceramic metallization printing, through hole metallization printing, flexible plate printing such as PET (with micro-hole vacuum printing platform), and solder paste printing of PCB. Features: Ø Automatic screen cleaning function Ø Lighting system:screen lighting, printing table lighting and backlight to check printing effect Ø Can be equipped with conventional center positioning fixture (ceramic substrate thickness >0.38mm) Ø Can be equipped with lifting type center positioning fixture (ceramic substrate >0.1mm) Specifications: Maximum Frame Size: 355x320mm Maximum Printing Area: 150 x 150mm...

Publisher: Wisdom Electronics Co,LTD.

Wisdom Electronics Co,LTD.

Design and manufacturing thick film printing machine for HIC,LTCC,HTCC,chip components,sensors,professional equipment provider,thick film printer,furnace, dryer,laser trimming,thick & thin film technology.

Jiaxing, China

Distributor, Manufacturer

Laser Drilling as an Alternative for Via & Microvia Drilling

May 16, 2024 | A-Laser

Much like actual cities where streets and roads connect buildings together, ICs on a board are connected to each other with copper traces. And just like any metropolitan city, urban expansion tends to move vertically instead of horizontally, but instead of multi-story buildings, we get multilayer boards. Vias are copper-plated holes spanning through the different layers of a given board or panel. They are the entrance locations to the subway stations, if you will. Having those multilayer boards has enabled electronic design to minimize the size of boards immensely without compromising on the complexity....

Publisher: A-Laser, Inc.

A-Laser, Inc.

Custom laser cutting services and precision parts manufacturing.

Milpitas, California, USA

Consultant / Service Provider, Manufacturer

Thick Film Screen Printer J7208

May 14, 2024 | Max.

Applications: High performance sensors, chip elements, thick film circuit (automotive\military\aerospace\medical applications) chip resistance and capacitance, LTCC, HTCC,HIC, RFID (radio frequency identification system) circuit/antenna, high-power LED and other fields. Features: Redefine key variables and standards for high-end printing Dynamic data will change the perception of the printing process Log recording, can trace daily printing data Automatic stabilization and compensation algorithm for printing target film thickness Core patent structure, stable operation period of more than ten years Operator perspective concept, smart using Thirty years of process precipitation, ten years of research and development Three variables affect the stability of film thickness Pressure applied by the squeegee Elasticity of silk screen deformation Pressure on the pad G-level measurement pressure real-time display of three major variables The reaction of the paste scraping rolling will be dynamically displayed Rely on algorithm to achieve uneven correction of front and rear film thickness Screen attenuated scraping wear will be monitored and corrected Ceramic substrate deviation and warping will be monitored and indicated Automatic balance correction can make the screen pattern synchronous recurrence, the uneven phenomenon of film thickness can be eliminated almost can achieve zero pressure printing, ultra-thin easy fragmentation printing will no longer be difficult Specifications: Maximum Frame 450×450mm Maximum Printing area 250×250mm...

Publisher: Wisdom Electronics Co,LTD.

Wisdom Electronics Co,LTD.

Design and manufacturing thick film printing machine for HIC,LTCC,HTCC,chip components,sensors,professional equipment provider,thick film printer,furnace, dryer,laser trimming,thick & thin film technology.

Jiaxing, China

Distributor, Manufacturer

Application of thick film technology- Heaters

May 11, 2024 | Max.

Heaters built on stainless steel substrates have been a popular choice for many applications over the past years because of their high reliability, extended lifetimes, temperature cycling, and power handling capabilities. These characteristics make them a great choice for automotive applications, and this is evident from their current use in the EV space for BMS and cabin comfort. Positive thermal coefficient (PTC) block heaters are the incumbent technology for heating applications in vehicles, however thick film heaters can handle high power density even in the smallest space available, much higher then what you could realize with conventional PTC blocks (stacked in an aluminum gasket). Thick film heaters can also run at much higher temperature than PTCs, as PTCs lose their self-controlling effect when operating at high temperatures or even degrade. Applications: Automotive: electrical vehicle battery thermal management, cabin and comfort heating, heaters for sensors in autos, incl. advanced driver assistance Industrial: food service, white goods, thermal print heads, e-cigarettes Semiconductor: wafer processing Aerospace: instrumentation, sensors Medical: analytical equipment, temperature optimization for sensors...

Publisher: Wisdom Electronics Co,LTD.

Wisdom Electronics Co,LTD.

Design and manufacturing thick film printing machine for HIC,LTCC,HTCC,chip components,sensors,professional equipment provider,thick film printer,furnace, dryer,laser trimming,thick & thin film technology.

Jiaxing, China

Distributor, Manufacturer

Application of thick film technology e-cigarette and heater

May 11, 2024 | Max.

Thick film technology is well established in the automotive industry for high reliability circuitry, challenging sensor applications, and robust passive component needs. With the evolution of electric vehicle (EV) and battery management systems (BMS), the needs for thick film materials are expanding once again. Electronic content per vehicle is doubling and tripling in comparison to current internal combustion engine (ICE) vehicles, and this will expand depending on the level of driving autonomy. One key difference comparing EV to ICE is the waste heat generation. ICE vehicles have utilized this waste heat for several purposes including in-cabin heating. However, EVs must utilize active heating systems, as the waste heat generated from the battery systems is not sufficient to fulfill the needs for cabin comfort. Additionally, battery management systems are required to provide critical temperature control for startup, operation, and charging of the battery pack. This is particularly needed for EV use in colder climates. Thick film is extremely well suited for this application because of the heating precision and repeatability, space constraints, design flexibility, and power handling capabilities of the technology. A heater is very simply a circuit with controlled resistance to output a desired temperature at a given power input. Depending on the choice of materials, thick film heaters can be self-limiting, or they can be designed with high or low temperature coefficient of resistance depending on the control systems desired. And thick film heaters can be built on numerous substrate types compatible to operating temperatures from below zero to upwards of 700°C with nearly unlimited power requirements. Most commonly thick film heaters are built on stainless steel, but there are also material systems available on polymer substrates, glass, oxide and nitride-based ceramics, and aluminum. There are long-running, commercialized uses for each of these types....

Publisher: Wisdom Electronics Co,LTD.

Wisdom Electronics Co,LTD.

Design and manufacturing thick film printing machine for HIC,LTCC,HTCC,chip components,sensors,professional equipment provider,thick film printer,furnace, dryer,laser trimming,thick & thin film technology.

Jiaxing, China

Distributor, Manufacturer

Application of thick film printing on stainless steel surface

May 11, 2024 | Max.

In this research work thick‐film manufacturing technology on stainless steel baseplates was developed. Adequate adhesion of dielectric IP211 to the steel substrate was achieved only by sand blast roughening. Standard PdAg thick‐film conductors were not solderable to IP211. The solution was to have a separate multilayer dielectric under conductors to be soldered. The reliability of soft soldering and gold wire bonding of thick‐film metallisation on stainless steel and other base plate materials was evaluated. The technology developed was applied to manufacturing an intelligent signal node. Present expertise enables the manufacture of thick‐film hybrids on stainless steel base plates. Development of an industrial production line would, however, involve considerable effort.p J7208 Perfect solution to the printing process...

Publisher: Wisdom Electronics Co,LTD.

Wisdom Electronics Co,LTD.

Design and manufacturing thick film printing machine for HIC,LTCC,HTCC,chip components,sensors,professional equipment provider,thick film printer,furnace, dryer,laser trimming,thick & thin film technology.

Jiaxing, China

Distributor, Manufacturer

Ceramic Substrate Thick Film Screen Printing

May 11, 2024 | Max.

Perfect solution to the problem of uneven printing film thickness caused by poor flatness of ceramic substrate...

Publisher: Wisdom Electronics Co,LTD.

Wisdom Electronics Co,LTD.

Design and manufacturing thick film printing machine for HIC,LTCC,HTCC,chip components,sensors,professional equipment provider,thick film printer,furnace, dryer,laser trimming,thick & thin film technology.

Jiaxing, China

Distributor, Manufacturer

Ceramic Substrate Thick Film Screen Printing

May 11, 2024 | Max.

Perfect solution to the problem of uneven printing film thickness caused by poor flatness of ceramic substrate...

Publisher: Wisdom Electronics Co,LTD.

Wisdom Electronics Co,LTD.

Design and manufacturing thick film printing machine for HIC,LTCC,HTCC,chip components,sensors,professional equipment provider,thick film printer,furnace, dryer,laser trimming,thick & thin film technology.

Jiaxing, China

Distributor, Manufacturer

Thick Film Screen Printer J7212

May 11, 2024 | Max.

High performance sensors, chip elements, thick film circuit (automotive\military\aerospace\medical applications) chip resistance and capacitance, LTCC, HTCC,HIC, RFID (radio frequency identification system) circuit/antenna, high-power LED and other fields. Maximum Frame 750×750mm Maximum printed area 350×350mm...

Publisher: Wisdom Electronics Co,LTD.

Wisdom Electronics Co,LTD.

Design and manufacturing thick film printing machine for HIC,LTCC,HTCC,chip components,sensors,professional equipment provider,thick film printer,furnace, dryer,laser trimming,thick & thin film technology.

Jiaxing, China

Distributor, Manufacturer

Thick Film Screen Printer J7208

May 11, 2024 | Max.

High performance sensors, chip elements, thick film circuit (automotive\military\aerospace\medical applications) chip resistance and capacitance, LTCC, HTCC,HIC, RFID (radio frequency identification system) circuit/antenna, high-power LED and other fields. Maximum Frame 450×450mm Maximum Printing area 250×250mm...

Publisher: Wisdom Electronics Co,LTD.

Wisdom Electronics Co,LTD.

Design and manufacturing thick film printing machine for HIC,LTCC,HTCC,chip components,sensors,professional equipment provider,thick film printer,furnace, dryer,laser trimming,thick & thin film technology.

Jiaxing, China

Distributor, Manufacturer

Thick Film Screen Printer 5206-CX

May 11, 2024 | Max.

Applications: Realize standard thick film printing system, ceramic metallization printing, through hole metallization printing, flexible plate printing such as PET (with micro-hole vacuum printing platform), and solder paste printing of PCB. Features: Automatic screen cleaning function Lighting system:screen lighting, printing table lighting and backlight to check printing effect Can be equipped with conventional center positioning fixture (ceramic substrate thickness >0.38mm) Can be equipped with lifting type center positioning fixture (ceramic substrate >0.1mm) Specifications: Maximum Frame Size: 355x320mm Maximum Printing Area: 150 x 150mm...

Publisher: Wisdom Electronics Co,LTD.

Wisdom Electronics Co,LTD.

Design and manufacturing thick film printing machine for HIC,LTCC,HTCC,chip components,sensors,professional equipment provider,thick film printer,furnace, dryer,laser trimming,thick & thin film technology.

Jiaxing, China

Distributor, Manufacturer

Thick Film Screen Printer J3202B

May 11, 2024 | Max.

Thick film circuit, suitable for thick film printing of heavy workpieces Printing Product Size: 20-70mm...

Publisher: Wisdom Electronics Co,LTD.

Wisdom Electronics Co,LTD.

Design and manufacturing thick film printing machine for HIC,LTCC,HTCC,chip components,sensors,professional equipment provider,thick film printer,furnace, dryer,laser trimming,thick & thin film technology.

Jiaxing, China

Distributor, Manufacturer

Thick Film Screen Printer J3202

May 11, 2024 | Max.

Thick film circuit, pressure sensor (piezoresistive, capacitive), glass glaze potentiometer, dielectric antenna, ceramic metallization RFID, automotive oil level sensor, LED ceramic bracket, tension sensor, piezoelectric ceramic components, etc. Maximum Printing Area: 75x70mm...

Publisher: Wisdom Electronics Co,LTD.

Wisdom Electronics Co,LTD.

Design and manufacturing thick film printing machine for HIC,LTCC,HTCC,chip components,sensors,professional equipment provider,thick film printer,furnace, dryer,laser trimming,thick & thin film technology.

Jiaxing, China

Distributor, Manufacturer

Thick Film Screen Printer J3201

May 11, 2024 | Max.

Applications: Thick film circuit, pressure sensor (Piezoresistive , Capacitive), RF device, ceramic metallization RFID, piezoelectric ceramic components, etc. Most suitable for automatic printing of small and shaped work pieces. Specifications: Printing Area: Diameter 1-25mm,height less than 23mm...

Publisher: Wisdom Electronics Co,LTD.

Wisdom Electronics Co,LTD.

Design and manufacturing thick film printing machine for HIC,LTCC,HTCC,chip components,sensors,professional equipment provider,thick film printer,furnace, dryer,laser trimming,thick & thin film technology.

Jiaxing, China

Distributor, Manufacturer

Thick Film Screen Printer J1202-RS

May 11, 2024 | Max.

Applications: Thick film circuit, pressure sensor (piezoresistive, capacitive), glass glaze potentiometer, dielectric antenna, ceramic metallization, microwave magnetron,HTCC,LTCC,HIC,RFID, automotive oil level sensor, air quality sensor, integrated LED lamp holder, tension sensor, piezoelectric ceramic components, etc Maximum Frame Size: 185x252mm Maximum Printing Area: 70x75mm...

Publisher: Wisdom Electronics Co,LTD.

Wisdom Electronics Co,LTD.

Design and manufacturing thick film printing machine for HIC,LTCC,HTCC,chip components,sensors,professional equipment provider,thick film printer,furnace, dryer,laser trimming,thick & thin film technology.

Jiaxing, China

Distributor, Manufacturer

What is Laser Depaneling/Singulation?

May 10, 2024 | A-Laser

A Review of laser singulation and what it is and how it can benefit PCB Contract Assembly....

Publisher: A-Laser, Inc.

A-Laser, Inc.

Custom laser cutting services and precision parts manufacturing.

Milpitas, California, USA

Consultant / Service Provider, Manufacturer

A review on Automatic Bare PCB Board Testing

May 08, 2024 | S.Kanimozhi, Dr. K.Gopala Krishnan

A Printed Circuit Board is used to mechanically support and electrically connect electronic components using conductive pathways, track or signal traces etched from copper sheets laminated on to anon conductive substrate. The automatic inspection of PCBs serves a purpose which is traditional in computer technology. The purpose is to relieve human inspectors of the tedious and inefficient task of looking for those defects in PCBs which could lead to electric failure. This paper is a survey conducted on various existing approaches which performs automatic testing on PCB.

...

Publisher: Sri Ramakrishna College of Arts & Science

Sri Ramakrishna College of Arts & Science

Sri Ramakrishna College of Arts and Science is a College of Arts and Science in Coimbatore, Tamil Nadu, India. It was founded in 1987. At present, with 5000+ students, the college is offering 30+ programmes in Arts, Humanities ...

Peelamedu, India

Research Institute / Laboratory / School

A Machine Vision Based Automatic Optical Inspection System for Measuring Drilling Quality of Printed Circuit Boards

Apr 29, 2024 | Wei-Chien Wang, Liang-Bi Chen,Wan-Jung Chang, Shang-Liang Chen, and Katherine Shu-Min Li

In this paper, we develop and put into practice an Automatic Optical Inspection (AOI) system based on machine vision to check the holes on a printed circuit board (PCB). We incorporate the hardware and software. For the hardware part, we combine a PC, the three-axis positioning system, a lighting device and CCD cameras. For the software part, we utilize image registration, image segmentation, drill numbering, drill contrast, and defect displays to achieve this system. Results indicated that an accuracy of 5µm could be achieved in errors of the PCB holes allowing comparisons to be made. This is significant in inspecting the missing, the multi-hole and the incorrect location of the holes. However, previous work only focusses on one or other feature of the holes. Our research is able to assess multiple features: missing holes, incorrectly located holes and excessive holes. Equally, our results could be displayed as a bar chart and target plot. This has not been achieved before. These displays help users analyze the causes of errors and immediately correct the problems. Additionally, this AOI system is valuable for checking a large number of holes and finding out the defective ones on a PCB. Meanwhile, we apply a 0.1mm image resolution which is better than others used in industry. We set a detecting standard based on 2mm diameter of circles to diagnose the quality of the holes within 10 seconds....

Publisher: National Cheng Kung University

National Cheng Kung University

National Cheng Kung University is a public research university located in Tainan, Taiwan. NCKU is one of the best comprehensive universities in Taiwan and a leader in promoting industry-academia cooperation. ...

Tainan City, Taiwan

Research Institute / Laboratory / School

FICS-PCB: A Multi-Modal Image Dataset for Automated Printed Circuit Board Visual Inspection

Apr 29, 2024 | Hangwei Lu , Dhwani Mehta, Olivia Paradis, Navid Asadizanjani, Mark Tehranipoor, and Damon L. Woodard

Over the years, computer vision and machine learning disciplines have considerably advanced the field of automated visual inspection for Printed Circuit Board (PCB-AVI) assurance. However, in practice, the capabilities and limitations of these advancements remain unknown because there are few publicly accessible datasets for PCB visual inspection and even fewer that contain images that simulate realistic application scenarios. To address this need, we propose a publicly available dataset, "FICS-PCB"1, to facilitate the development of robust methods for PCB-AVI. The proposed dataset includes challenging cases from three variable aspects: illumination, image scale, and image sensor. This dataset consists of 9,912 images of 31 PCB samples and contains 77,347 annotated components. This paper reviews the existing datasets and methodologies used for PCBAVI, discusses challenges, describes the proposed dataset, and presents baseline performances using feature engineering and deep learning methods for PCB component classification....

Publisher: University of Florida

University of Florida

SVS 8100 (parts)

Gainesville, Florida, USA

Manufacturer

SPI C-Platform-L Operation Manual

Apr 28, 2024 | Koh Young

Table of Contents: Safety // Product/Parts Control and // Replacing Parts.// System Installation .// System Alignment // System Specifications......

Publisher: Koh Young America, Inc.

Koh Young America, Inc.

Koh Young is the leading True3D™ measurement-based inspection solutions provider supported by its global offices to ensure close communication with a growing customer base to provide access to AI-powered process optimization tools

Duluth, Georgia, USA

Consultant / Service Provider, Manufacturer, Other, Training Provider

SPI C-Platform Operation Manual

Apr 28, 2024 | Koh Young

Table of Contents: Safety Precautions // Operation // AOI Operation....

Publisher: Koh Young America, Inc.

Koh Young America, Inc.

Koh Young is the leading True3D™ measurement-based inspection solutions provider supported by its global offices to ensure close communication with a growing customer base to provide access to AI-powered process optimization tools

Duluth, Georgia, USA

Consultant / Service Provider, Manufacturer, Other, Training Provider

Laser Depaneling/Laser Singulation

Apr 26, 2024 | A-Laser

A brief description of what laser depaneling is....

Publisher: A-Laser, Inc.

A-Laser, Inc.

Custom laser cutting services and precision parts manufacturing.

Milpitas, California, USA

Consultant / Service Provider, Manufacturer

Microelectronics Reliability: Physics-of-Failure Based Modeling and Lifetime Evaluation

Apr 22, 2024 | Mark White and Joseph B. Bernstein

The solid-state electronics industry faces relentless pressure to improve performance, increase functionality, decrease costs, and reduce design and development time. As a result, device feature sizes are now in the nanometer scale range and design life cycles have decreased to fewer than five years. Until recently, semiconductor device lifetimes could be measured in decades, which was essentially infinite with respect to their required service lives. It was, therefore, not critical to quantify the device lifetimes exactly, or even to understand them completely. For avionics, medical, military, and even telecommunications applications, it was reasonable to assume that all devices would have constant and relatively low failure rates throughout the life of the system; this assumption was built into the design, as well as reliability and safety analysis processes....

Publisher: NASA Office Of Safety And Mission Assurance

NASA Office Of Safety And Mission Assurance

The Office of Safety and Mission Assurance (OSMA) assures the safety and enhances the success of all NASA activities through the development, implementation and oversight of agencywide safety, reliability, maintainability and ...

Washington, District of Columbia, USA

Research Institute / Laboratory / School

The Difference Between AB Glue Dispensing Machine and AB Glue Potting Machine?

Apr 19, 2024 | KPD automatic-

Glue Dispensing Machine VS. Glue Potting Machine potting dosing encapsluation,glue dispenser,Meter Mix Systems, Metering, Mixing and dispensing , 2K metering, 2 part epoxy dispensing ,glue potting machine The Difference Between Glue Dispensing Machine and Glue Potting Machine? While both glue dispensing machines and glue potting machines are used in industrial and manufacturing settings for adhesive applications, they have some differences in their functionality and applications. Glue dispensing machines are designed to accurately and precisely apply adhesive materials to specific locations on a part or surface. These machines use a variety of application methods, including spray, needle or nozzle dispensing, and jetting. They are typically used in applications where a small amount of adhesive is required at a specific location or where a high level of precision is needed. They are commonly used in electronics, automotive, and medical device manufacturing. On the other hand, glue potting machines are designed to fill entire cavities or enclosures with adhesive material. They are typically used in applications where a part or assembly requires a high level of protection from environmental factors such as moisture, dust, or vibrations. Glue potting machines are used to apply a thick layer of adhesive to enclose and protect sensitive components such as circuit boards, sensors, or electronic assemblies .While glue dispensing machines and glue potting machines share some similarities in their application of adhesive material, they are typically used for different purposes and in different types of applications. In general, glue dispensing machines are used for precise, small-scale adhesive applications, while glue potting machines are used for large-scale applications where a high level of protection is needed. How to Choose a Suitable Automatic Glue Dispensing Machine? Choosing a suitable automatic glue dispensing machine can depend on a number of factors, such as the type of glue you're working with, the desired application method, the size and complexity of your project, and your budget. Here are some things to consider when choosing an automatic glue dispensing machine: Types of glue: Different automatic glue dispensing machines are designed to work with specific types of glue, such as epoxy, silicone, hot melt, or UV-curable adhesives. Make sure to choose a machine that is compatible with the type of glue you need to use. Dispensing method: Consider the method by which the machine dispenses the glue. Some machines use needles or nozzles to apply the glue, while others use spray or roller applicators. Choose a method that is appropriate for your application. Precision: If you need precise control over the amount of glue dispensed, look for a machine that has high accuracy and repeatability. Some machines use vision systems or other sensors to ensure accurate placement and amount of glue. Production volume: Consider the volume of production that you require. If you need to produce large quantities of products, you may need a faster cycle time and higher capacity machine. Integration: If you plan to integrate the automatic glue dispensing machine into an existing production line, make sure it is compatible with your equipment and software. Budget: Automatic glue dispensing machines can range in price from a few hundred dollars to tens of thousands. Consider your budget and the ROI (Return on Investment) the machine can provide before making a purchase decision. Technical support: Choose a supplier that provides good technical support, training, and maintenance services to ensure your machine runs smoothly and efficiently. By considering these factors and doing thorough research, you can choose an automatic glue dispensing machine that meets your needs and helps you achieve your production goals. We offer both glue dispensing machine and glue potting machine, kindly share your glue TDS and your product, we will recommend suitable machine to you...

Publisher: Kapton Automation Equipment (Guangzhou) Co., Ltd

Kapton Automation Equipment (Guangzhou) Co., Ltd

2 component resin meter mix dispense system 2 component glue potting machine 2 component ab glue dispenser ab resin dosing machine, ab resin mixing machine, Potting and encapsulation machine

guangzhou, Guangdong, China

Manufacturer

Addressing Silicone Contamination Issues

Apr 16, 2024 | Edward M. Petrie

Since adhesives and sealants must function by surface attachment, the nature and condition of the substrate
surface are critical to the success of any bonding or sealing operation. One of the most important parameters
is surface cleanliness or the absence of contaminants that can impair adhesion. There are many sources of
possible contamination to worry about. Some of these are indicated in Table 1, but the list is by no means allinclusive.  

...

Publisher: TECHSiL Ltd

TECHSiL Ltd

For over 30 years, Techsil has been supplying the electronics, transportation, medical and many other industries with high-grade materials from our offices in the UK. Offering adhesives, silicones, tapes, lubricants, O-rings ...

Bidford-on-Avon, Alcester, Warwickshire, United Kingdom

Distributor

Wettable Flank Plated PQFN

Apr 08, 2024 | Bradley Smith

Plastic Quad Flat Pack No-Lead (PQFN) or Quad Flat Pack No-Lead Exposed Pad (QFN-EP) packages (a.k.a. QFN) have no easily solderable, visually exposed terminations, because the package designs have terminations on the underside of the package for solder joints. The package edge has exposed copper of the termination after singulation and does not easily solder wet due to copper oxidation. Therefore, visual determination that the package has soldered effectively cannot be made optically or by x-ray. Electrical test is the only way to determine electrical connectivity of the soldered terminations. There are some applications where full electrical test of all terminations is difficult or incomplete. Thus, in high reliability applications, it may be desired to visually check for termination solder joint integrity. It is for these purposes that wettable flank, tin plated terminations of QFNs have been developed as a visual aid to the determination of board solder operation effectiveness

...

Publisher: Allegro MicroSystems

Allegro MicroSystems

With more than 30 years of experience developing advanced semiconductor technology and application-specific algorithms, Allegro is a global leader in power and sensing solutions for motion control and energy-efficient systems.

Manchester, New Hampshire, USA

Manufacturer

Factors That Influence Side-Wetting Performance on IC Terminals

Apr 08, 2024 | Donald C. Abbott, Bernhard Lange, Douglas W. Romm, and John Tellkamp .

A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact....

Publisher: Texas Instruments

Texas Instruments

Advance in DSP technology and design/applications

Baguio City, USA

How to select vacuum potting machine for ignition coils products?

Apr 03, 2024 | D&H

Selecting a vacuum potting machine for ignition coils products involves considering several factors to ensure efficient and effective potting. Here's a step-by-step guide to help you choose the right vacuum potting machine: Understand Your Requirements: Determine the specific needs of your production process. Consider factors such as the volume of production, size and shape of the ignition coils, potting material viscosity, curing requirements, and desired production rate. Capacity and Size: Choose a vacuum potting machine with a capacity suitable for your production volume. Consider the size of the ignition coils and ensure that the machine can accommodate them comfortably. Material Compatibility: Ensure that the vacuum potting machine is compatible with the potting material you intend to use for the ignition coils. Different machines may be optimized for specific types of potting materials, such as epoxy, polyurethane, silicone, etc. Vacuum and Degassing Capability: Opt for a machine with strong vacuum and degassing capabilities to remove air bubbles from the potting material effectively. This ensures proper encapsulation of the ignition coils and minimizes the risk of defects. Precision and Control: Look for a machine that offers precise control over vacuum level, potting material dispensing, curing parameters (if applicable), and other relevant variables. This allows you to tailor the potting process to meet your specific requirements and ensure consistency in product quality. Ease of Use and Maintenance: Choose a vacuum potting machine that is user-friendly and easy to maintain. Consider factors such as intuitive controls, accessibility for cleaning and servicing, and availability of spare parts and technical support. Automation and Integration: Depending on your production setup and requirements, consider whether automation features or integration capabilities with other equipment (e.g., dispensing systems, curing ovens) would be beneficial for streamlining your production process and improving efficiency. Reliability and Durability: Select a machine from a reputable manufacturer known for producing high-quality, reliable equipment. Check customer reviews and testimonials to gauge the reliability and durability of the machine over time. Cost and ROI: Evaluate the cost of the vacuum potting machine in relation to its features, capabilities, and potential return on investment (ROI) for your production operation. Consider factors such as increased production efficiency, reduced material waste, and improved product quality when assessing the overall value proposition. Customization Options: Some manufacturers offer customization options to tailor the vacuum potting machine to specific industry requirements or unique production processes. If necessary, inquire about customization possibilities that align with your needs. By considering these factors and conducting thorough research, you can select a vacuum potting machine that meets your requirements for potting ignition coils products effectively and efficiently. For more professional ,please consult us by : gluepottingmachine@gmail.com whatsapp:+86 13535032180 Our working range including as follow : CCD Vision dispensing system AB glue machine 2 Part Silicone plyurethane epoxy potting dispensing machine,AB Resins compound dosing dispensing potting system ,2K potting technology AB glue dispensing machine Epoxy dispensing machine,Two-component dispensing machine,Dual-component dispensing machine, AB dosing system machine ,glue dropping machine ,glue filling machine ,Meter-mix dispensing machine,Resin dispensing machine Vuaccum potting casting system machine Adhesive dispensing system,Dispensing robot with high precision Dispensing valve, AB Liquid dispenser , Automated dispensing equipment ,automatic glue dispensing ,meter mixing machine , 2K dispenser , 2K DOS machine, 2-part silciones ,polyurethane epoxy dispensing potting filling machine ,AB epoxy resins compound spraying filling dispenser ,two components ab epoxies ,PU and silicones metering mixing system ,2K dosing unit , ab-part doser ,2k resins metering mixing machine,meter-mix dispensing system , resin dispensing , adhesive dispensing technology ,high precision and accuracy dispensing robot ,dispensing valve units and automated ab glue dispenser equipment . dynamic and static mixing system ....

Publisher: Guangzhou Zhengqi Technology Co.,Ltd

Guangzhou Zhengqi Technology Co.,Ltd

We are manufacturer of 2K potting technology AB glue dispensing machine Epoxy dispensing machine Two-component dispensing machine,Dual-component dispensing machine Meter-mix dispensing machine,Resin dispensing machine

Guangzhou, Guangdong, China

Manufacturer

How to optimize dispensing processes

Mar 20, 2024 | Scheugenpflug

Effective and reliable dispensing is based primarily on process technology that has been perfectly set up for the specific project. Anyone tasked with planning dispensing systems and responsible for the processes should know the principles and key factors involved so that the dispensing processes can be successfully implemented in cooperation with system and material partners. This White Paper explains the relevant aspects of process technology and provides valuable practical tips....

Publisher: Scheugenpflug Inc.

Scheugenpflug Inc.

Producer of bonding, dispensing and potting solutions with outstanding expertise in automation. As part of the Atlas Copco Group, we have a worldwide sales & service network and access to the Group's extensive technology portfolio

Kennesaw, Georgia, USA

Manufacturer

What is Underfill

Mar 19, 2024 | GPD Global

Underfill is a composite material usually made of an epoxy polymer that fills gaps between a chip and its carrier or a finished package and the PCB substrate to connect the chip to the board....

Publisher: GPD Global

GPD Global

A Manufacturer of High Quality, Precision, Automated Fluid Dispensing and Conformal Coating Systems, SMT Cover Tape Peel Tester and Lead Forming machines for through-hole component preparation.

Grand Junction, Colorado, USA

Manufacturer

Made in Japan: Solder Paste Jet Dispensing Machine

Mar 19, 2024 | I.C.T

Introduction of Solder Paste Jet Dispensing Machine Step into the future of manufacturing with the Solder Paste Jet Dispensing Machine, meticulously crafted in Japan under the esteemed I.C.T brand. This cutting-edge equipment represents the pinnacle of precision engineering, delivering unrivaled performance and reliability. Let's dive into its exceptional features and applications. Transmission Structure System of Solder Paste Jet Dispensing Machine At the heart of this Solder Paste Jet Dispensing Machine lies a meticulously designed transmission structure system. Powered by X Y linear motor drive control, it achieves unprecedented precision in positioning. With a reciprocating position accuracy of 3σ±5um and a dynamic position accuracy of 3σ±3um across the X, Y, and Z axes, it ensures flawless execution of tasks with minimal deviation. The load-type gantry structure further enhances stability and accuracy, guaranteeing consistent performance even during high-speed operations. Advanced Function Configuration Flexibility and customization are the hallmarks of the Solder Paste Jet Dispensing Machine. It features a customizable platform tailored to meet the specific needs of diverse applications, ensuring optimal performance and efficiency. Additionally, the machine boasts advanced functionalities such as automatic correction of substrate warp height and real-time penetration monitoring. Equipped with dual cameras, it provides precise feedback for adjustments during the filling process, ensuring unmatched precision and quality. Function configuration.jpg Vision Non-stop Experience uninterrupted precision with the Vision Non-stop functionality of this machine. Capable of detecting 100 chips per second, it automatically identifies position and height deviations, enabling real-time compensation for coating actions. Dual compensation for path and glue amount further optimizes efficiency, minimizing waste and maximizing productivity. With its ability to print solder paste dots as small as 110um, it's perfectly suited for high-precision applications in ICs, BGAs, and beyond. Versatility in Configuration Options and Applications Adaptability is key in modern manufacturing, and the Solder Paste Jet Dispensing Machine delivers on all fronts. Offering a range of configuration options, including different valves tailored to various material viscosities and fluidity, it ensures optimal performance across diverse production scenarios. From semiconductor packages to LED back-end Mini-LED production, its versatility knows no bounds, making it an indispensable asset in a wide range of industries. Explore the Future of Manufacturing with I.C.T Join the ranks of industry leaders embracing the future of manufacturing with I.C.T's Solder Paste Jet Dispensing Machine. With its unrivaled precision, speed, and reliability, it's set to revolutionize your production processes and propel your business to new heights of success. Don't just keep up with the competition--surpass it with I.C.T's cutting-edge solutions. Unlock the Potential of Precision Manufacturing Delve deeper into the transformative power of precision manufacturing and discover how the Solder Paste Jet Dispensing Machine can unlock new possibilities for your business. From reducing production costs to improving product quality, the benefits are endless. Partner with I.C.T today and embark on a journey towards manufacturing excellence. Conclusion In conclusion, our Solder Paste Jet Dispensing Machine embodies the fusion of Japanese precision and I.C.T reliability, offering unparalleled efficiency in solder paste dispensing. With its advanced features and customizable options, it caters to the diverse needs of modern manufacturing processes. Experience the pinnacle of dispensing technology with our Solder Paste Jet Dispensing Machine. Overseas Technical Support by I.C.T At I.C.T, our commitment to customer satisfaction extends beyond the initial purchase. We provide comprehensive overseas technical support, including machine installation, debugging, and customer training. Our dedicated team ensures that your production line runs smoothly from the first product off the line to the seamless delivery of the machine. Partner with I.C.T today and elevate your manufacturing precision with our Solder Paste Jet Dispensing Machine. Contact us now to learn more about our solutions and take your production processes to new heights of efficiency and reliability....

Publisher: I.C.T ( Dongguan ICT Technology Co., Ltd. )

I.C.T ( Dongguan ICT Technology Co., Ltd. )

I.C.T is a manufacturer from China that offers SMT, DIP, PCBA conformal coating equipment and turnkey solution.

Dongguan, Guangdong, China

Manufacturer

Precision Control in Electronic Assembly: Selective Wave Soldering Machine

Feb 26, 2024 | I.C.T

Precision Control in Electronic Assembly: Selective Wave Soldering Machine Discover the technical features of I.C.T's Selective Wave Soldering Machines, including precision flux application and innovative preheating systems. Learn how these machines redefine efficiency and reliability in electronic assembly. Introduction: Enhancing Precision Soldering: Technical Features of Selective Wave Soldering Machines by I.C.T Explore the innovative design and operation of I.C.T's Selective Wave Soldering Machines, featuring a seamless PCB handling system and modular design for enhanced assembly line flexibility. Experience precision control and efficiency with comprehensive PC controls, allowing easy adjustment of solder parameters like temperature and flux type. Automatic calibration and CCD mark positioning ensure consistent soldering quality. Detail Excellence: Enhancing Selective Wave Soldering Technology Flux System Mastery German high-frequency pulse injection valve ensures precise flux application. Optional flux nozzle jam detection simplifies maintenance. Pressure tank and precision pressure flow meter ensure consistent flux control. Preheat System Excellence Bottom IR preheating system ensures stability and efficiency. Maintenance is simplified with a tool-free mode and plug-in design. Soldering System Innovation Swedish "PRECIMETER" electromagnetic pump coil ensures stability. Stainless steel soldering pot prevents tin liquid leakage. N2 online heating system reduces solder dross. Transmission System Mastery Specially designed material profiles ensure operational stability. Thickened customized rails guarantee flawless operation. Control and Intelligence Keyence PLC+module high-end bus control system ensures stability. Industry 4.0 compliance allows guided programming and real-time data visualization. Market Promotion and Success Stories: Elevating Selective Wave Soldering Machine I.C.T's strategic market positioning has led to global success across diverse industries. Success stories from European clients highlight reliability and trust in the machine. Over 70 units sold across 20+ countries since 2022, establishing its industry-leading position. Conclusion Conclusion: I.C.T's Selective Wave Soldering Machine combines technical excellence with global market success, solidifying its leadership in precision soldering technology....

Publisher: I.C.T ( Dongguan ICT Technology Co., Ltd. )

I.C.T ( Dongguan ICT Technology Co., Ltd. )

I.C.T is a manufacturer from China that offers SMT, DIP, PCBA conformal coating equipment and turnkey solution.

Dongguan, Guangdong, China

Manufacturer

Evaluation Report Medium Temperature Dry Cabinet

Feb 07, 2024 | Totech

Report of different drying temperatures...

Publisher: TOTECH Canada N.A Inc

TOTECH Canada N.A Inc

Totech Canada operates in North America as the official distributor for TOTECH Japan SUPERDRY/AUTODRY Humidity & Temperature controlled Dry Cabinets, A Industry leader in Dry Cabinets since 1973, Sales & service in the N/S America

Montreal, Quebec, Canada

Consultant / Service Provider, Distributor, Manufacturer

Inline Quality Control and Position Detection in Dispensing Systems

Feb 06, 2024 | Scheugenpflug

Quality monitoring for verifiable, high-precision application of adhesives and sealants now begins with detecting the position of the component. Dispensing systems are in continuous use and have to work with 100 percent accuracy. And this level of accuracy must be verifiable. Demands on electronic components continue to escalate as these components also need to operate continuously and flawlessly, especially in the automotive and medical sectors. At the same time, there is increasing pressure to automate as companies are looking to achieve the shortest possible cycle times and maximum output....

Publisher: Scheugenpflug Inc.

Scheugenpflug Inc.

Producer of bonding, dispensing and potting solutions with outstanding expertise in automation. As part of the Atlas Copco Group, we have a worldwide sales & service network and access to the Group's extensive technology portfolio

Kennesaw, Georgia, USA

Manufacturer

Moisture-Sensitive Components

Feb 05, 2024 | Robert Rowland

The topic of moisture-sensitive components is rather boring but very important -- and frequently misunderstood. Increased moisture-sensitive component use, such as thin fine-pitch devices and ball grid arrays (BGA), has increased concern for this failure mechanism. When components are exposed to the elevated temperatures that occur during reflow soldering, moisture trapped inside plastic surface mount devices (SMD) produces enough vapor pressure to damage or destroy the device. Common failure modes include internal separation (delamination) of the plastic from the die or lead-frame; wire bond damage; die damage; and internal cracks that do not extend to the component surface. In extreme cases, cracks will extend to the component surface; in the most severe cases, the component will bulge and pop (referred to as the "popcorn" effect)....

Publisher: Radisys Corporation

Radisys Corporation

Radisys Corpatioorn is an American technology company located in Hillsboro, Oregon, USA that makes technology used by telecommunications companies in mobile networks. Founded in 1987 in Oregon by former employees.of Intel.

Hillsboro, Oregon, USA

Manufacturer

Guidelines/recommendations "Drying of PCBs before soldering"

Feb 05, 2024 | ZVEI

Objective:  Drying = reducing the humidity in PCB before soldering  Preventing delamination caused by thermal stress after moisture absorption Methods:  Drying in convection and/ or vacuum oven  Parameters subject to material type, soldering surface, layer count, time to soldering, layout (copper-plated areas)...

Publisher: ZVEI - German Electro and Digital Industry Association

ZVEI - German Electro and Digital Industry Association

The ZVEI is one of the most important manufacturers' associations in Germany. It represents the interests of a high-tech branch with a very widely varied and extremely dynamic product portfolio.

Frankfurt am Main, Germany

Association / Non-Profit

A Bus Planning Algorithm for FPC Design in Complex Scenarios_2_Preliminaries  

Feb 03, 2024 | wangfeng

Flexible printed circuit(FPC) design in complex scenarios has a list of pin concentration areas, which lead to extremely congested intersection regions while connecting the pins.Currently,it is challengingto explore the routability and to find topologically non-cross-ing and routable paths manually for the nets timely. The existing bus planning methods cannot offer optimal solutions concerning the special resource distribution of FPC design.To investigate an effective way to shorten the routing time of FPC and achieve enhanced performance, a bus planning algorithm is proposed to tackle complex area connection problems. On the basis of the pin location in- formation, the routing space is partitioned and generally represented as an undirected graph, and the topological non-crossing relationship between different regions is obtained using the dynamic pin sequence. Considering the routability and electrical constraints, a heuristic algorithm is proposed to search the optimal location of the crossing point on the region boundary. Experimental results on industrial cases show that the proposed algorithm realize better performance in terms of count and routability in comparison with numerous selected state-of-the-art router and methods....

Publisher: FPCWay

FPCWay

Full feature custom flex PCB prototype service at low cost. FPCWay has been committed to meeting the needs of our customers by providing the best and most efficient flex PCB Manufacturer experience from flex pcb quote to deliver

Shenzhen, Guangdong, China

Consultant / Service Provider

A Bus Planning Algorithm for FPC Design in Complex Scenarios_1_Introduction

Feb 03, 2024 | wangfeng

Flexible printed circuit(FPC) design in complex  scenarios has a list of pin concentration areas, which lead to  extremely congested intersection regions while connecting the  pins.Currently,it is challengingto explore the routability and to find topologically non-cross-ing and routable paths manually for the nets timely. The existing bus planning methods cannot offer  optimal solutions concerning the special resource distribution of FPC design.To investigate an effective way to shorten the routing time of FPC and achieve enhanced performance, a bus planning algorithm is proposed to tackle complex area connection problems.  On the basis of the pin location in- formation, the routing space  is partitioned and generally represented as an undirected graph,  and the topological non-crossing relationship between different  regions is obtained using the dynamic pin sequence. Considering  the routability and electrical constraints, a heuristic algorithm is proposed to search the optimal location of the crossing point on the region boundary. Experimental results on industrial cases show that the proposed algorithm realize better performance in terms of count and routability in comparison with numerous selected state-of-the-art router and methods....

Publisher: FPCWay

FPCWay

Full feature custom flex PCB prototype service at low cost. FPCWay has been committed to meeting the needs of our customers by providing the best and most efficient flex PCB Manufacturer experience from flex pcb quote to deliver

Shenzhen, Guangdong, China

Consultant / Service Provider

Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer

Feb 02, 2024 | I.C.T

Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer In today's rapidly evolving electronics manufacturing landscape, optimizing efficiency, cost-effectiveness, and precision remains paramount. Businesses engaged in producing industrial control boards, computer motherboards, mobile phone motherboards, and mining machine boards face ongoing challenges in streamlining production processes. The integration of expensive equipment strains budgets, making the creation of an efficient, cost-effective high-speed SMT line a daunting task. However, a solution exists that seamlessly combines these elements into a singular, high-performance, and cost-effective SMT line. Let's delve into the specifics. A Comprehensive High-Speed SMT Line Our innovative solution amalgamates two pivotal components: a cutting-edge SMT (Surface Mount Technology) production line and a laser cutting line equipped with a depanelizer. The SMT Production Line The high-speed SMT line comprises several essential components, each fulfilling a unique role in the manufacturing process: 1. PCB Loader: This initial stage involves loading boards onto the production line with utmost care. Our Board Loader prioritizes safety, incorporating various safety light curtains and sensors to promptly halt operations and issue alerts in case of any anomalies. 2. Laser Marking Machine: Every PCB receives a unique two-dimensional code or barcode, facilitating comprehensive traceability. Despite the high-temperature laser process potentially leading to dust accumulation on PCB surfaces, our dedicated PCB Surface Cleaner swiftly addresses this issue. 3. SMT Solder Paste Printer: This stage involves applying solder paste to the boards, a fundamental step in the manufacturing process. 4. SPI (Solder Paste Inspection): Meticulous inspections are conducted at this stage. Boards passing inspection proceed through the NG (No Good) Buffer Conveyor to the module mounters. Conversely, "No Good" results prompt storage of PCBs in the NG Buffer Conveyor, capable of accommodating up to 25 PCBs. Operators can retrieve these NG boards for rework after utilizing our specialized PCB Mis Cleaner to remove solder paste. 5. Module Mounters: These machines excel in attaching small and delicate components, necessitating precision and expertise in the module mounting process. 6. Standard Pick And Place Machines: The selection of these machines is contingent upon your specific BOM (Bill of Materials) list. 7. Pre-Reflow AOI (Automated Optical Inspection): Boards undergo examination for component quality at this stage. Detected issues prompt the Sorting Conveyor to segregate boards for rework. 8. Reflow Oven: Boards undergo reflow soldering, with our Lyra series reflow ovens recommended for their outstanding features, including nitrogen capability, flux recycling, and water cooling function, ensuring impeccable soldering results. 9. Post-Reflow AOI: This stage focuses on examining soldering quality. Detected defects prompt the Sorting Conveyor to segregate boards for further inspection or rework. Any identified defects are efficiently addressed with the BGA rework station, maintaining the highest quality standards. 10. Laser Depanelizer: Boards advance to the laser depanelizer, where precision laser cutting, often employing green light for optimal results, ensures smoke-free, highly accurate separation of boards. 11. PCB Placement Machine: Cut boards are subsequently managed by the PCB Placement Machine, arranging them as required. With this, all high-speed SMT line processes are concluded. Efficiency And Output This production line demonstrates exceptional productivity when manufacturing motherboards with approximately 3000 electronic components, boasting the potential to assemble up to 180 boards within a single hour. Such efficiency not only enhances output but also ensures cost-effectiveness and precision in your manufacturing processes. At I.C.T, we specialize in crafting customized SMT production line solutions tailored to your product and specific requirements. Our equipment complies with European safety standards and holds CE certificates. For inquiries or to explore our exemplary post-sales support, do not hesitate to contact us. The I.C.T team is here to elevate your electronics manufacturing to new heights of efficiency and cost-effectiveness....

Publisher: I.C.T ( Dongguan ICT Technology Co., Ltd. )

I.C.T ( Dongguan ICT Technology Co., Ltd. )

I.C.T is a manufacturer from China that offers SMT, DIP, PCBA conformal coating equipment and turnkey solution.

Dongguan, Guangdong, China

Manufacturer

Critical Evaluation of Relative Importance of Stress and Stress Gradient in Whisker Growth in Sn Coatings

Jan 29, 2024 | PIYUSH JAGTAP, VIJAY A. SETHURAMAN, and PRAVEEN KUMAR

The role of stress state and stress gradient in whisker growth in Sn coatings electrodeposited on brass is examined. The bulk stress in Sn coatings was measured using a laser-optics-based curvature setup, whereas glancing angle x-ray diffraction was employed to quantify the stress near the surface; this also allowed studying the role of the out-of-plane stress gradient in whisker growth. Both bulk stress and near-surface stress in the Sn coating evolved with time, wherein both were compressive immediately after the deposition, and thereafter while the bulk stress monotonically became more compressive and subsequently saturated with aging at room temperature, the stress near the surface of the Sn coating continually became more tensile with aging. These opposing evolutionary behaviors of bulk and near-surface stresses readily reveals establishment of a negative out-of-plane stress gradient, which is required for the spontaneous growth of whiskers. The importance of the outof- plane stress gradient was also validated by externally imposing widely different stress states and stress gradients in Sn coatings using a 3-point bending apparatus. Additional whisker growth occurred in the coatings subjected to external tensile stress; however, this was accompanied by a higher negative out-of-plane stress gradient. The results conclusively demonstrate the important role of the negative out-of-plane stress gradient on whisker growth, as compared to only sign and magnitude of stress.

...

Publisher: Indian Institute of Science

Indian Institute of Science

The Indian Institute of Science is a public, deemed, research university for higher education and research in science, engineering, design, and management. It is located in the southern Indian city of Bangalore, Karnataka.

Bengaluru, Karnataka, India

Research Institute / Laboratory / School

Assembly and Rework of Lead Free Package on Package Technology

Jan 16, 2024 | Raymond G. Clark and Joseph D. Poole

Miniaturization continues to be a driving force in both integrated circuit packaging and printed circuit board laminate technology. In addition to decreasing component pitch (lead to lead spacing), utilization of the vertical space by stacking packages has found wide acceptance by both designers and manufactures of electronics alike. Lead free Package on Package (PoP) technology represents one of the latest advancements in vertical electronics packaging integration and has become the preferred technology for mobile hand held electronics applications. TT Electronics in Perry, Ohio has developed the capability to assemble and rework numerous "state of the art" packaging technologies. This paper will focus on the essential engineering development activities performed to demonstrate TT Electronics' ability to both assemble and rework PoP components....

Publisher: TT Electronics

TT Electronics

Solving technology challenges for a sustainable world Take a closer look at TT and you'll soon discover that the most important things we offer aren't manufactured...

Perry, Ohio, USA

Manufacturer

Unlocking Success in PCB Design: A Comprehensive Guide for Beginners

Jan 13, 2024 | Muhammad Aamir

Navigating the world of PCB design, fabrication, and assembly requires a blend of technical expertise and strategic planning. In this comprehensive guide, we delve into the fundamental principles of PCB design, offering valuable insights and tips for both beginners and experienced designers. From optimizing schematic designs to mastering component placement and routing techniques, this guide provides actionable advice to enhance your PCB projects. Beyond the design phase, the blog explores the critical aspects of reliable fabrication and assembly services. It introduces XLPCB, a leading PCB service provider in Pakistan, offering advanced solutions and expertise in tools like Eagle and KiCad. Discover the advantages of partnering with XLPCB, where a commitment to quality and precision ensures the success of your PCB projects. Embark on your PCB design journey armed with knowledge, tips, and the support of a trusted service provider. Visit XLPCB to elevate your projects and turn your design visions into reality....

Publisher: XLPCB

XLPCB

Your One-Stop Solution for Electronics Projects.From PCB Designing to Fabrication and Assembly. At XLPCB, we take pride in providing high-quality manufacturing of printed circuit board PCBA with the least lead time in the industry

Lahore Pakistan, Punjab, Pakistan

Manufacturer

Is soldering iron solder toxic?

Jan 09, 2024 | peak pcba

A netizen touted that he soldered in the PCB factory with a soldering iron for a whole year, are feeling the body began to feel uncomfortable, the abdomen is a bit bloated, solder is toxic? Is not lead poisoning. In fact, this also depends on the work with a soldering iron soldering leaded solder wire or lead-free, and the need for regular checks of blood lead, not exceeding the standard will not have a problem at all, solder is toxic? Normally speaking, if in accordance with national standards for protection and procurement of raw materials, solder will not cause significant harm. Nowadays, we basically use lead-free products. Lead is a toxic substance, the human body absorbs too much will cause lead poisoning, intake of low doses may have an impact on human intelligence, nervous system and reproductive system. The alloy of tin and lead, which is commonly used as solder, has good electrical conductivity of the metal and a low melting point, so it has long been used in the soldering process. Its toxicity comes mainly from lead. Lead fumes from soldering can easily lead to lead poisoning. Lead metal may produce lead compounds, all of which are classified as hazardous substances, and in humans lead affects the central nervous system and the kidneys. The environmental toxicity of lead to a number of organisms is well established. Blood lead concentration of 10μg/dl or more will produce sensitive biochemical effects, if long-term exposure to make the blood lead concentration of more than 60~70μg/dl will cause clinical lead poisoning. Lead is definitely toxic, not to mention his big or not, is the general metal, more will be poisoned, soldering, there will be smoke, which contains a harmful element to the body. When working, it is best to wear a mask, but more or less will be a little bit of an impact, of course, if you can use lead-free solder wire, will be more than leaded, to be much safer. Is lead-free solder toxic? Soldering with a soldering iron material solder wire, it is the main ingredient is tin, but also contains other metals. It is mainly divided into leaded and lead-free (i.e. environmentally friendly). With the introduction of the EU ROHS standard, now more and more PCB soldering factories choose the lead-free environmentally friendly, leaded solder wire is also slowly being replaced, not environmentally friendly out of the mouth. Lead-free solder paste, lead-free solder wire, lead-free solder bars are the main products on the market. Simply put: the harmful general use of solder because of the low melting point, containing lead 60%, containing about 40% tin, so the solder itself is toxic. Most of the solder on the market are hollow, filled with rosin, so the gas you said, it is estimated that the welding of rosin melting inside the solder volatilized out. Rosin volatile gas is also some slightly toxic, this gas is quite unpleasant. Solder in the welding of the most important hazardous factor is lead smoke, even lead-free solder, which contains more or less lead. Lead fume in GBZ2-2002 in the limit value is very low, very toxic, need to focus on protection. Due to the damage of the welding process on the human body and the environment, in Europe, the protection of welding workers and the protection of the environment has been enforced in the form of legislation, in the absence of how to protect the conditions of welding is not allowed. In the ISO14000 standard on the production process of pollution generated by the treatment and protection of clear provisions. Tin contains lead, lead in the previous solder wire soldering classified as an occupational hazard positions (in the National Occupational Disease Inventory); now we generally use lead-free solder wire, the main ingredient is tin, the CDC measured tin dioxide; and not in the National Occupational Disease Inventory. Lead-free process (leadfree) generally speaking, lead smoke is not excessive, but there are other hazards of solder, such as flux (rosin-like substances) have a certain degree of harm, depending on the specific circumstances to see. Employees can usually look at the distribution of the tin is what labeling, which belongs to which category, so that you can have evidence and require companies to rectify (you can give advice to the factory's internal trade unions). If the tin that is distributed contains lead, it is definitely harmful to the body. Over time, they accumulate in the body, the nervous system immune damage. Lead-free solder wire is environmentally friendly, but lead-free solder wire is also harmful to the human body. The low lead content of lead-free solder wire does not mean that it does not contain lead, and compared with lead-containing solder wire, lead-free solder wire is less polluting to the environment and the human body than lead-containing ones. The gas produced when soldering is toxic, there are rosin oil, zinc chloride and other gas vapors produced. Soldering iron soldering wire is toxic how to prevent: First of all PCB factories in the soldering iron soldering components to use ROHS tin wire, and to do a good job of prevention: for example, with gloves, masks or gas masks, the workplace attention to ventilation, exhaust system is good, pay attention to cleaning after the work, drink milk is also a way to prevent lead toxicity in the solder. 1. To rest for a period of time, generally take a break of about 1 hour and 15 minutes to relieve fatigue, because fatigue resistance is the worst; 2. Less smoking, drink more water, so that in the daytime can eliminate most of the harmful substances absorbed; 3. Drink green bean soup or honey water before going to bed This can reduce the fire on the mood to help, and green beans and honey can exclude the absorption of a large number of lead and radiation! 4. Can avoid radiation as much as possible to avoid, more use of the phone, less use of cell phones, out of no way to use a cell phone;   5. Can make the soldering iron a little brighter, try to use the PPD soldering head, so that the temperature reached, you can use less soldering oil and rosin, to reduce the harm to the body; 6. Soldering oil soldering smoke when you try to head to the side of the point, brush the time of the water to the side point of the head, try to hold your breath; 7. Less use of water, more use of alcohol, with alcohol more brush for a while the effect is almost the same; 8. To wash your hands; 9. Before going to bed to take a bath, try to go to bed early and get up early to ensure adequate sleep, as long as you sleep well, impurities can basically be discharged with the body; 10. Work with a mask....

Publisher: Shenzhen PEAK Technology Co., Ltd

Shenzhen PEAK Technology Co., Ltd

Military Certified PCB Fabrication & Circuit Board Assembly Manufacturer Custom PCB fabrication in as little as 8 hours – All you have to do is ask! 16 Years Of PCB Manufacturing - Serving Electronic Since 2001

Shenzhen, Guangdong, China

Manufacturer

How to Solve Impedance Matching Problems in PCB Designs

Jan 09, 2024 | peak pcba

In order to prevent reflection in the high-speed PCB design should be considered impedance matching, but due to the PCB processing process limits the impedance continuity and simulation can not be simulated, in the schematic design of how to consider this issue? In addition, regarding the IBIS model, I don't know where I can provide a more accurate IBIS model library. Most of the libraries we downloaded from the Internet are not very accurate, which affects the reference of simulation.   When designing a high speed PCB circuit, impedance matching is one of the design elements. The impedance value has absolute relationship with the way of routing, for example, whether it is in the surface layer (microstrip) or inner layer (stripline/double stripline), and the distance from the reference layer (power layer or ground layer), the width of the route, the PCB material, etc. will affect the characteristic impedance value of the route. In other words, the impedance value can only be determined after the wiring is done. General simulation software will be due to the line model or the use of mathematical algorithms can not take into account the limitations of some of the impedance discontinuity of the wiring, which can only be reserved on the schematic diagram of the terminators (termination), such as series resistance to ease the effect of discontinuity of the impedance of the alignment. The real fundamental solution to the problem is to try to avoid the occurrence of impedance discontinuity when wiring. The accuracy of the IBIS model directly affects the simulation results. Basically, IBIS can be regarded as the electrical characteristics of the equivalent circuit of the actual chip I/O buffer, which can be converted from the SPICE model (measurement can also be used, but with more limitations), and the SPICE information has an absolute relationship with the chip manufacturing, so the same device is supplied by different chip makers, and the SPICE information is different, which will lead to a different information in the converted IBIS model. Therefore, the SPICE data of the same device provided by different chip manufacturers is different, and the data in the converted IBIS model will also be different. That is to say, if you use the device of vendor A, only they have the ability to provide accurate modeling information of their devices, because no one else will know better than them what kind of process their devices are made of. If the IBIS provided by the vendor is inaccurate, the only way to solve the problem is to keep asking the vendor to improve it.   In high-speed PCB design, we use the software is only to set up a good EMC, EMI rules for checking, and the designer should be from those aspects to consider EMC, EMI rules? How to set the rules?   General EMI/EMC design need to consider both radiation (radiated) and conduction (conducted) two aspects. The former belongs to the higher frequency part (>30MHz) and the latter is the lower frequency part (<30MHz). So you can't just focus on the high frequencies and ignore the low frequencies. A good EMI/EMC design must start with a layout that takes into account the location of devices, PCB iterations, important connections, device selection, etc. If this is not done properly beforehand, it will be twice as expensive to fix it later. For example, the clock generator should be located as close as possible to the external connectors. High-speed signals should be routed in the inner layer as much as possible, and attention should be paid to the characteristic impedance matching and the continuity of the reference layer in order to minimize reflections. The slope of the signals pushed by the device should be as small as possible in order to minimize the high-frequency components. When choosing decoupling/bypass capacitors, attention should be paid to whether the frequency response is up to the requirement in order to reduce the noise of the power supply layer. . In addition, pay attention to the return path of the high-frequency signal current so that the loop area is as small as possible (that is, the loop impedance loop impedance is as small as possible) to reduce the radiation. Can also be used to divide the ground layer in order to control the scope of high-frequency noise. Finally, the appropriate choice of PCB and shell grounding....

Publisher: Shenzhen PEAK Technology Co., Ltd

Shenzhen PEAK Technology Co., Ltd

Military Certified PCB Fabrication & Circuit Board Assembly Manufacturer Custom PCB fabrication in as little as 8 hours – All you have to do is ask! 16 Years Of PCB Manufacturing - Serving Electronic Since 2001

Shenzhen, Guangdong, China

Manufacturer

MOISTURE PHYSICS AND PROCESS OF DRYING OF PRINTED CIRCUIT BOARDS

Jan 08, 2024 | Würth Elektronik GmbH & Co. KG

The aim of this collection and interpretation is to develop an understanding of moisture in materials, especially in printed circuit boards, to know the effects on further processing and to be able to derive targeted corrective actions when moisture-related problems occur. In principle, the considerations are valid for all types of PCBs. Although these basic principles are of particular importance when working with flexible and rigid-flexible printed circuit boards; observing them can mean the difference between success or failure....

Publisher: Würth Elektronik GmbH & Co. KG

Würth Elektronik GmbH & Co. KG

We produce circuit boards from your specifications in various designs.

Niedernhall, Germany

Consultant / Service Provider, Manufacturer

Drying and storage recommendation for printed circuit boards

Jan 08, 2024 | ILFA GmbH

Printed circuit boards, especially multilayer, flexible and rigid-flexible printed circuit boards, are extremely hygroscopic, i.e. they absorb and bind the moisture in the air. A dried polyimide film, for example, will have reached its moisture saturation level again after just a few hours....

Publisher: ILFA GmbH

ILFA GmbH

High-Tech-PCBs of ILFA – We connect your innovations. The owner and founder operated company ILFA has developed and manufactured PCB´s for 41 years.

Hannover, Germany

Manufacturer

Revolution in PCB Manufacturing: A Dive into Advanced SMT Techniques

Dec 29, 2023 | Muhammad Sannan Ali

The SMT/PCB assembly industry is undergoing a paradigm shift, and XLPCB is at the forefront of this transformation. By embracing advanced technologies, prioritizing quality, and maintaining a commitment to sustainability, XLPCB is not just manufacturing PCBs; we are engineering the future of electronics. Explore the XLPCB advantage and witness the evolution of PCB manufacturing excellence. Visit our website to learn more about how XLPCB is leading the charge in delivering cutting-edge solutions for your electronic manufacturing needs....

Publisher: XLPCB

XLPCB

Your One-Stop Solution for Electronics Projects.From PCB Designing to Fabrication and Assembly. At XLPCB, we take pride in providing high-quality manufacturing of printed circuit board PCBA with the least lead time in the industry

Lahore Pakistan, Punjab, Pakistan

Manufacturer

Revolutionizing Tech: SMT Auto IC Programming Machine Mastery

Dec 27, 2023 | I.C.T Team

Background Of SMT Auto IC Programming Machines In the dynamic landscape of electronics manufacturing, SMT Auto IC Programming Machines, also known as IC Programmers, have become indispensable tools. These machines play a crucial role in the semiconductor industry, addressing the escalating demand for efficient programming tools as electronic devices become more intricate. Specifically designed to load firmware or programs onto integrated circuits (ICs), these machines ensure the functionality of ICs and facilitate their seamless integration into various electronic applications. Significance Of SMT Auto IC Programming Machines The significance of SMT Auto IC Programming Machines lies in their ability to streamline the manufacturing process of electronic devices. ICs, ranging from microcontrollers to memory chips, serve as the central processing units in electronic systems. IC Programming Machines enable the customization of these ICs, allowing manufacturers to program specific functionalities, update firmware, and adapt to diverse applications. Furthermore, these machines contribute significantly to the rapid development of new products. In a market where time-to-market is critical, IC Programming Machines provide the flexibility to quickly program different ICs, reducing production lead times and enhancing overall efficiency. Operational Principles Of IC Programming Machines Hardware Architecture SMT Auto IC Programming Machines consist of a sophisticated hardware architecture comprising a controller, socket, pin detection system, and additional peripherals. The controller acts as the brain, orchestrating the programming process, while the socket provides a connection interface for the IC. Programming Algorithms At the core of IC Programming Machines are various programming algorithms encompassing essential operations such as erasure, writing, and verification. The choice of algorithms depends on the specific requirements of the IC and the desired functionality. Communication Protocols Effective communication between the IC Programming Machine and the target IC is facilitated by standardized communication protocols such as JTAG, SPI, and I2C. The selection of a particular protocol is influenced by factors such as data transfer speed, complexity, and compatibility with the IC. Advanced Features And Characteristics Equipped with advanced features like parallel programming, support for multiple ICs, and online programming, IC Programming Machines elevate their capabilities, enhancing production efficiency and flexibility. Practical Applications IC Programming Machines find practical applications across various industries, from automotive electronics to consumer electronics. Case studies illustrate how these machines contribute to improved production workflows and product quality by ensuring programmed ICs meet specific application requirements. Future Trends Looking ahead, the future of SMT Auto IC Programming Machines holds exciting prospects. Anticipated trends include advancements in programming speed, support for emerging communication protocols, and increased integration with smart manufacturing systems. These developments aim to address the evolving demands of the electronics industry. I.C.T-910 Programming Machine Invest in the I.C.T-910 for an efficient and reliable IC programming experience. The I.C.T-910 complies with European safety standards, holding a CE certificate that attests to its quality and adherence to safety regulations. Our skilled engineers at I.C.T are committed to ensuring your success by providing professional training and assistance with equipment installation. I.C.T: Your Comprehensive SMT Equipment Provider I.C.T stands as a comprehensive SMT equipment provider, offering end-to-end solutions for your SMT production line needs. Tailoring services to your specific requirements and product specifications, we conduct a thorough analysis to determine the precise SMT equipment that suits your needs. Our commitment is to deliver the highest quality and cost-effective solutions, ensuring optimal performance and efficiency for your production processes. Partner with I.C.T for a customized approach to SMT equipment that aligns perfectly with your manufacturing goals. Contact us for an inquiry today....

Publisher: I.C.T ( Dongguan ICT Technology Co., Ltd. )

I.C.T ( Dongguan ICT Technology Co., Ltd. )

I.C.T is a manufacturer from China that offers SMT, DIP, PCBA conformal coating equipment and turnkey solution.

Dongguan, Guangdong, China

Manufacturer

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