Electronics Manufacturing Technical Articles

Materials Used For Laser Cut Mesh Components

Jul 25, 2024 | A-Laser

A list of materials often used in laser cutting to produce mesh components....

Publisher: A-Laser, Inc.

A Word About SomaBlack Material

Jul 24, 2024 | A-Laser

What is SomaBlack material and applications....

Publisher: A-Laser, Inc.

Effect of Thermal via Design on Heat Dissipation of High-Lead QFN Packages Mounted on PCB

Jul 24, 2024 | Ziyi Yuan, Dongyan Ding and Wenlong Zhang

The quad flat no-lead package (QFN) is widely used in integrated circuits due to its
advantages in performance and cost. With the increasing power of electronic products, effective
heat dissipation from QFN packages has become crucial to prevent product damage. The focus of
this study is to investigate the thermal performance of QFN packages soldered onto printed circuit
boards (PCB) by finite element analysis (FEA). Conventional QFN, dual-row QFN, and high-lead
QFN packages were modeled and compared by ANSYSY software. The effect of thermal via design
(the distance, number, distribution, diameter, and thickness of thermal vias) on the QFN package
was investigated. The study revealed that the high-lead QFN package consistently demonstrated
superior heat dissipation performance than the other two under different conditions. Placing thermal
vias closer to the heat source enhances heat dissipation efficiency. Thermal vias positioned beneath
the thermal pad were particularly effective. Increasing thermal via quantity and diameter improved
heat dissipation, with square distribution layouts showing advantages. However, excessive copper
plating thickness can increase thermal resistance and hinder heat dissipation.

Publisher: Shanghai Jiao Tong University

CORRELATION BETWEEN CALCULATION AND PRACTICE FOR SIMPLE TOP-TO-BOTTOM PCB HEAT DISSIPATION USING TIM & VIAS

Jul 24, 2024 | Andreas Nadler, Markus Eberle

A study of the Thermo Design PCB Indicates The better the performance of the heatsink (=low Rth), the more influence the TIMs have  The thickness of a TIM is often more critical than the thermal conductivity of the material  The thermal resistance of the surface between the materials are most critical  Better use many small vias than a few big vias!  Plated or filled vias are very expensive to get, better try to stay with standard!...

Publisher: Würth Elektronik GmbH & Co. KG

THE IMPACT OF VIA AND PAD DESIGN ON QFN ASSEMBLY

Jul 24, 2024 | Jennifer Nguyen, David Geiger and Anwar Mohammed

Quad Flat No-Lead (QFN) packages has become very popular in the industry and are widely used in many products. These packages have different size and pin counts, but they have a common feature: thermal pad at the bottom of device. The thermal pad of the leadless QFN provides efficient heat dissipation from the component to PCB. In many cases, arrays of the thermal via under the component is used to dissipate heat from the device. However, thermal vias can create more voids or result in solder protrusion onto the secondary side....

Publisher: Flex (Flextronics International)

Pad Design and Process for Voiding Control at QFN Assembly

Jul 24, 2024 | Derrick Herron, Dr. Yan Liu, and Dr. Ning-Cheng Lee

Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size, such as a near die size footprint, thin profile, and light weight; (2) easy PCB trace routing due to the use of perimeter I/O pads; (3) reduced lead inductance; and (4) good thermal and electrical performance due to the adoption of exposed copper die-pad technology. These features make the QFN an ideal choice for many new applications where size, weight, electrical, and thermal properties are important. However, adoption of QFN often runs into voiding issue at SMT assembly. Upon reflow, outgassing of solder paste flux at the large thermal pad has difficulty escaping and inevitably results in voiding. It is well known that the presence of voids will affect the mechanical properties of joints and deteriorate the strength, ductility, creep, and fatigue life. In addition, voids could also produce spot overheating, lessening the reliability of the joints....

Publisher: Indium Corporation

Heat Sink Induced Thermomechanical Joint Strain in QFN Devices

Jul 24, 2024 | Gerard McVicker, Vijay Khanna, and Sri M. Sri-Jayantha

A blade server system (BSS) utilizes voltage regulator modules (VRMs), in the form of quad flat no-lead (QFN) devices, to provide power distribution to various components on the system board. Depending on the power requirements of the circuit, these VRMs can be mounted as single devices or banked together. In addition, the power density of the VRM can be high enough to warrant heat dissipation through the use of a heat sink. Typically, at field conditions (FCs), the BSS are powered on and off up to four times per day, with their ambient temperature cycling between 258C and 808C. This cyclical temperature gradient drives inelastic strain in the solder joints due to the coefficient of thermal expansion (CTE) mismatch between the QFN and the circuit card. In addition, the heat sink, coupled with the QFN and the circuit card, can induce additional inelastic solder joint strain, resulting in early solder joint fatigue failure. To understand the effect of the heat sink mounting, a FEM (finite element model of four QFNs mounted to a BSS circuit card was developed. The model was exercised to calculate the maximum strain energy in a critical joint due to cyclic strain, and the results were compared for a QFN with and without a heat sink. It was determined that the presence of the heat sink did contribute to higher strain energy and therefore could lead to earlier joint failure. Although the presence of the heat sink is required, careful design of the mounting should be employed to provide lateral slip, essentially decoupling the heat sink from the QFN joint strain. Details of the modeling and results, along with DIC (digital image correlation) measurements of heat sink lateral slip, are presented....

Publisher: IBM Corporation

The Case for Laser Wire Stripping Machines

Jul 22, 2024 | Laser Wire Solutions

Find out more about the importance of these machines in ensuring compliance with industry standards and enhancing product quality....

Publisher: Laser Wire Solutions

Seamless Integration for Enhanced Wire Processing

Jul 22, 2024 | Laser Wire Solutions

This article delves into the integration possibilities of the Mercury-4, highlighting how it can enhance productivity and efficiency in wire processing operations....

Publisher: Laser Wire Solutions

High Volume Manufacturing

Jul 17, 2024 | A-Laser

A review of what High Volume Manufacturing is and the support systems needed in support....

Publisher: A-Laser, Inc.

Acid Cleaning-Benefits, Risks, Types of Acids, Types of Metals

Jul 15, 2024 | A-Laser

Description of acid cleaning, what it is and the risks and benefits of using it. Types of metals used for and types of acids....

Publisher: A-Laser, Inc.

Transforming LED Manufacturing: I.C.T Engineers Set Up Complete Production Line in Tajikistan

Jul 15, 2024 | I.C.T SMT Machine

Curious about setting up a state-of-the-art LED production line from 0 to 1? I.C.T recently deployed two of our top engineers to Tajikistan, where they successfully installed and trained a major client on three SMT lines, a fully SMT production line, a LED Lens production line, a PCBA coating line, and a fully automated LED bulb assembly line. This comprehensive, turnkey solution showcases I.C.T's unmatched capability in providing end-to-end LED production solutions. Click to discover how we can help you transform your manufacturing capabilities and lead your market with our innovative technology and expertise. More details, pls visit: https://www.smtfactory.com/one-stop-smart-factory-solution-for-led-lighting-manufacturing-in-tajikistan.html...

Publisher: I.C.T ( Dongguan ICT Technology Co., Ltd. )

CNC Laser Cut Parts

Jul 09, 2024 | A-Laser

A review of what are CNC laser cut parts. How does A-laser provide support for these types of projects?...

Publisher: A-Laser, Inc.

What To Expect When Laser Cutting Stainless Steel

Jul 08, 2024 | A-Laser

Typical Expectations when laser cutting stainless steel....

Publisher: A-Laser, Inc.

3 axis two 2 component ccd visual glue dispensing machine automatic AB glue epoxy resin dispenser mixing potting machine robot

Jul 06, 2024 | KPD automatic-

3 axis two 2 component ccd visual glue dispensing machine automatic AB glue epoxy resin dispenser mixing potting machine robot #mixing #metering #Pouring #potting #dispensing #Dosing #encapsulating #spraying #sealing #filling #casting equipment...

Publisher: Kapton Automation Equipment (Guangzhou) Co., Ltd

Peek Material and What industries Use It

Jul 02, 2024 | A-Laser

What is Peek and how is it used in industry applications....

Publisher: A-Laser, Inc.

Grafoil Material-What is it and How it is Used.

Jul 01, 2024 | A-Laser

Informative overview of Grafoil material....

Publisher: A-Laser, Inc.

SOMABLACK

Jun 28, 2024 | Abby Young

SOMABLACK, produced by Somar Corporation, is rapidly becoming the top choice for many applications that require low to zero light reflectivity. It is a polyester-based material, mixed with black carbon to create something that both shades light and reduces reflection, while also having excellent dimensional stability. It is available in a range of options, with varying thicknesses, specular glossiness, optical density, and coatings....

Publisher: A-Laser, Inc.

UV Lasers and Kapton

Jun 26, 2024 | A-Laser

How UV lasers cut Kapton and where you can find more information about it....

Publisher: A-Laser, Inc.

Effects of Flux and Reflow Parameters on Lead-Free Flip Chip Assembly

Jun 23, 2024 | Sandeep Tonapi, Peter Borgesen, Ph.D. K. Srihari, Ph.D

The melting temperatures of most lead-free solder alloys are somewhat higher than that of eutectic Sn/Pb solder, and many of the alloys tend to wet typical contact pads less readily. This tends to narrow down the fluxing and mass reflow process windows for assembly onto typical organic substrates and may enhance requirements on placement accuracy. Flip chip assembly here poses some unique challenges. The small dimensions provide for particular sensitivities to wetting and solder joint collapse, and underfilling does not reduce the demands on the intermetallic bond strength. Rather, the need to underfill lead to additional concerns in terms of underfill process control and reliability. Relatively little can here be learned from work on regular SMT components, BGAs or CSPs....

Publisher: Binghamton University

EFFECT OF PROCESS THERMAL HISTORY ON THE MICROSTRUCTURE OF COPPER PILLAR SnAg SOLDER JOINTS

Jun 23, 2024 | Mohammed Genanu, Jim Wilcox , Eric Cotts, Jae Joon Choi, Ki Seok Kim

Two extremes of reflow time scale for copper pillar flip chip solder joints were explored in this study. Sn-2.5Ag solder capped pillars were joined to laminate substrates using either conventional forced convection reflow or the controlled impingement of a defocused infrared laser. The laser reflow joining process was accomplished with an order of magnitude reduction in time above liquidus and a similar increase in solidification cooling rate. The brief reflow time and rapid cooling of a laser impingement reflow necessarily affects all time and temperature dependent phenomena characteristic of reflowed molten solder. These include second phase precipitate dissolution, base metal (copper) dissolution, and the extent of surface wetting. This study examines the reflow dependent microstructural aspects of flip chip Sn-Ag joints on samples of two different size scales, the first with copper pillars of 70μm diameter on 120μm pitch and the second with 23μm diameter pillars on a 40μm pitch. The length scale of Pb-free solder joints is known to affect the Sn grain solidification structure; Sn grain morphology will be noted across both reflow time and joint length scales. Sn grain morphology was further found to be dependent on the extent of surface wetting when such wetting circumvented the copper diffusion barrier layer. Microstructural analysis also will include a comparison of intermetallic structures formed; including the size and number density of second phase Ag3Sn precipitates in the joint and the morphology and thickness of the interfacial intermetallics formed on the pillar and substrate surfaces....

Publisher: Binghamton University

Metal Plating Services

Jun 21, 2024 | Abby Young

Explanation of metal plating services and its benefits...

Publisher: A-Laser, Inc.

Case study: Precise Coating on Electronic Hearing Devices

Jun 20, 2024 | Nordson Electronics Solutions

A leading electronic hearing device manufacturer reduced UV precise coating cycle time by 79% with advanced automation. A manual process of hand brushing UV coating onto components was replaced by an automated solution from Nordson to increase production volumes, improve quality, and reduce costs for this complex application. Download the paper to learn the details of the application....

Publisher: ASYMTEK Products | Nordson Electronics Solutions

Component Reliability After Long Term Storage

Jun 19, 2024 | R. R. Madsen

Each year the semiconductor industry routes a significant volume of devices to recycling sites for no reliability or quality rationale beyond the fact that those devices were stored on a warehouse shelf for two years. This study identifies the key risks attributed to extended storage of devices in uncontrolled indoor environments and the risk mitigation required to permit safe shelf-life extension. Component reliability was evaluated after extended storage to assure component solderability, MSL stability and die surface integrity. Packing materials were evaluated for customer use parameters as well as structural integrity and ESD properties. Results show that current packaging material (mold compound and leadframe) is sufficiently robust to protect the active integrated circuits for many decades and permit standard reflow solder assembly beyond 15 years. Standard packing materials (bags, desiccant, and humidity cards) are robust for a 32 month storage period that can be extended by repacking with fresh materials. Packing materials designed for long term storage are effective for more than five years....

Publisher: Texas Instruments

Guidelines for the Long-Term Storage of Components, Subasseemblies and Devuces

Jun 19, 2024 | ZVEI-German Electro and Digital Industry Association

These guidelines on long-term storage are intended to help develop a supply strategy for components which need to be warehoused, processed and used beyond ......

Publisher: ZVEI - German Electro and Digital Industry Association

EFFECTS OF STORAGE ENVIRONMENTS ON THE SOLDERABILITY OF NICKELPALLADIUM-GOLD FINISH WITH Pb-BASED AND PbFREE SOLDERS

Jun 19, 2024 | Edwin Lopez, Paul Vianco, Samuel Lucero, and Carly George

The solderability of a nickel-palladium-gold (Ni-Pd-Au) finish on a Cu substrate was evaluated for the Pb-free solder, 95.5Sn-3.9Ag-0.6 Cu (wt.%, abbreviated Sn-Ag-Cu) and the eutectic 63Sn-37 Pb (Sn-Pb) alloy. The solder temperature was 245ºC. The flux was a rosin-based mildly activated (RMA) solution. The Ni-Pd-Au finish was tested in the as-fabricated condition as well as after exposure to one of the following accelerated storage (shelf life) regiments:...

Publisher: Sandia National Laboratories

What Is Laser Engraving

Jun 18, 2024 | A-Laser

An Introduction to laser engraving giving examples of applications....

Publisher: A-Laser, Inc.

What Is Laser Engraving?

Jun 18, 2024 | A-Laser

An introduction to laser engraving, with applications and why laser engraving is used....

Publisher: A-Laser, Inc.

High Precision Laser Cutting

Jun 14, 2024 | Abby Young

This type of laser cutting is the most successful and effective practice to achieve quality clean edges and superior products. As opposed to more traditional methods (water jets, punches), laser cutting allows the material to be processed once with extraordinary accuracy and without any other interventions to get a finished piece. It also allows for less waste and is less time consuming, resulting in cleaner production and the ability to manufacture in greater quantities. No matter how complex or straightforward, we achieve the precise, fine cut, details your company needs....

Publisher: A-Laser, Inc.

What is CNC Laser Cutting For PCB's and other materials

Jun 10, 2024 | A-Laser

A description of CNC laser cutting....

Publisher: A-Laser, Inc.

What is PCB Depaneling

Jun 07, 2024 | A-Laser

A description of laser PCB Depaneling, the technology used and benefits....

Publisher: A-Laser, Inc.

What is Laser Routing with Ablation

Jun 07, 2024 | A-Laser

A description of laser routing with ablation....

Publisher: A-Laser, Inc.

What is Laser Routing with Ablation

Jun 07, 2024 | A-Laser

A description of laser routing with ablation....

Publisher: A-Laser, Inc.

Gaskets For The Semi Conductor Industry

Jun 05, 2024 | A-Laser

What type of materials are being used for gaskets in the semi-conductor industry....

Publisher: A-Laser, Inc.

Interesting Materials Used For Gaskets

Jun 04, 2024 | A-Laser

A description of materials called Grafoil and Q-Pad, often used for gaskets....

Publisher: A-Laser, Inc.

Medical Device Laser Cutting: Applications

Jun 03, 2024 | A-Laser

How Laser cutting can support medical electronics singulation of PCB and for medical components....

Publisher: A-Laser, Inc.

Precision Aerospace Parts

May 31, 2024 | Abby Young

A-Laser enters the aerospace world with laser cutting services that continue to exceed performance expectations. The modern aerospace industry has strict tolerance requirements and A-Laser is prepared to meet those needs. For example, modern aerospace design dictates anywhere from dozens to millions of precise holes and channels. These must vary in thickness, diameters, and geometries. A-Laser is prepared to meet these requirements and we do so with faster, more versatile, more consistent and cost-effective tools....

Publisher: A-Laser, Inc.

Achieving Tight Tolerances

May 31, 2024 | Abby Young

A tight tolerance machine isn't necessarily a specific machine type. Rather, it's any machine capable of producing parts with precision tolerances. This means minimal variation in the final dimensions of the part. These cutting-edge tools are meticulously engineered to achieve exceptionally precise measurements within minuscule margins. This is accomplished with CNC, or computer numerical control, a manufacturing method that automates the movement of a machine and optimizes for precision. With technology and advanced techniques, these machines ensure that every component meets exact specifications, guaranteeing unparalleled accuracy in manufacturing processes....

Publisher: A-Laser, Inc.

Quality Laser Cut Parts

May 31, 2024 | Abby Young

We strive to produce quality parts for customers around the world looking for laser cutting precision. We are able to produce quality machined parts to the specifications provided by customers because of the strong quality system. Precision parts with tight laser cut hole tolerances cannot be done without our quality department. Supplying quality machined parts defines who we are and laser micromachining wouldn't be possible without it....

Publisher: A-Laser, Inc.

What Is A CNC Machine?

May 30, 2024 | A-Laser

Overview of what a CNC Machine is....

Publisher: A-Laser, Inc.

What is a CO2 Laser?

May 29, 2024 | A-Laser

An overview of what CO2 laser technology is....

Publisher: A-Laser, Inc.

Smart Determination of Gold Content in PCBs of Waste Mobile Phones by Coupling of XRF and AAS Techniques

May 28, 2024 | Nicolò Maria Ippolito , Gianmaria Belardi , Valentina Innocenzi , Franco Medici , Loris Pietrelli and Luigi Piga

: Quantitative determination of most economic valuable metals in waste is the first fundamental operation of evaluating the feasibility of recycling processes. Field-portable X-ray fluorescence
spectrometers (FPXRFs) represent a more practical, efficient, and economic tool in determining the
elemental composition of samples with respect to conventional analytical techniques, such as atomic
absorption spectrometry (AAS) and inductively coupled plasma emission spectrometry (ICP). In
this paper, quick and smart determination of gold content in printed circuit boards (PCBs) of waste
mobile phones was studied. The aim of the research was to combine the practicality of FPXRFs
with the reliability of quantitative spectrometry analysis and evaluate the error between the two
techniques. Several samples (33) of PCBs were ground to a size below 0.5 mm, and then, the powders
were analyzed by FPXRFs at different acquisition times with five replications for each sample. The
same analyzed samples then underwent chemical attack to determine the quantitative gold content
by AAS. The obtained results were associated with FPXRFs response with the purpose of realizing
a calibration curve (100–1000 mg/kg Au). The curve was validated for accuracy and precision by
other PCBs waste samples; the control samples were added as standards to obtain a more reliable calibration curve. The curve was evaluated with RPD classification, regression linear, and Bolt–Altman
analysis. 

Publisher: University of L'Aquila

Theory of XRF

May 28, 2024 | Peter Brouwer

This booklet gives a general introduction to X-Ray fluorescence (XRF) spectrometry and XRF analysis. It explains simply how a spectrometer works and how XRF analysis is done. It is intended for people new to the field of XRF analysis. Difficult mathematical equations are avoided and the booklet requires only a basic knowledge of mathematics and physics.

The booklet is not dedicated to one specific type of spectrometer or one application area, but aims to give a broad overview of the main spectrometer types and applications.

Chapter 2 briefly explains XRF and its benefits. Chapter 3 explains the physics of XRF, and Chapter 4 describes how this physics is applied to spectrometers and their components. Chapter 5 explains how an XRF analysis is done. It describes the process of sample taking, measuring the sample and calculating the composition from the measurement results.

Finally, Chapter 6 gives a list of recommended literature for further information on XRF analysis.

Publisher: Malvern Panalytical Ltd

Non-Destructive Characterization of Mechanically Processed Waste Printed Circuit Boards: X-ray Fluorescence Spectroscopy and Prompt Gamma Activation Analysis

May 28, 2024 | Akira Otsuki , Pedro Pereira Gonçalves , Christian Stieghorst and Zsolt Révay

This work aimed to characterize the deportment/concentration and liberation/association
of the metals and light elements within mechanically processed waste printed circuit boards (PCBs)
that hold the complex and heterogeneous structure and distribution of different material components.
Waste PCBs passed through a series of mechanical processing (i.e., comminution and sieving) for
metal recovery and were then characterized without further destroying the particles in order to
capture their heterogeneity. The characterizations were performed in a laboratory and large-scale
neutron facility. The results obtained with a portable X-ray fluorescence spectroscopy and prompt
gamma activation analysis were compared and confirmed the good agreement and complementarities
in general. The advantages and disadvantages of the two different methods were identified and
discussed in this paper, in relation to their application to the analysis of mechanically processed
PCB particles. 

Publisher: Université de Lorraine

Ultraviolet Laser Technology Overview

May 28, 2024 | A-Laser

Review of UV Laser Technology...

Publisher: A-Laser, Inc.

INTEGRATED MICRO X-RAY FLUORESCENCE AND CHEMOMETRIC ANALYSIS FOR PRINTED CIRCUIT BOARDS RECYCLING

May 28, 2024 | Silvia Serranti , Giuseppe Capobianco and Giuseppe Bonifazi

A novel approach, based on micro X-ray fluorescence (µXRF), was developed to define an efficient and fast automatic recognition procedure finalized to detect and
topologically assess the presence of the different elements in waste electrical and
electronic equipment (WEEE). More specifically, selected end-of-life (EOL) iPhone
printed circuit boards (PCB) were investigated, whose technological improvement
during time, can dramatically influence the recycling strategies (i.e. presence of
different electronic components, in terms of size, shape, disposition and related
elemental content). The implemented µXRF-based techniques allow to preliminary
set up simple and fast quality control strategies based on the full recognition and
characterization of precious and rare earth elements as detected inside the electronic boards. Furthermore, the proposed approach allows to identify the presence
and the physical-chemical attributes of the other materials (i.e. mainly polymers),
influencing the further physical-mechanical processing steps addressed to realize
a pre-concentration of the valuable elements inside the PCB milled fractions, before
the final chemical recovery

Publisher: Sapienza - University of Rome

Engineering Services

May 23, 2024 | A-Laser

Information on how A-Laser can help support your next laser manufacturing project....

Publisher: A-Laser, Inc.

Ultraviolet Laser Technology Overview

May 22, 2024 | A-Laser

This article reviews UV or ultraviolet laser technology. Is on method that can be used for laser depaneling or singulation for precision control....

Publisher: A-Laser, Inc.

Thick Film Printing Filter , size 6mmx10mm

May 17, 2024 | Max.

Applications: Realize standard thick film printing system, ceramic metallization printing, through hole metallization printing, flexible plate printing such as PET (with micro-hole vacuum printing platform), and solder paste printing of PCB. Features: Ø Automatic screen cleaning function Ø Lighting system:screen lighting, printing table lighting and backlight to check printing effect Ø Can be equipped with conventional center positioning fixture (ceramic substrate thickness >0.38mm) Ø Can be equipped with lifting type center positioning fixture (ceramic substrate >0.1mm) Specifications: Maximum Frame Size: 355x320mm Maximum Printing Area: 150 x 150mm...

Publisher: Wisdom Electronics Co,LTD.

Laser Drilling as an Alternative for Via & Microvia Drilling

May 16, 2024 | A-Laser

Much like actual cities where streets and roads connect buildings together, ICs on a board are connected to each other with copper traces. And just like any metropolitan city, urban expansion tends to move vertically instead of horizontally, but instead of multi-story buildings, we get multilayer boards. Vias are copper-plated holes spanning through the different layers of a given board or panel. They are the entrance locations to the subway stations, if you will. Having those multilayer boards has enabled electronic design to minimize the size of boards immensely without compromising on the complexity....

Publisher: A-Laser, Inc.