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Main Products: 1. Original new and Original Used SMT/AI Spare Parts. 2. SMT Equipments And Related Machine( SMT Calibration, SMT Feeder Carts,Conveyer etc.) 3. Maintenace and Repair Service Pre-Sales Service Provide details ab
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We are a global electronics manufacturing Solutions provider ....Our company supplies new and used SMT equipment, spare parts, consumibles, ESD supplies and services to a wide range of EMS companies.
juki 8mm feeder ATF05HP
Featured Items: Single 8mm tape Abrasive Block for Feeder Table Double side tape (8mm) SMT magazine rack Siemens Valve Plunger SP6 DST-8MM-00 (4)splice tape Stencil wiping rolls Splice Clip SMT tools,SMD tapes
Electronics Forum | Mon Jan 11 20:33:13 EST 1999 | Chris G.
I'm looking for a CABGA test socket for a 2 CABGAs. One 81 ball CABGA is 9mm x 9mm with .46 mm dia balls on .8mm pitch. The other is a 64 ball CABGA 8mm x 8mm with .46 mm dia balls on .8mm pitch. I need to pretest CABGAs before placement due to hi
Electronics Forum | Wed Oct 29 14:38:19 EDT 2008 | markhoch
Actually 0603 is 8mm x 4mm pitch. 0201 and 0402 are 8mm x 2mm pitch. 0603, 0805, 1206, 1210 are 8mm x 4mm pitch. Tant Caps 3216 & 3528 packages are 8mm X 4mm pitch. 6032 and 7343 are 12mm X 8mm pitch. ICs, Diodes, Transistors are various sizes and d
Used SMT Equipment | Pick and Place/Feeders
The machine includes the following: 3 Banks of 10 lines for 8mm 2 Bank of 4 lines for 8 mm 1- 12 mm 1 – 16 mm 1- 24 mm 1 Bank of 7 lines for 12 mm This gives a total of 38- 8mm, 9 – 12mm, 2 – 16mm and 2 – 24mm Also has a Tube feeder and a Tra
Used SMT Equipment | Pick and Place/Feeders
Wer have an urgent need for the following items. Any vintage will be considered. Qty. 50 8mm Dual Lane ion Tape Feeder Qty. 50 8MM DL 7" Ion Dual Reel Holder Qty. 25 (12mm feeders) 12MM SL ION TAPE FEEDER Qty. 25 12/16MM SL 7-15
Industry News | 2003-05-19 10:06:43.0
The PCB is available with a maximum panel size of 406-by-460mm and a minimum board thickness of 0.8mm.
Industry News | 2003-01-29 13:23:31.0
A Common Drain Configuration that is 80% Smaller than Devices in the TSSOP-8 Package
Parts & Supplies | Pick and Place/Feeders
TAPE HOLDER ASM. (FTF8mm～24mm)
Parts & Supplies | Pick and Place/Feeders
samsung CP45 8mm feeder CP45 8mm feeder
Technical Library | 2020-12-24 02:50:56.0
A method for packaging integrated circuit silicon die in thin flexible circuits has been investigated that enables circuits to be subsequently integrated within textile yarns. This paper presents an investigation into the required materials and component dimensions in order to maximize the reliability of the packaging method. Two die sizes of 3.5 mm×8 mm× 0.53 mm and 2 mm×2 mm×0.1 mm have been simulated and evaluated experimentally under shear load and during bending. The shear and bending experimental results show good agreement with the simulation results and verify the simulated optimal thickness of the adhesive layer. Three underfill adhesives (EP30AO, EP37-3FLF, and Epo-Tek 301 2fl), three highly flexible adhesives (Loctite 4860, Loctite 480, and Loctite 4902), and three substrates (Kapton,Mylar, and PEEK) have been evaluated, and the optimal thickness of each is found. The Kapton substrate, together with the EP37-3FLF adhesive, was identified as the best materials combination with the optimum underfill and substrate thickness identified as 0.05 mm.
Technical Library | 2020-10-27 02:07:31.0
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.
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