Industry Directory: .8mm pitch (2)

International Marketing Corporation

Industry Directory | Distributor

Representing Foreign Principals for their range of SMT / PCB Assembly equipments.

SMTBOX INC. - One Box, All SMT Spare Parts.

Industry Directory | Equipment Dealer / Broker / Auctions / Manufacturer / Marketing Agency / Other

SMTBOX supplies SMT feeders, SMT nozzles, SMT tools and SMT consumables to electronics manufacturing services companies globally and also has created win-win partnerships with SMT vendors and distributors to the worldwide.

New SMT Equipment: .8mm pitch (65)

Automatic splicing machine BMHP-08 BMHP-24

Automatic splicing machine BMHP-08 BMHP-24

New Equipment | Other

Automatic splicing machine BMHP-08 BMHP-24  It replaces manual labor to splicing,suitable for8-24mm splicing Tape  it has the function of Barcode comparison,detectsempty pockets of the component reels,Font&charactersprinting comparison,Systems inter

Qinyi Electronics Co.,Ltd

JUKI RS-1R Pick and Place Machine

JUKI RS-1R Pick and Place Machine

New Equipment | Pick & Place

JUKI RS-1R Pick and Place Machine Applicable Components: 0201~5050Board size:50×50-650×370mmFeeder inputs:max.112placement capacity:47,000 CPHProduct description: JUKI RS-1R Pick and Place Machine, Applicable Components: 0201~5050,Board size:50×50-6

Qersa Technology Co.,ltd

Electronics Forum: .8mm pitch (112)

yamaha feeder pitch calibration

Electronics Forum | Sun Jun 14 19:41:35 EDT 2020 | yakout

hello michal have a nice day i need to adjust the pitch from 4mm to 8mm

0.5 mm pitch BGA

Electronics Forum | Wed Mar 02 10:24:48 EST 2005 | Guest

Balls are 0.30 mm diameter, with a height of 0.24 mm It's a 8*8 mm 184 pins BGA.

Used SMT Equipment: .8mm pitch (66)

Samsung CP45FV multi-function chip mounter

Samsung CP45FV multi-function chip mounter

Used SMT Equipment | Flexible Mounters

Product Name: Samsung CP45FV multi-function chip mounter Product number: CP45FV Detailed product introduction Samsung CP45FV multi function placement: Mounting head: 6 mounting head Servo system: servo motor drive X, Y shaft - Z axis shift drive

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Samsung original CP45FV multi-function chip mounter

Samsung original CP45FV multi-function chip mounter

Used SMT Equipment | SMT Equipment

Product Name: Samsung CP45FV multi-function chip mounter Product number: CP45FV Detailed product introduction Samsung CP45FV multi function placement: Mounting head: 6 mounting head Servo system: servo motor drive X, Y shaft - Z axis shift drive

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry News: .8mm pitch (39)

Suggested 14 and 16 Layer Board Layouts

Industry News | 2018-10-18 10:43:28.0

Suggested 14 and 16 Layer Board Layouts

Flason Electronic Co.,limited

Count On Tools Inc. Introduces the StripFeeder Transition Rail

Industry News | 2015-09-10 16:45:40.0

Count On Tools has released a new accessory – the Transition Rail – for its award-winning line of StripFeeder products. Each StripFeeder Transition Rail features machined tracks for both paper and emboss tape on the same rail for a seamless transition.

Count On Tools, Inc.

Parts & Supplies: .8mm pitch (794)

Siemens SIPLACE X 8MM FEEDER SINGLE PITCH used

Siemens SIPLACE X 8MM FEEDER SINGLE PITCH used

Parts & Supplies | Pick and Place/Feeders

We supply the following SIEMENS feeders: Model Part Number SIEMENS SIPLACE X 8MM FEEDER SINGLE PITCH 00141270 00141290 SIEMENS SIPLACE X 8MM FEEDER DOUBLE PITCH 00141269 00141289 SIEMENS SIPLACE X 12MM FEEDER 00141271 00141291 SIEME

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Siemens X 08mm DUAL FEEDER

Siemens X 08mm DUAL FEEDER

Parts & Supplies | Pick and Place/Feeders

SIEMENS SIPLACE X 8MM FEEDER SINGLE PITCH 00141270 00141290 SIEMENS SIPLACE X 8MM FEEDER DOUBLE PITCH 00141269 00141289 SIEMENS SIPLACE X 12MM FEEDER 00141271 00141291 SIEMENS SIPLACE X 16MM FEEDER 00141272 00141292 SI

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Technical Library: .8mm pitch (1)

Solder Joint Reliability of Pb-free Sn-Ag-Cu Ball Grid Array (BGA) Components in Sn-Pb Assembly Process

Technical Library | 2020-10-27 02:07:31.0

For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.

Sanmina-SCI

Videos: .8mm pitch (27)

JUKI Feeder

JUKI Feeder

Videos

JUKI feeder calibration---ZK Electronic Technology Co., Limited

ZK Electronic Technology Co., Limited

I-Pulse F1-16mm FEEDER LG4-M5A00-080

Videos

We also can supply you other kinds of I-PULSE Feeders, Such as: F2-82-0603: Tape Feeder LG4-M2A00-02 8mm x 2mm pitch for 0201 (7" Reel) F1-82-1005: Tape Feeder LG4-M2A00-03 8mm x 2mm pitch for 0402 (7" Reel) F1-84 series: Tape Feeder LG4-M3A00-01

Qinyi Electronics Co.,Ltd

Express Newsletter: .8mm pitch (175)

Partner Websites: .8mm pitch (425)

SMT Used Samsung CP12mm Feeder Variable 4mm And 8mm Pitch , Steel Metal Material

KingFei SMT Tech | http://www.smtspare-parts.com/sale-9371939-smt-used-samsung-cp12mm-feeder-variable-4mm-and-8mm-pitch-steel-metal-material.html

SMT Used Samsung CP12mm Feeder Variable 4mm And 8mm Pitch , Steel Metal Material Leave a Message We will call you back soon! Your message must be between 20-3,000 characters

KingFei SMT Tech

Mydata/Mycronic Feeders TM8FC -8mm Fine pitch Magazine - Part# L14021C - Lewis and Clark

Lewis & Clark | http://www.lewis-clark.com/product/mydata-feeders-tm8fc-8mm-fine-pitch-magazine/

Mydata/Mycronic Feeders TM8FC -8mm Fine pitch Magazine - Part# L14021C - Lewis and Clark Skip to content My Cart:  0 View Cart Checkout No products in the cart. Subtotal

Lewis & Clark


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