Electronics Forum | Wed Aug 07 15:58:17 EDT 2024 | SMTA-64386252
Hello. Since a DFN is a BTC component, an end fillet height is not required on IPC 610 since most of these components did not have a wettable surface on the sides. A cross section in a non-touched up sample could be performed to validate the solder
Electronics Forum | Wed Jul 06 09:07:28 EDT 2016 | davef
Hi Pavel IPC-6012 - Qualification and Performance Specification for Rigid Printed Boards, Paragraph: Solder Resist (Solder Mask) Requirements, Sub-paragraph: Solder Resist Thickness has words to the effect … * Solder mask thickness shall be accordi
Electronics Forum | Fri Jul 29 02:50:18 EDT 2016 | pavel_murtishev
Hello, Could you please tell me what the latest Siemens F5HM software version is? Installed version we have is 407.03. It seems this software version does not support placement force adjustment for pick&place head that might be a critical point for
Electronics Forum | Sat Dec 02 10:23:47 EST 2017 | tomh
Have you ever heard of "Solder Mask Defined Thermal Pads"? I wrote a short blurb on this here - https://www.pcblibraries.com/forum/ipc7093a-btc-qfn-solder-mask-defined-thermal-pad_topic2154.html This technology saves fabrication costs by not havi
Electronics Forum | Mon Mar 11 06:49:42 EDT 2019 | SMTA-Bob
You problem will be related to the part type or the design. Standard 40 or 100 pin QFN or LGA parts are not going to drop due to weight as they are just a few grams. If you send a photo of the PCB pad footprint and the component separately I may be a
Electronics Forum | Sat Apr 27 09:47:27 EDT 2019 | SMTA-Joe
Hello SMTA, We currently use Solder Stencils for installation/rework of QFNs/BTCs, and have tremendous success with them. While they aren't overly expensive considering their high quality it does seem like a waste of money to purchase more screens
Electronics Forum | Tue Apr 30 10:14:43 EDT 2019 | SMTA-Joe
I wish I had that much power! They're always going to select components according to their needs, but I want to know if there are standard pad layouts (complete size/shape) that are shared between components so I can re-use some screens for multiple
Electronics Forum | Fri May 28 13:19:31 EDT 2021 | cbart
I can't see the image very well, but from what i see it looks like oxidation. looks like an ENIG finish on the board, possibly a plating issue from the bare board house, thin gold or the nickle is to thick. one other question i would get an answer t
Electronics Forum | Sat Jul 16 13:53:52 EDT 2022 | yannick_herzog
Hello all, we use a reflow oven from Rehm in our SMT production. At the moment we solder under nitrogen atmosphere (approx. 500ppm). Now we want to reduce the nitrogen consumption (costs etc.). What consequences can occur here? Especially on the s
Electronics Forum | Tue Apr 30 10:29:42 EDT 2019 | spoiltforchoice
Well to some extent, but with QFNs, device manufacturers seem to have really gone to town with inventing new shapes and sizes. So while you could certainly generalize a bit with QFPs with common shapes like a TQPFP100 for instance; thats harder with
