Industry Directory | Manufacturer
China PCB manufacturer.Rigid,aluminium,FPC.1-12 layers,Min.line/space:0.1mm min.hole:0.1mm,burried and blind hole
We manufacture multi PCB up to 12 layer,The details of our capabilities:*Micro fine line to 4 mil *Blind & buried via hole *Flying-probe testing *Carbonlack *FR4 thickness: 0.3/0.4/0.8/1.0/1.2/1.5/2.0/2.4/3.2mm *Small quantities are available *Golden finger *HAL & chemical tin
Refurbished Yamaha YV100X Pick and Place Machine MC Type YV100X PCB size L460 x W445 mm (Max.), L50 x W50 mm (Min.)or L460 x W335 mm Accuracy +-0.1 mm(Chips), +-0.08 mm Mounting Speed 0.198 sec/chips
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New Equipment | Solder Paste Stencils
DEK Horizon 03iX Fully Automatic Printer Model Horizon 03iX Operating System Win XP+09sp13 or up PCB support Tooling Magnetic tooling pins Camera type
Used SMT Equipment | Pick and Place/Feeders
Make: Juki Model: KE-2030 Features: OS: WIndows NT SW: 3.0.1.8 Chip Shooter Location: Camarillo, CA USA
Used SMT Equipment | Pick and Place/Feeders
Product number: KD - 775 Products in detail JUKI KD775 high-speed daub glue standardequipped with three dispensing head, achieved 0.1 seconds/launch daub adhesiveat a high speed. Stable quality standards are equipped witheven daub glue residual wi
Industry News | 2023-07-22 11:28:46.0
If need more technical support , pls contact with us at Jenny@ksunsmt.com
Industry News | 2023-07-03 20:08:24.0
IPC Issues June Economic Outlook Report
Technical Library | 2021-10-20 18:21:06.0
The solderability of the SAC305 alloy in contact with printed circuit boards (PCB) having different surface finishes was examined using the wetting balance method. The study was performed at a temperature of 260 _C on three types of PCBs covered with (1) hot air solder leveling (HASL LF), (2) electroless nickel immersion gold (ENIG), and (3) organic surface protectant (OSP), organic finish, all on Cu substrates and two types of fluxes (EF2202 and RF800). The results showed that the PCB substrate surface finish has a strong effect on the value of both the wetting time t0 and the contact angle h. The shortest wetting time was noted for the OSP finish (t0 = 0.6 s with EF2202 flux and t0 = 0.98 s with RF800 flux), while the ENIG finish showed the longest wetting time (t0 = 1.36 s with EF2202 flux and t0 = 1.55 s with RF800 flux). The h values calculated from the wetting balance tests were as follows: the lowest h of 45_ was formed on HASL LF (EF2202 flux), the highest h of 63_ was noted on the OSP finish, while on the ENIG finish, it was 58_ (EF2202 flux). After the solderability tests, the interface characterization of cross-sectional samples was performed by means of scanning electron microscopy coupled with energy dispersive spectroscopy.
Technical Library | 2021-09-08 13:57:37.0
While the presence of silver in SAC solder provided excellent temperature cycling durability, the silver in high silver SAC alloy also made the solders susceptible to failures under drop/shock loading. To improve the drop/shock reliability, the silver content in SAC alloys was reduced from three percent, to as low as no silver. Solder dopants, also known as microalloy additions, are elements (typically 0.1% or lower) other than the main constituents of the alloy that have been shown to improve solder performance. Commonly used microalloy additions include nickel (Ni), bismuth (Bi), manganese (Mn), and antimony (Sb).
DEK Horizon 03iX Fully Automatic Printer Model Horizon 03iX Operating System Win XP+09sp13 or up PCB support Tooling Magnetic tooling pins Camera type
MPM UP2000 HiE Screen Printer Substrate treatment Minimum/maximum size 2"x 2"(50.0 mm x50.0 mm) to 20" x 16" (508 mm x 406 mm)(16 "or larger substrate requires special clamps
Events Calendar | Mon Feb 24 18:30:00 UTC 2020 - Mon Feb 24 18:30:00 UTC 2020 | Boxborough, Massachusetts USA
Chapter Technical Meeting: Challenges and Opportunities in Shrinking RDL Features: Microstructure Control of Copper Deposits for Improved Fill and Reliability
International Microelectronics Assembly and Packaging Society (IMAPS)
Career Center | EDEN PRAIRIE, Minnesota USA | Production
Logic PD collaborates with clients to help them launch products that accelerate growth and capture value in the Internet of Things (IoT). Logic PD helps at any stage in the product lifecycle by being the complete product innovation and product realiz
SMT Express, Issue No. 4 - from SMTnet.com Volume 1, Issue No. 4 Tuesday, September 14, 1999 Featured Article Return to Previous Page MULTILAYER BOARD (MLB) CONSTRUCTIONS FOR HIGHEST LAMINATE INTEGRITY, DIMENSIONAL STABILITY, AND ELECTRICAL
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/dage/products/x-ray-inspection-systems/quadra-7-x-ray-inspection-system
Röntgeninspektionsleistung zeigt Ihnen Quadra 7 zerstörungsfrei Eigenschaften und Defekte bis zu einer Größe von 0,1 µm. Auf dem neuesten Stand der Röntgeninspektionsleistung zeigt Ihnen Quadra 7
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_hp3070.html
!------------- REMOVE TEXT ABOVE THIS LINE ----------------- ! ! CONFIGURATION FOR TESTHEAD ! testhead name "testhead1" line frequency 60 relay 1 controls vacuum 2,3 relay 2 controls vacuum 0,1 !Bank 1 ! module 0
