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Samsung SM320 Pick and Place Machine

Samsung SM320 Pick and Place Machine

New Equipment | Pick & Place

http://www.flason-smt.com/product/Samsung-SM320-Pick-and-Place-Machine.html Samsung SM320 Pick and Place Machine Samsung SM320 Pick and Place Machine Chip theoretical speed :18500CPH PCB size 510 * 460 Mounting range 0402mm Chip ~ 55mm IC Pro

Flason Electronic Co.,limited

Samsung SM320 Pick and Place Machine

Samsung SM320 Pick and Place Machine

New Equipment | Pick & Place

Samsung SM320 Pick and Place Machine Samsung SM320 Pick and Place Machine Chip theoretical speed :18500CPH PCB size 510 * 460 Mounting range 0402mm Chip ~ 55mm IC Product description: Samsung SM320 Pick and Place Machine -Good Price! Good Qua

Flason Electronic Co.,limited

SAKI AOI BF-10Z

SAKI AOI BF-10Z

New Equipment | Test Equipment

SAKI AOI BF-10Z Resolution 10μm, 20μm Board size:686 W x 870 L mm Dimension:​1500x 1360x 1380mm weight:530 Kg Product description: SAKI AOI BF-10Z XL size panel capabilities, inline, and 2 resolution modes, Resolution 10μm, 20μm,

Flasonsmt Co.,ltd

SAKI AOI BF-10Z

SAKI AOI BF-10Z

New Equipment | Test Equipment

SAKI AOI BF-10Z Resolution 10μm, 20μm Board size:686 W x 870 L mm Dimension:​1500x 1360x 1380mm weight:530 Kg Product description: SAKI AOI BF-10Z XL size panel capabilities, inline, and 2 resolution modes, Resolution 10μm, 20μm, B

Flasonsmt Co.,ltd

SAKI AOI BF-10Z

SAKI AOI BF-10Z

New Equipment | Inspection

SAKI AOI BF-10Z Resolution 10μm, 20μm Board size:686 W x 870 L mm Dimension:​1500x 1360x 1380mm weight:530 Kg Product description: SAKI AOI BF-10Z XL size panel capabilities, inline, and 2 resolution modes, Resolution 10μm, 20μm, Board size:68

qismt electronic co.,ltd

SAKI Inspection AOI BF-10Z

SAKI Inspection AOI BF-10Z

New Equipment | Inspection

SAKI Inspection AOI BF-10Z Resolution: 10μm, 20μm Board size: 686 W x 870 L mm Dimension:​ 1500x 1360x 1380mm weight: 530 Kg  INQUIRY SAKI Inspection AOI BF-10Z Specifications: The SAKI AOI BF-10Z was developed especially for manufacturers

Fomyn Equipment co,.ltd

uBGA stencil design

Electronics Forum | Wed Feb 22 08:02:56 EST 2006 | dj44

I was looking for an stencil design for a 0.5mm pitch uBGA. Pad size is 0.38mm in diameter. We have been using 5mil stencil with type 3 no clean paste. What size aperture should we be using? Any suggestions?

Minimum Tg for LeadFree board.

Electronics Forum | Fri Aug 21 04:43:14 EDT 2009 | ghepo

Hello, I suggest you visit the website http://www.analysispcb.com, where I found these information : PARAMETERS FOR DOUBLE “V” SCORING LEAD FREE LAMINATES Typ WEB Thickness, 1.6mm : 0.38mm (+.15/-0) "...Tg is not a good indicator of a materials’

Solder Ball Attach (BGA)

Electronics Forum | Mon Sep 24 12:58:31 EDT 2018 | vincentl

We are attaching 0.50mm diameter SAC 305 solder balls onto 0.38 diameter Au plated pins placed at a 0.80mm pitch (pins are pressed into a plastic insulator). A tacky flux is then stenciled onto the pins using a stencil with.a 0.38mm diameter aperture

0402 stencil design

Electronics Forum | Tue Feb 04 22:28:16 EST 2003 | davef

You could reduce the paste by about 70%. Solder balling and tombstoning will be the issues to fight. The drivers to these don't change with the component size. Use the fine SMTnet Archives for background. Aperture Size and Thickness of Solder Pas

Sm t t t t t t t net
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