The DV-7000 Heli-Flow® pump is a third-generation encoded auger pump. The pump has a floating head for use with footed needles to make fast, repeatable dots of solder paste and silver epoxy. The dispense gap is mechanically controlled by the needle,
Don't Sacrifice PCBs for Profiling Double Sided Thermally Conductive Tape Used for Attaching Thermocouples to PCBS. Non-destructive TC attachment Reliable TC readings No waiting for curing or soldering Fast, easy setup Sold in 1
Electronics Forum | Thu Aug 24 08:46:15 EDT 2006 | Chunks
I too had to reduce by 50% because of floating (0.006"). But, most recommendations are for pads with via perforations. So if you are mounting to a flat pad, reduce even more.
Electronics Forum | Tue May 24 19:35:36 EDT 2005 | davef
Certainly, most often, the focus of pot analysis is directed at controlling impurities. Maintaining proper level of tin is important, also. When the portion of tin decreases: * Liquidous temperature increases. * Ability to wet decreases. * Solder c
Used SMT Equipment | Pick and Place/Feeders
Board size L50xW50mm – L460 xW410mm Board thickness 0.5mm-2.0mm Flow direction Left to right Conveyor speed Max. 420mm/sec, speed variable, soft stop fuction Placement speed A (NB1) 0.13 sec/CHIP, 0.38 sec/TSOP32 Placement speed B
Used SMT Equipment | In-Circuit Testers
The Agilent E8362B is a member of Agilent s PNA Series network analyzer platform and provides the combination of speed and precision for the demanding needs of today's high frequency high-performance component test requirements. The PNA Series meets
Industry News | 2019-11-05 22:20:35.0
8 Layer PCB Stack-up Guidelines How to improve EMC performance on 8 layer PCB design? The following text is reproduced, with permission, from Part 4 of a 6-Part article on PCB Stackup by Henry W. Ott. The original article is available at http://www.hottconsultants.com/tips.html
Industry News | 2008-06-06 23:18:15.0
COLORADO SPRINGS, CO � June 5, 2008 � FINE LINE STENCIL, a division of FCT Assembly and a leading manufacturer of stencil products, introduces its newest Slic� laser cut stencil.
Technical Library | 2020-07-15 18:29:34.0
In the early 2000s the first fine-pitch ball grid array devices became popular with designers looking to pack as much horsepower into as small a space as possible. "Smaller is better" became the rule and with that the mechanical drilling world became severely impacted by available drill bit sizes, aspect ratios, and plating methodologies. First of all, the diameter of the drill needed to be in the 0.006" or smaller range due to the reduction of pad size and spacing pitch. Secondly, the aspect ratio (depth to diameter) became limited by drill flute length, positional accuracy, rigidity of the tools (to prevent breakage), and the throwing power of acid copper plating systems. And lastly, the plating needed to close up the hole as much as possible, which led to problems with voiding, incomplete fill, and gas/solution entrapment.
Universal GSM1 with FlexJet customer acceptance.
