Industry Directory | Consultant / Service Provider / Equipment Dealer / Broker / Auctions / Manufacturer's Representative / Training Provider
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Industry Directory | Manufacturer
China PCB manufacturer.Rigid,aluminium,FPC.1-12 layers,Min.line/space:0.1mm min.hole:0.1mm,burried and blind hole
Semi-Automatic SMT Stencil Printers - P300, P350, P400. Using precision guide rail and the import motor to drive the blade seat conversion, printing, and high accuracy. Printing scraper can rotate 45 degrees fixed up, easy printing stencil a
SMT Stencil Printer/ PCB Printers/ Solder Paste Stencil Printer Semi-Auto Main product: Stencil Printer, Semi-Automatic Printing, PCB Printer, screen printing, SMT Stencil Printer, SMT screen printer, SMT printer, Solder Paste Printer, SMT solder p
Electronics Forum | Thu Nov 20 12:10:20 EST 2003 | frank
Well, let me take a shot... +/-100um = 0.1mm 5 sigma = is the number of acceptable defects (or placements outside of that accuracy (or tolerance). I believe 5 sigma is 233 defects out of 1 million, but I could be wrong on that. So basically all pl
Electronics Forum | Tue Aug 20 21:39:29 EDT 2019 | sssamw
6 mil (0.15mm) for the 1.13mm pitch BGA, and 4 mil (0.1mm) for the smal QFN with 0.4mm pitch.
Used SMT Equipment | Chipshooters / Chip Mounters
FUJI, Chip Shooter, type CP643E, s.n. 2066, Left to right, cap. 40.000 CPH, Device input 140-8mm, with 20 heades, 6 nozels each, 2 tables 70 feeders each, PCB dimensions Max: 457mm x 356mm Min: 80mm x 60mm,Board Thickness: 0.3 to 4.0 mm, Component ca
Used SMT Equipment | Chipshooters / Chip Mounters
FUJI, Chip Shooter, type CP643E, s.n. 1278, Left to right, cap. 40.000 CPH, Device input 140-8mm, with 20 heades, 6 nozels each, 2 tables 70 feeders each, PCB dimensions Max: 457mm x 356mm Min: 80mm x 60mm,Board Thickness: 0.3 to 4.0 mm, Component ca
Industry News | 2017-10-17 19:32:15.0
MIRTEC, “The Global Leader in Inspection Technology,” is pleased to announce plans to exhibit its award-winning MV-6 OMNI 3D AOI System in Hall A2, Booth 329 at productronica 2017, scheduled to take place Nov. 14 – 17, 2017 at the Messe München in Germany. Additionally, the company will show the MS-11e 3D SPI, MV-3 OMNI Desktop 3D AOI and INTELLISYS® software.
Industry News | 2023-03-22 09:50:04.0
Precision PCB Services, Inc. will Demo the Zhuomao ZM-R7220A BGA Rework Station at SMTA Expo, Dallas on March 28th.
Parts & Supplies | Assembly Accessories
Product name: YV100X YAMAHA multi-functional chip mounter Product number: YV100X Products in detail YAMAHA multi-function placement machineYAMAHA YV100X substrate size: ATS20 (end to put) W -AT assembly: L460 * W250 (Max)/L50 * W50 (Min)sub
Technical Library | 2023-12-18 11:33:57.0
Elevate your electronic manufacturing game with the I.C.T-D600 SMT Dispensing Machine! Precision, safety, and efficiency in one powerful solution. In the dynamic realm of electronic manufacturing, precision and efficiency are not just preferences but essential requirements. Introducing the I.C.T-D600, an automatic glue dispenser machine engineered to enhance production processes across various applications. From chip encapsulation to PCB assembly, SMT red-glue dispensing, LED lens production, and medical device creation, SMT dispensing machine is a versatile solution tailored to meet the demands of the industry. Essential Attributes Of The I.C.T-D600 Automatic Glue Dispenser Machine 1. Compliance with European Safety Standards: The I.C.T-D600 SMT dispensing machine prioritizes not only efficiency but also safety, boasting compliance with European safety standards and holding a CE certificate. This ensures a secure and reliable manufacturing environment, aligning with global quality benchmarks. 2. International Component Quality: Internationally renowned components form the core of the D600 SMT dispensing machine. From Panasonic servomotors to MINTRON CCD, each element is carefully selected, guaranteeing high performance and durability. This commitment to quality components results in a machine that operates seamlessly, reducing downtime and maintenance costs. 3. Impressive Performance Metrics: The SMT dispensing machinedoesn't just meet expectations; it surpasses them with exceptional performance metrics: Maximum Guide Rail Speed: 400mm/s Fastest Injection Valve Speed: 20 spots/sec Dispensing Accuracy: ±0.02mm Repeated Accuracy: ±0.01mm Machine Characteristics: Core Part – Jet Valve The non-contact jet dispensing method ensures high-speed operation (max jet speed: 20 spots/second), high accuracy with a minimum dispensing volume of 5nl, and flexibility with extremely small dispensing volumes. The thermostatic system for the flow channel and sprayer ensures uniform glue temperature, resulting in low maintenance costs and an extended service life. Enhanced Capacity: Non-contact jet dispensing eliminates the need for Z-axis motion. Integrated temperature control technology reduces manual intervention. Automatic glue compensation minimizes artificial regulation time. Dual-track design reduces waiting time. Automatic visual location identification and compensation. Non-contact height detection with laser reduces height detection time. Flexibility: Capable of handling substrates or backings of various sizes. Optional heating module. Independent control of dual tracks with user-friendly software. Fast switching between different product lines. Universal platform suitable for various processes with different glues
Technical Library | 2008-04-08 17:42:27.0
Concern about the failure of lead-free BGA packages when portable devices such as cell phones are accidentally dropped and a general concern about the resistance of these packages under shock loading has prompted an interest in the impact strength of the soldered BGA connection. This paper reports the results of the measurement of the impact strength of lead-free 0.5±0.01mm diameter BGA spheres on 0.42mm solder mask defined pads on copper/OSP and ENIG substrates using recently developed equipment that can load individual BGA spheres at high strain rates in shear and tension.
Sharemate Smart Router PCB Depanelizer Model: EM-5700N Serial: CUT-041018-01 - Two independently controlled beds with working area of 14x12" each. - Max cutting speed: 60 mm/sec - Max spindle speed: 40,000 rpm - XYZ steps: 0.01 mm - Power
Right Transportation Speed 1500mm/s Feeding Mode Section type transportation guide rail Rail Width Adjustment Automatic Communication Signal SMEMA PCB Positioning Upper and lower guide rail
Career Center | Shen Zhen, China | Management,Sales/Marketing
Working in GLORYPCB for 10 years.knowing electronic supply chain very well. especially for PCB PCBA assembly and other Electronic Manufacturing Service.Glorypcb is a professional electronic manufacturer located in Shenzhen with three facilities.offe
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/collections/bga-rework-stations/products/wds-900-nitrogen-capable-smd-bga-rework-station
:±0.01mm Fits Boards up to 26" Wide Places components from 1mm to 60mm Mount Accuracy ±0.01mm 5 Thermocouple Inputs 1200 watt Component heater (Top Side
| http://www.szhonreal.com/productview.asp?id=42
*80mm Working table adjustment ± 10mm Forward/backward, ± 10mm left/right PCB locating way Jig Placement precision ± 0.01mm Min.pitch of BGA ball 0.15mm Bottom IR preheat 3600W Top heater 1200W Bottom heater 800W Max BGA weight 80g Power supply Single phase 220V,50/60Hz, Machine dimension L750
