Electronics Forum | Tue Feb 04 22:28:16 EST 2003 | davef
You could reduce the paste by about 70%. Solder balling and tombstoning will be the issues to fight. The drivers to these don't change with the component size. Use the fine SMTnet Archives for background. Aperture Size and Thickness of Solder Pas
Electronics Forum | Wed Aug 07 17:20:17 EDT 2019 | orbitcoms
The aperture over the pads is set to 95% coverage of the pad. The stencil is 0.12 mm thick.
Electronics Forum | Tue Oct 31 20:42:56 EST 2000 | speedy-tech
Now we are face with tombstoning for component '0402',we have tried many ways,it seems no change,Below is our experient: 1,The thickness of stencil is 0.12mm,and the aperture is circle.the diameter is 0.55mm.The pads size is 0.5*0.6. 2 Ch
Electronics Forum | Sun Jun 07 19:16:54 EDT 2015 | linux
Hello everyone, I'm looking for help with placement issue on our cp6 Fuji. On occasion we have to adjust co ordinates on the x and y axis usually about 0.12mm. Ball screw was replaced did not fix issue. Anything else we could try. Thanks everyone
Electronics Forum | Thu Sep 07 07:36:57 EDT 2017 | tsvetan
we use 0.12 mm stencil with 0.3 mm apretures for 0.5mm step FBGA153 memory without problems the solder paste is SAC305 Class4 http://www.olimex.com/Products/Components/Soldering/SOLDER-PASTE-SAC305-CLASS4/
Electronics Forum | Wed Aug 07 01:41:27 EDT 2019 | orbitcoms
Hi I am having trouble getting solder bridges on TQFP-100 (0.5mm pitch) components. The boards are pasted on semi-auto printer using laser-cut 0.12mm stencil and SN63 NC257-2 T4 paste. The components are placed using Samsung CP40LV and tghen reflow
Electronics Forum | Wed Apr 29 17:51:44 EDT 2009 | smt_guy
One more thing: I have a Panelized PCB with 8 boards on the X directions. As I move to the next PCB towards the right my misalignment moves to the right by 0.02mm. By the time I reach the 8th PCB I'm Off by between 0.12mm to 0.14mm. My fine pitch
Electronics Forum | Fri Sep 08 01:08:10 EDT 2017 | tsvetan
The material is 0.12mm stainless steel, electropolished it's thick for fine pitch but we have lot of other big components on the board which do not solder good if we use 0.1mm thickness stencil. The 0.3 mm apretures are big enough and have good rele
Electronics Forum | Wed May 22 12:00:13 EDT 2019 | gregoireg
Thanks. It starts to make sense. There is a formula at the bottom of this page: http://www.circuitinsight.com/programs/50456.html It says: Stencil Thickness = 2.64mil + 0.0831 * pitch of component in mil. for 1.13mm, that gives exactly 0.16mm. So,
Electronics Forum | Thu Jun 20 23:28:15 EDT 2019 | SMTA-David
How can I upload image to this forum? I can show you the pad layout. I am thinking maybe too much solder. I used 0.16mm thick stencil but notice many us 0.12mm thickness. Also, cream layer is 100% of pad surface, I know for fine pitch parts it is r
