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PCB prototype assembly for advisement player

PCB prototype assembly for advisement player

New Equipment | Assembly Services

One-stop PCB and Assembly Manufacturers Specialized in one-stop PCB and Assembly manufacturing, Heros Electronics is committed to providing quick-turn high quality custom PCB and smt assembly to our customers all over the world with affordable pri

Heros Electronics (Shenzhen) Co., Ltd.

Consumer Electronics PCB Assembly for VR (Virtual Reality)

Consumer Electronics PCB Assembly for VR (Virtual Reality)

New Equipment | Assembly Services

One-stop PCB and Assembly Manufacturers Specialized in one-stop PCB and Assembly manufacturing, Heros Electronics is committed to providing quick-turn high quality custom PCB and smt assembly to our customers all over the world with affordable pri

Heros Electronics (Shenzhen) Co., Ltd.

DEK Galaxy - Screen Printer

DEK Galaxy - Screen Printer

New Equipment | Printing

Advanced semiconductor packaging and high precision SMT assembly convergence. Galaxy unites advanced semiconductor packaging and high precision next-generation SMT assembly on the same platform. This level of convergence delivers the advanced techno

ASM Assembly Systems (DEK)

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch

Electronics Forum | Thu Nov 14 10:52:56 EST 2019 | jandon

Maybe something like this could work?

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch

Electronics Forum | Tue Nov 12 00:49:37 EST 2019 | myke03o

I am optimizing a stencil opening for BGA with 0.4mm pitch and pad diameter of 0.2mm. Can anyone advice of stencil thickness and stencil opening I can use in order to have a good paste release. Thanks for all your answers.

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch

Electronics Forum | Thu Nov 14 18:25:07 EST 2019 | myke03o

Hi Jandon, Thanks, I will try it on my DOE.

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch

Electronics Forum | Thu Nov 14 21:47:41 EST 2019 | sssamw

Yes, 0.25x0.25 square could work @0.1 thickness, use nano-coating or electroform stencil for better solder paste release.

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch

Electronics Forum | Thu Nov 14 22:24:43 EST 2019 | dman97

Use a type 5 solder for maximum paste release.

SOLDER BALLS

Electronics Forum | Tue Apr 28 21:48:50 EDT 2009 | davef

Confirm the source of the issue. Run a coalescence test on both lots of paste. A simple coalescence test can quickly determine the condition of solder paste after prolonged use. Simply print a small disk [around 4-5mm diameter and 0.2mm thick - a bu

Re: Solder Paste Dispense problems

Electronics Forum | Thu Nov 30 21:13:55 EST 2000 | Dave F

Can't find "WS601" on the Alpha site. What is that stuff? So, with nothing to go on, I'll just guess ... Yer probably cold welding the solder particles together. The nozzle size (inside diameter) determines the dot size. * With glue, small dot si


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