Technical Library | 2007-01-03 16:36:58.0
Solder paste dispensing is not a new process. However, today's microelectronics present a daunting array of technical challenges to meet deposit size requirements. The need for better paste formulations, more precise equipment, and more tightly controlled processes is driving paste suppliers and equipment suppliers to develop new methods and materials. The most challenging solder paste deposits are those smaller than 0.25mm in diameter and today’s electronics demand such deposits. This paper addresses the process requirements for solder paste micro-deposits in terms of material, equipment and process variable control required for success in producing 0.25mm and smaller deposits.
1) Teflon PCB,Doulbe sided, 1.6mm thickness 2) Min. track width: 0.2mm 3) Min. track space: 0.2mm 4) Min. hole diameter: 0.3mm 5) Finish: Copper finish.
Product name: Halogen Free Lead Free Solder Wire Product code: E9650-HF961 Alloy composition: Sn/Ag3.0/Cu0.5 Diameter: 0.2mm, 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm Packing: 500g/reel, 1kg/reel (10kg/box) Price: Contact us for best price Features:
New Equipment | Assembly Services
Factory supply cable utp cat5e and cat6 lan cable 305m (Rhonda(at)z-crown.com cable utp cat5e: 1.Conductor:24AWG,bare copper 0.51 +/-0.01 mm, 2.Insulation: High density polyethylene, minimum thickness of 0.19 mm 3.Conductor diameter 0.92 +/- 0
New Equipment | Assembly Services
Factory supply cable utp cat5e and cat6 lan cable 305m (Rhonda(at)z-crown.com cable utp cat5e: 1.Conductor:24AWG,bare copper 0.51 +/-0.01 mm, 2.Insulation: High density polyethylene, minimum thickness of 0.19 mm 3.Conductor diameter 0.92 +/- 0
Industry News | 2013-10-08 14:47:36.0
The Balver Zinn Group announces that it will exhibit in Hall A4, Stand 451 at the 20th international Productronica Trade Fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.
Used SMT Equipment | Pick and Place/Feeders
ASM Assembly Systems SIPLACE X4i S Placement Machine (2015) Brand: ASM Model: SIPLACE X4i S Machine Type: Placement machine Year: 2015 Serial #: G785-12041706 Machine Specifications: Configured with 4 x Siplace SpeedStar CP20P heads (37,500
Advanced semiconductor packaging and high precision SMT assembly convergence. Galaxy unites advanced semiconductor packaging and high precision next-generation SMT assembly on the same platform. This level of convergence delivers the advanced techno
Industry News | 2018-10-18 11:19:07.0
How To Design Cost-Effective PCBs
Electronics Forum | Thu Nov 14 10:52:56 EST 2019 | jandon
Maybe something like this could work?
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